JPS6095965A - Manufacture of solid-state image pickup device - Google Patents

Manufacture of solid-state image pickup device

Info

Publication number
JPS6095965A
JPS6095965A JP58204313A JP20431383A JPS6095965A JP S6095965 A JPS6095965 A JP S6095965A JP 58204313 A JP58204313 A JP 58204313A JP 20431383 A JP20431383 A JP 20431383A JP S6095965 A JPS6095965 A JP S6095965A
Authority
JP
Japan
Prior art keywords
solid
package
state image
image pickup
optical window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58204313A
Other languages
Japanese (ja)
Inventor
Shigeru Sato
滋 佐藤
Akihiko Furukawa
古川　章彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58204313A priority Critical patent/JPS6095965A/en
Publication of JPS6095965A publication Critical patent/JPS6095965A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To obtain a solid-state image pickup device, yield thereof is not lowered and characteristics thereof are not deteriorated, by welding an optical window to the fringe of a package while cooling the welding section when a solid-state image pickup element converting an optical signal into an electric signal is received in a recessed section formed to the surface of the package and the optical window is welded to the fringe of the package while covering the solid-state image pickup element. CONSTITUTION:A solid-state image pickup element, the surface thereof has a color filter 6, is fixed into a recessed section formed at the central section of the surface of a package 1 and bonding wires 3 are wired in a predetermined manner. A metallic layer 5 is applied on the circumferential wall surface of the package 1, and an optical window 4 opposite to the element 2 is fitted through the metallic layer 5. That is, supporters supporting the optical window 4 are positioned on the metallic layer 5 and electric welding rods 10 are pushed against the supporters and the optical window is welded, but the package 1 is placed on a stage 11 with a hole 12 running parallel with the bottom of the package and the window is welded while passing cooling water through the hole 12 at that time. Accordingly, cracks, etc. are not generated in the window 4, and the color of the color filter 6 is not also changed.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は固体撮像装置の製造方法に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a method for manufacturing a solid-state imaging device.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

００　Ｄ　（（！ｈａｎｇｅ　０ｕｐｌｅｄ　Ｄｅｖｉ
ｃｅ　）やＢＢＤ（Ｂａｃｋｅｔ　Ｂｒｉｇｅｄｅ　Ｄ
ｅｖｉｃｅ）等の電荷転送素子を用いた固体撮像装置は
従来よりょ〈知らｎてｂ固体撮像装置の一例を第１図に
示す。例えばセラミックから成る外囲器１には凹部が形
成されており、その凹部に固体撮像素子２が固着さ詐て
いる。固体撮像素子２のポンディングパッド部（図示せ
ず）はボンディングワイヤ３にて外囲器１のボスト部（
図示せず）と電気的に接続されて層る。00 D ((!hange 0upled Devi
ce ) and BBD (Backet Brigede D
An example of a solid-state imaging device using a charge transfer element such as a conventional solid-state imaging device is shown in FIG. For example, an envelope 1 made of ceramic has a recess formed therein, and a solid-state image sensor 2 is fixed to the recess. A bonding pad portion (not shown) of the solid-state image sensor 2 is connected to a boss portion (not shown) of the envelope 1 using a bonding wire 3.
(not shown).

この固体撮像素子２への光信号を透過するために外囲器
１上部には光学窓４が金属層５を介して設けられており
、固体撮像素子２を気密に封止して因る。一方近年、固
体撮ｆ象装置のカラー化が進んでいる。そしてカラー固
体撮像装置においては固体撮像素子２上に直接色フィル
タ６を形成することが多い。In order to transmit the optical signal to the solid-state image sensor 2, an optical window 4 is provided in the upper part of the envelope 1 via a metal layer 5, and the solid-state image sensor 2 is hermetically sealed. On the other hand, in recent years, the use of color solid-state imaging devices has progressed. In color solid-state imaging devices, the color filter 6 is often formed directly on the solid-state imaging element 2.

外囲器１と光学窓４との固着方法としては、操作が容易
であること、信頼性が優ｎてｈることから一般に電気溶
接法が採用されてｂる。ところが電気溶接で光学窓４を
封止する場合、十分な封止能力を達成するように電気溶
接すると、固体撮像装置全体が高温になり、光学窓４の
ガラス板に歪を生じてクラックが入ることがあり、歩留
りが低かった。またカラー固体撮像装置においては固体
撮像素子２上の色フィルタ６が変色して特性が劣化した
りする問題があった。As a method of fixing the envelope 1 and the optical window 4, electric welding is generally adopted because it is easy to operate and has excellent reliability. However, when sealing the optical window 4 by electric welding, if the electric welding is performed to achieve sufficient sealing ability, the entire solid-state imaging device will become hot, causing distortion and cracks in the glass plate of the optical window 4. As a result, the yield was low. Further, in the color solid-state imaging device, there is a problem in that the color filter 6 on the solid-state imaging device 2 changes color and its characteristics deteriorate.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情全考慮してなさｎたもので、歩留りの
低下や特性劣化を招くことのない固体撮像装置の製造方
法を提供することを目的とする。The present invention has been made in consideration of all the above circumstances, and an object of the present invention is to provide a method for manufacturing a solid-state imaging device that does not cause a decrease in yield or deterioration of characteristics.

〔発明の概要〕[Summary of the invention]

この目的を達成するために本発明による饗遣方法は、外
囲器に電気溶接にて光学窓を封止する際に溶接部を冷却
することを％徴とする。In order to achieve this object, the serving method according to the present invention includes cooling the welded portion when sealing the optical window to the envelope by electric welding.

