JPS6435938A - Method of hermetically sealing image sensing element module - Google Patents

Method of hermetically sealing image sensing element module

Info

Publication number
JPS6435938A
JPS6435938A JP62190796A JP19079687A JPS6435938A JP S6435938 A JPS6435938 A JP S6435938A JP 62190796 A JP62190796 A JP 62190796A JP 19079687 A JP19079687 A JP 19079687A JP S6435938 A JPS6435938 A JP S6435938A
Authority
JP
Japan
Prior art keywords
rings
light
transmitting window
welding
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62190796A
Other languages
Japanese (ja)
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62190796A priority Critical patent/JPS6435938A/en
Publication of JPS6435938A publication Critical patent/JPS6435938A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To prevent a thermal stress from generating in a light-transmitting window by the heat a the time of welding and to prevent the generation of a crack by a method wherein welded rings are provided and a laser beam is irradiated on the peripheral parts of a metal cap while the window is directly cooled to perform the welding. CONSTITUTION:Metallic welded rings 5 are provided on the outer peripheral part of the surface of a chip carrier 1 mounted with a solidstate image sensing element 3. In case the element is airtightly sealed with a metal cap 8 with a light-transmitting window, this cap 8 is first placed on the rings 5 and thereafter, a waterdrop is dripped on a transparent glass 7. Moreover, a laser beam 10 is irradiated on the peripheral parts of a metallic frame body 6 to come into contact to the rings 5 in a state that the light-transmitting window is covered with the waterdrop 9 to weld the frame body 6 on the rings 5. Thereby, a crack is never generated in the light-transmitting window by the heat at the time of welding of the cap 8 and the yield of products is improved significantly.
JP62190796A 1987-07-30 1987-07-30 Method of hermetically sealing image sensing element module Pending JPS6435938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62190796A JPS6435938A (en) 1987-07-30 1987-07-30 Method of hermetically sealing image sensing element module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62190796A JPS6435938A (en) 1987-07-30 1987-07-30 Method of hermetically sealing image sensing element module

Publications (1)

Publication Number Publication Date
JPS6435938A true JPS6435938A (en) 1989-02-07

Family

ID=16263885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62190796A Pending JPS6435938A (en) 1987-07-30 1987-07-30 Method of hermetically sealing image sensing element module

Country Status (1)

Country Link
JP (1) JPS6435938A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130447A (en) * 1983-01-17 1984-07-27 Toshiba Corp Method for packaging electronic component
JPS6095965A (en) * 1983-10-31 1985-05-29 Toshiba Corp Manufacture of solid-state image pickup device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130447A (en) * 1983-01-17 1984-07-27 Toshiba Corp Method for packaging electronic component
JPS6095965A (en) * 1983-10-31 1985-05-29 Toshiba Corp Manufacture of solid-state image pickup device

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