JPS60150667A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPS60150667A JPS60150667A JP59006862A JP686284A JPS60150667A JP S60150667 A JPS60150667 A JP S60150667A JP 59006862 A JP59006862 A JP 59006862A JP 686284 A JP686284 A JP 686284A JP S60150667 A JPS60150667 A JP S60150667A
- Authority
- JP
- Japan
- Prior art keywords
- optical window
- window plate
- solid
- state image
- envelope body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は固体撮像装置の改良に関し、特に外囲器本体と
光学窓板との間に介在される金属製中継部を改良した固
体撮像装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a solid-state imaging device, and more particularly to a solid-state imaging device in which a metal relay portion interposed between an envelope body and an optical window plate is improved. .
周知の如く、半導体装置としてＣＣＤ （ｇｈａｒｇｓ
Ｃｏｕｐｌｅｄ Ｄ＠ｖｉｃａ ）、ＢＢＤ （Ｂｕｃ
ｋｅｔ ＢｒｉｇａｄｅＤｅｖｉｃｅ ）等の電荷素子
を用いた固体撮像装置がが知られている。こうした固体
撮像装置は、一般に半導体基板上に絶縁膜を介して複数
の電極を配列した構造となっている。そして、半導体基
板の内部にポテンシャル井戸を作り、このポテンシャル
井戸に光電効果によって発生させた電荷を蓄積し、その
電荷を所定の規則にしたがって電圧を印加することによ
り半導体基板表面もしくはその近傍に沿って一方向に転
送して出力端子から信号として読出す機能を有している
。As is well known, CCD (ghargs) is a semiconductor device.
Coupled D@vica), BBD (Buc
Solid-state imaging devices using charge elements, such as Brigade Device (Brigade Device), are known. Such solid-state imaging devices generally have a structure in which a plurality of electrodes are arranged on a semiconductor substrate with an insulating film interposed therebetween. Then, a potential well is created inside the semiconductor substrate, charges generated by the photoelectric effect are accumulated in this potential well, and the charges are applied along the surface of the semiconductor substrate or its vicinity by applying a voltage according to a predetermined rule. It has a function of transferring data in one direction and reading it out as a signal from the output terminal.
従来、固体撮像装置としては第１図に示すものが知られ
ている。図中の１は、階段状の凹部２を有する例えばセ
ラミック製の外囲器本体である。この外囲器本体１の凹
部２の底面上には光入射により電気信号な出力する例え
ばＣＯＤイメージセンサのチップ３が導電性接着剤層４
により貼着して載置されている。このチップ３表面の電
極（図示せず）と凹部２の階段面上のパ、ド部（図示せ
ず）とは、複数のＭ、金等のポンディングワイヤ５・・
・により接続されている。2. Description of the Related Art Conventionally, the solid-state imaging device shown in FIG. 1 is known. Reference numeral 1 in the figure indicates an envelope body made of ceramic, for example, and having a step-like recess 2 . On the bottom surface of the recess 2 of the envelope body 1, a conductive adhesive layer 4 is placed, for example, a chip 3 of a COD image sensor that outputs an electrical signal upon incident light.
It is attached and placed by. The electrodes (not shown) on the surface of the chip 3 and the pads (not shown) on the stepped surface of the recess 2 are connected to a plurality of M, gold, etc. bonding wires 5.
・Connected by.
前記外囲器本体１０２つの対向する側壁には複数のリー
ド（図示せず）が設けられ、該リードは前記パッド部と
夫々接続している。更に、外囲器本体１の開口端には、
前記チップ３を気密に封止するための枠状のメタル層６
が設けられている。このメタル層６上には、メタルフレ
ーム７、セラミックＲ８を夫々介して光学窓板９が例え
ば電気溶接法を用いて前記チップ３を封止するように設
けられている。A plurality of leads (not shown) are provided on the two opposing side walls of the envelope body 102, and the leads are respectively connected to the pad portions. Furthermore, at the open end of the envelope body 1,
a frame-shaped metal layer 6 for hermetically sealing the chip 3;
is provided. An optical window plate 9 is provided on the metal layer 6 via a metal frame 7 and a ceramic R8, respectively, so as to seal the chip 3 using, for example, electric welding.
しかしながら、従来の固体撮像装置によれば、以下に示
す欠点を有する。即ち、一般に光学窓板９はセラミック
層８を介してメタルフレーム７と一体になっており、こ
の状態で外囲器本体１にメタル層６を介して例えば電気
溶接法により封止される。しかるに、光学窓板９と外囲
器本体１の位置合わせに際し、リードフレーム７の上方
から外囲器本体１の上端面を確認し難いため、それらの
位置決めが正確に行なわれない。However, conventional solid-state imaging devices have the following drawbacks. That is, the optical window plate 9 is generally integrated with the metal frame 7 via the ceramic layer 8, and in this state is sealed to the envelope body 1 via the metal layer 6 by, for example, electric welding. However, when aligning the optical window plate 9 and the envelope body 1, it is difficult to confirm the upper end surface of the envelope body 1 from above the lead frame 7, so that their positioning is not performed accurately.
その結果、メタルフレーム７が外囲器本体１の上端面か
らずれて封止され、チップ３の封止不良等をもたらす。As a result, the metal frame 7 is deviated from the upper end surface of the envelope body 1 and sealed, resulting in failure of sealing of the chip 3 and the like.