〔発明の実施例〕[Embodiments of the invention]

以下本発明を図示の実施例に基づｂて説明する。 The present invention will be explained below based on the illustrated embodiments.

第１図に示したものと同じ構成の固体撮像装置を製造す
る場合につｂて説明する。第２図に示すように外囲器１
に形成さｎた凹部に色フィルタ６つきの固体撮像素子２
が固着されている。固体撮像素子２のポンディングパッ
ド部（図示せず）はボンディングワイヤ８にて外囲器１
のポスト部（図示せず）と電気的に接続されている。こ
の固体撮像素子２への光信号を透過する光学窓４が電気
溶接軸１０により金属層５を介して外囲器１に封止さｎ
る。このとき外囲器１が塔載されているステージ１１内
部処設けられた穴１２に冷却水を流してステージ１１を
介して固体撮像装置全冷却する。A case of manufacturing a solid-state imaging device having the same configuration as that shown in FIG. 1 will be described. As shown in Figure 2, the envelope 1
A solid-state image sensor 2 with a color filter 6 in a recess formed in the
is fixed. A bonding pad portion (not shown) of the solid-state image sensor 2 is connected to the envelope 1 with a bonding wire 8.
The post section (not shown) is electrically connected to the post section (not shown). An optical window 4 that transmits optical signals to the solid-state image sensor 2 is sealed to the envelope 1 via a metal layer 5 by an electric welding shaft 10.
Ru. At this time, cooling water is allowed to flow through holes 12 provided inside the stage 11 on which the envelope 1 is mounted, thereby completely cooling the solid-state imaging device through the stage 11.

固体撮像装置を冷却する方法としては他に例えば第８図
に示すように、電気溶接軸１０で溶接するときに、この
溶接部に冷風管１３により冷風を吹きつけて冷却しても
よい。Another method for cooling the solid-state imaging device is, for example, as shown in FIG. 8, when welding is performed using an electric welding shaft 10, cooling may be performed by blowing cold air onto the welded portion through a cold air pipe 13.

このように固体撮像装置を冷却することにより、電気溶
接による封止時における温度上昇を防止し、光学窓４の
クラックや色フィルタ６の変色を防止することができる
。By cooling the solid-state imaging device in this manner, it is possible to prevent a temperature rise during sealing by electric welding, and to prevent cracks in the optical window 4 and discoloration of the color filter 6.

〔発明の効果〕〔Effect of the invention〕

以上の通り本発明によ扛ば封止時における光学窓のクラ
ック等が防止でき歩留りを向上させることができる。ま
た色フィルタの変色が防止でき光学特性のよめ固体撮像
ｉ置が製造できる。As described above, according to the present invention, cracks in the optical window during sealing can be prevented and the yield can be improved. Furthermore, discoloration of the color filters can be prevented and optical characteristics can be improved, so that solid-state imaging devices can be manufactured.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は固体撮は装置の断面図、第２図は本発明の一実
施例による固体撮像装置の製造方法の説明図、第８図は
本発明の他の実施例による固体描像装置の製造方法の説
明図である。 １・・・外囲器、２・・・固体撮像素子、３・・・ボン
ティングワイヤ、４・・・光学窓、５・・・金属層、６
・・・色フィルタ、１０・・・電気溶接軸、１１・・・
ステージ、１３・・・冷風管。 出願人代理人　猪　股　清 第１図 ムFIG. 1 is a cross-sectional view of a solid-state imaging device, FIG. 2 is an explanatory diagram of a method for manufacturing a solid-state imaging device according to an embodiment of the present invention, and FIG. 8 is a manufacturing method of a solid-state imaging device according to another embodiment of the present invention. It is an explanatory diagram of a method. DESCRIPTION OF SYMBOLS 1... Envelope, 2... Solid-state image sensor, 3... Bonding wire, 4... Optical window, 5... Metal layer, 6
...Color filter, 10...Electric welding shaft, 11...
Stage 13...cold air pipe. Applicant's agent Kiyoshi Inomata Figure 1

Claims (1)

【特許請求の範囲】[Claims] 光信号全電気信号に変換す今固体撮像素子と、この固体
撮像素子が固着される外囲器と、この外囲器に溶接され
前記固体撮像素子を気密封止する光学窓とを備えた固体
撮像装置の製造方法にお込て、前記外囲器と光学窓との
溶接部全冷却しつつ溶接を行うことを％徴とする固体撮
ｆ象装置の製造方法。A solid-state image pickup device that converts an optical signal into an electrical signal, an envelope to which the solid-state image pickup device is fixed, and an optical window that is welded to the envelope and hermetically seals the solid-state image pickup device. A method for manufacturing a solid-state imaging device, the method comprising: performing welding while completely cooling the welded portion between the envelope and the optical window.
JP58204313A 1983-10-31 1983-10-31 Manufacture of solid-state image pickup device Pending JPS6095965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58204313A JPS6095965A (en) 1983-10-31 1983-10-31 Manufacture of solid-state image pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58204313A JPS6095965A (en) 1983-10-31 1983-10-31 Manufacture of solid-state image pickup device

Publications (1)

Publication Number Publication Date
JPS6095965A true JPS6095965A (en) 1985-05-29

Family

ID=16488412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58204313A Pending JPS6095965A (en) 1983-10-31 1983-10-31 Manufacture of solid-state image pickup device

Country Status (1)

Country Link
JP (1) JPS6095965A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435938A (en) * 1987-07-30 1989-02-07 Toshiba Corp Method of hermetically sealing image sensing element module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435938A (en) * 1987-07-30 1989-02-07 Toshiba Corp Method of hermetically sealing image sensing element module

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