JPS59119736A - 自動クリ−ニング式モ−ルド装置 - Google Patents

自動クリ−ニング式モ−ルド装置

Info

Publication number
JPS59119736A
JPS59119736A JP23294182A JP23294182A JPS59119736A JP S59119736 A JPS59119736 A JP S59119736A JP 23294182 A JP23294182 A JP 23294182A JP 23294182 A JP23294182 A JP 23294182A JP S59119736 A JPS59119736 A JP S59119736A
Authority
JP
Japan
Prior art keywords
resin
mold
cleaning
die
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23294182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219057B2 (enrdf_load_stackoverflow
Inventor
Kazuo Kachi
加地　一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23294182A priority Critical patent/JPS59119736A/ja
Publication of JPS59119736A publication Critical patent/JPS59119736A/ja
Publication of JPS6219057B2 publication Critical patent/JPS6219057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP23294182A 1982-12-24 1982-12-24 自動クリ−ニング式モ−ルド装置 Granted JPS59119736A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23294182A JPS59119736A (ja) 1982-12-24 1982-12-24 自動クリ−ニング式モ−ルド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23294182A JPS59119736A (ja) 1982-12-24 1982-12-24 自動クリ−ニング式モ−ルド装置

Publications (2)

Publication Number Publication Date
JPS59119736A true JPS59119736A (ja) 1984-07-11
JPS6219057B2 JPS6219057B2 (enrdf_load_stackoverflow) 1987-04-25

Family

ID=16947244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23294182A Granted JPS59119736A (ja) 1982-12-24 1982-12-24 自動クリ−ニング式モ−ルド装置

Country Status (1)

Country Link
JP (1) JPS59119736A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179268A (ja) * 1984-10-15 1986-08-11 キユ−オ−　ケミカルズ，インコ−ポレイテイド 金属、プラスチツクまたは木材の表面清浄方法
JPS63185231U (enrdf_load_stackoverflow) * 1987-05-20 1988-11-29
KR100455388B1 (ko) * 2002-05-28 2004-11-06 삼성전자주식회사 금형에의 이형제 처리를 자동화한 반도체 소자 성형 장비
JP2009010084A (ja) * 2007-06-27 2009-01-15 Sumitomo Heavy Ind Ltd 樹脂封止装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146760U (enrdf_load_stackoverflow) * 1988-03-18 1989-10-11
JPH04101646A (ja) * 1990-08-20 1992-04-03 Tomoharu Kataoka 送風機

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179268A (ja) * 1984-10-15 1986-08-11 キユ−オ−　ケミカルズ，インコ−ポレイテイド 金属、プラスチツクまたは木材の表面清浄方法
JPS63185231U (enrdf_load_stackoverflow) * 1987-05-20 1988-11-29
KR100455388B1 (ko) * 2002-05-28 2004-11-06 삼성전자주식회사 금형에의 이형제 처리를 자동화한 반도체 소자 성형 장비
US6971863B2 (en) 2002-05-28 2005-12-06 Samsung Electronics Co., Ltd Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
JP2009010084A (ja) * 2007-06-27 2009-01-15 Sumitomo Heavy Ind Ltd 樹脂封止装置

Also Published As

Publication number Publication date
JPS6219057B2 (enrdf_load_stackoverflow) 1987-04-25

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