又電気溶接法を用いる事により、外囲器本体１と光学窓
板９も高温になる為熱の歪、応力により光学窓板９がク
ラックし歩留りの低下を招いている。Further, by using the electric welding method, the envelope body 1 and the optical window plate 9 are also heated to high temperatures, which causes the optical window plate 9 to crack due to thermal distortion and stress, resulting in a decrease in yield.
本発明は上記事情に鑑みてなされたもので、光学窓板と
外囲器本体との位置決めを正確に行なって固体撮像素子
を気密性よく封止できるとともに、封止の際に発生する
熱に起因する歪や応力を緩和して光学窓板にクラックが
発生することを阻止し得る固体撮像装置を提供すること
な目的とするものである。The present invention was made in view of the above circumstances, and it is possible to accurately position the optical window plate and the envelope body to seal the solid-state image sensor with good airtightness, and also to prevent heat generated during sealing. It is an object of the present invention to provide a solid-state imaging device that can prevent cracks from occurring in an optical window plate by alleviating the resulting strain and stress.
本発明は、光学窓側のメタルフレームの周縁部分を凹状
とした構造にすることにより、上記目的を達成すること
を図ったことな骨子とするものである。The gist of the present invention is to achieve the above object by making the peripheral edge of the metal frame on the optical window side concave.
以下、本発明の一実施例を第２図を参照して説明す。な
お、第１図の部材と同部材のものは同符号を付して説明
を省略する。An embodiment of the present invention will be described below with reference to FIG. It should be noted that the same members as those shown in FIG. 1 are given the same reference numerals and their explanations will be omitted.
図中の１１はメタルフレームである。このメタルフレー
ム１ノの光学窓板９側の周縁部分には、凹部１２が設け
られている。この凹部１２は、既述した外囲器本体１上
のメタル層６の内周側壁と嵌合するようになっている。11 in the figure is a metal frame. A recess 12 is provided in the peripheral portion of the metal frame 1 on the optical window plate 9 side. This recess 12 is adapted to fit into the inner peripheral side wall of the metal layer 6 on the envelope body 1 described above.
しかして、本発明によれば、メタルフレーム１１の光学
窓板９側の周縁部分に凹部１２が設ゆられているため、
光学窓板９を外囲器本体ｌに対して位置決めする際に凹
部１２が目印となり、位置決めを正確に行なうことがで
き、もって光学窓板９によりチップ３を完全に封止でき
る。According to the present invention, since the recess 12 is provided in the peripheral portion of the metal frame 11 on the optical window plate 9 side,
When positioning the optical window plate 9 with respect to the envelope body l, the recess 12 serves as a mark, and the positioning can be performed accurately, thereby making it possible to completely seal the chip 3 with the optical window plate 9.
また、このように位置決めを正確に行なうことができる
と共に、従来の如く高温で電気溶接を行なっても光学窓
板９側の周縁部分凹部１２が設けられていることにより
封止の際に発生する熱の歪や応力を緩和でき、光学窓板
９のクラ、りを阻止し１歩留りを向上できる。In addition, positioning can be performed accurately in this manner, and even if electric welding is performed at high temperatures as in the conventional method, the presence of the peripheral recess 12 on the optical window plate 9 side prevents the occurrence of problems during sealing. Thermal distortion and stress can be alleviated, cracking of the optical window plate 9 can be prevented, and the yield can be improved.
以上詳述した如く本発明によれば、固体撮像素子を気密
性よく封止できるとともに、光学窓板にクラックが発生
するのを阻止できる固体撮像装置を提供できるものであ
る。As described in detail above, according to the present invention, it is possible to provide a solid-state imaging device in which the solid-state imaging device can be hermetically sealed and the occurrence of cracks in the optical window plate can be prevented.
第１図は従来の固体撮像装置の断面図、第２図は本発明
の一実施例に係る固体撮像装置の断面図である。
１・・・外囲器本体、２，１２・・・凹部、３・・・チ
ップ、４・・・導電性接着剤層、５・・・ゲンテ（ンク
ヮイヤ、６・・・メタル層、８・・・セラミ、り層、９
・・・光学窓板、１１・・・メタルフレーム。FIG. 1 is a sectional view of a conventional solid-state imaging device, and FIG. 2 is a sectional view of a solid-state imaging device according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Envelope main body, 2, 12... Recessed part, 3... Chip, 4... Conductive adhesive layer, 5... Necklace, 6... Metal layer, 8... ...cerami, layer, 9
...Optical window plate, 11...Metal frame.
Claims (1)
四部底面に収納された光信号な電気信号に変換する固体
撮像素子と、前記外囲器本体上面にメタルフレームを介
して設けられた光学窓板とを具備する固体撮像装置にお
いて、光学窓板側のメタルフレームの周縁部分を凹状と
したことな特徴とする固体撮像装置。An envelope body having a step-like recess, a solid-state image sensor that converts optical signals to electrical signals housed in the bottom of the four parts of the envelope body, and a solid-state image pickup device that is installed on the top surface of the envelope body via a metal frame. What is claimed is: 1. A solid-state imaging device comprising an optical window plate having an optical window plate, characterized in that a peripheral edge portion of a metal frame on the side of the optical window plate is formed into a concave shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59006862A JPS60150667A (en) | 1984-01-18 | 1984-01-18 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59006862A JPS60150667A (en) | 1984-01-18 | 1984-01-18 | Solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60150667A true JPS60150667A (en) | 1985-08-08 |
Family
ID=11650048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59006862A Pending JPS60150667A (en) | 1984-01-18 | 1984-01-18 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60150667A (en) |
-
1984
- 1984-01-18 JP JP59006862A patent/JPS60150667A/en active Pending
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