JPS59130447A - 電子部品のパツケ−ジ方法 - Google Patents

電子部品のパツケ−ジ方法

Info

Publication number
JPS59130447A
JPS59130447A JP58005465A JP546583A JPS59130447A JP S59130447 A JPS59130447 A JP S59130447A JP 58005465 A JP58005465 A JP 58005465A JP 546583 A JP546583 A JP 546583A JP S59130447 A JPS59130447 A JP S59130447A
Authority
JP
Japan
Prior art keywords
wiring board
welding base
outer diameter
diameter dimension
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58005465A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355866B2 (cs
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58005465A priority Critical patent/JPS59130447A/ja
Publication of JPS59130447A publication Critical patent/JPS59130447A/ja
Publication of JPS6355866B2 publication Critical patent/JPS6355866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP58005465A 1983-01-17 1983-01-17 電子部品のパツケ−ジ方法 Granted JPS59130447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58005465A JPS59130447A (ja) 1983-01-17 1983-01-17 電子部品のパツケ−ジ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58005465A JPS59130447A (ja) 1983-01-17 1983-01-17 電子部品のパツケ−ジ方法

Publications (2)

Publication Number Publication Date
JPS59130447A true JPS59130447A (ja) 1984-07-27
JPS6355866B2 JPS6355866B2 (cs) 1988-11-04

Family

ID=11611981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58005465A Granted JPS59130447A (ja) 1983-01-17 1983-01-17 電子部品のパツケ−ジ方法

Country Status (1)

Country Link
JP (1) JPS59130447A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435938A (en) * 1987-07-30 1989-02-07 Toshiba Corp Method of hermetically sealing image sensing element module
US8335050B2 (en) 2007-04-03 2012-12-18 Hitachi Global Storage Technologies, Netherlands B.V. Disk drive with a solder preform hermetic seal

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537057U (ja) * 1991-10-22 1993-05-21 フラツト合成株式会社 さけます孵化槽用下網

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435938A (en) * 1987-07-30 1989-02-07 Toshiba Corp Method of hermetically sealing image sensing element module
US8335050B2 (en) 2007-04-03 2012-12-18 Hitachi Global Storage Technologies, Netherlands B.V. Disk drive with a solder preform hermetic seal
US9412420B2 (en) 2007-04-03 2016-08-09 HGST Netherlands B.V. Hermetically sealing a disk drive assembly

Also Published As

Publication number Publication date
JPS6355866B2 (cs) 1988-11-04

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