JPS6484645A - Method for encapsulating semiconductor element by seam weld - Google Patents

Method for encapsulating semiconductor element by seam weld

Info

Publication number
JPS6484645A
JPS6484645A JP62242227A JP24222787A JPS6484645A JP S6484645 A JPS6484645 A JP S6484645A JP 62242227 A JP62242227 A JP 62242227A JP 24222787 A JP24222787 A JP 24222787A JP S6484645 A JPS6484645 A JP S6484645A
Authority
JP
Japan
Prior art keywords
cap
frame
oscillation
semiconductor element
seam weld
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62242227A
Other languages
Japanese (ja)
Inventor
Katsushi Terajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62242227A priority Critical patent/JPS6484645A/en
Publication of JPS6484645A publication Critical patent/JPS6484645A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To increase the yield and improve the product quality by a method wherein a cap is placed at a correct position in a seam weld encapsulation process by applying mechanical oscillation or ultrasonic waves to a ceramic package substrate or a cap-constituting member. CONSTITUTION:A cap 3 is installed on a frame 2, when mechanical or supersonic oscillation 5a from an oscillator 5 is applied to a cradle 4. The flat station 11 of the cap 3 exposed to the oscillation 5a slides into the frame 2. A pulse current is applied to the cap 3 through a roller electrode 9. Heat is generated by the large current locally in presence between the cap 3 and the frame 2. The heat melts and then bonds together the frame 2 and cap 3, hermetically sealing a semiconductor element 6 in a package 1. This design improves on the yield out of the sealing process and on the product quality.
JP62242227A 1987-09-26 1987-09-26 Method for encapsulating semiconductor element by seam weld Pending JPS6484645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242227A JPS6484645A (en) 1987-09-26 1987-09-26 Method for encapsulating semiconductor element by seam weld

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242227A JPS6484645A (en) 1987-09-26 1987-09-26 Method for encapsulating semiconductor element by seam weld

Publications (1)

Publication Number Publication Date
JPS6484645A true JPS6484645A (en) 1989-03-29

Family

ID=17086124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242227A Pending JPS6484645A (en) 1987-09-26 1987-09-26 Method for encapsulating semiconductor element by seam weld

Country Status (1)

Country Link
JP (1) JPS6484645A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011177736A (en) * 2010-02-26 2011-09-15 Kyocera Kinseki Corp Ultrasonic seam welding apparatus
WO2017195424A1 (en) * 2016-05-13 2017-11-16 日本電気硝子株式会社 Airtight package manufacturing method and airtight package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011177736A (en) * 2010-02-26 2011-09-15 Kyocera Kinseki Corp Ultrasonic seam welding apparatus
WO2017195424A1 (en) * 2016-05-13 2017-11-16 日本電気硝子株式会社 Airtight package manufacturing method and airtight package

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