JPS59128735U - 半導体チツプの接着装置 - Google Patents

半導体チツプの接着装置

Info

Publication number
JPS59128735U
JPS59128735U JP1983022605U JP2260583U JPS59128735U JP S59128735 U JPS59128735 U JP S59128735U JP 1983022605 U JP1983022605 U JP 1983022605U JP 2260583 U JP2260583 U JP 2260583U JP S59128735 U JPS59128735 U JP S59128735U
Authority
JP
Japan
Prior art keywords
semiconductor chip
adhesive
mounting table
chip bonding
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983022605U
Other languages
English (en)
Japanese (ja)
Other versions
JPH027466Y2 (cg-RX-API-DMAC7.html
Inventor
小沢　淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP1983022605U priority Critical patent/JPS59128735U/ja
Publication of JPS59128735U publication Critical patent/JPS59128735U/ja
Application granted granted Critical
Publication of JPH027466Y2 publication Critical patent/JPH027466Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1983022605U 1983-02-17 1983-02-17 半導体チツプの接着装置 Granted JPS59128735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983022605U JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983022605U JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Publications (2)

Publication Number Publication Date
JPS59128735U true JPS59128735U (ja) 1984-08-30
JPH027466Y2 JPH027466Y2 (cg-RX-API-DMAC7.html) 1990-02-22

Family

ID=30153698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983022605U Granted JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Country Status (1)

Country Link
JP (1) JPS59128735U (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135561A (ja) * 1987-08-27 1989-05-29 Fuji Kikai Seizo Kk 接着剤塗布装置
JPH02137339A (ja) * 1988-11-18 1990-05-25 Hitachi Ltd ペレットボンディング方法およびその装置
JPH05115823A (ja) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd 試し打ち機能を備えた高粘性流体塗布装置
JPH05115822A (ja) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd 高粘性流体塗布装置
JPH09172030A (ja) * 1996-10-25 1997-06-30 Toshiba Mechatronics Kk ペレットボンディング用ペースト塗布装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112019000273B1 (pt) * 2016-07-08 2022-12-13 Macdonald, Dettwiler And Associates Inc Método implementado por computador em tempo real para vedação, sistema de dispensação, e, sistema de vedação

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5732587U (cg-RX-API-DMAC7.html) * 1980-08-01 1982-02-20
JPS5839019A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5732587U (cg-RX-API-DMAC7.html) * 1980-08-01 1982-02-20
JPS5839019A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135561A (ja) * 1987-08-27 1989-05-29 Fuji Kikai Seizo Kk 接着剤塗布装置
JPH05115823A (ja) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd 試し打ち機能を備えた高粘性流体塗布装置
JPH05115822A (ja) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd 高粘性流体塗布装置
JPH02137339A (ja) * 1988-11-18 1990-05-25 Hitachi Ltd ペレットボンディング方法およびその装置
JPH09172030A (ja) * 1996-10-25 1997-06-30 Toshiba Mechatronics Kk ペレットボンディング用ペースト塗布装置

Also Published As

Publication number Publication date
JPH027466Y2 (cg-RX-API-DMAC7.html) 1990-02-22

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