JPS59119736A - Automatic cleaning type molding device - Google Patents

Abstract

PURPOSE:To execute resin seal work containing die cleaning work automatically by previously supplying a die with a resin for cleaning at regular intervals and automatically carrying a dummy frame to the die while being interlocked with a supply. CONSTITUTION:When the resin 18 for cleaning, a color or reflectivity thereof differs from a sealing resin 17, passes through a chute 6 and reaches under a press 7, a sensor 10 transmits a signal (A) over a controller 11. The controller drives motors by signals (B), (C), each moves elevators 16, 19 to predetermined positions, and sets the dummy frames 13 to a bottom force 3 from a tray 15. The bottom force 3 is fast stuck to a top force 2, and heated 2a and the approximately liquefied resin 18 for cleaning is forwarded by the press 7, and the dummy frames are sealed. The controller 11 transmits a signal (D) over a main body 1, and sets the conditions of sealing required for cleaning. When the sealed dummy frames are extracted from the die, dust in the cavities of the top force 2 and the bottom force 3 is removed together with the resin 18.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a self-cleaning molding device for molding semiconductor devices with resin.

[Technical background of the invention and its problems]

Generally, semiconductor devices are encapsulated with a resin mold to protect them from the external environment. In such a mold sealing process, a mold is usually used, and a frame with a sealing resin and a semiconductor element is set in this mold to perform the mold sealing process. Automated.

By the way, in the mold sealing process as described above, a mold cleaning process is carried out at certain intervals (i.e., at a certain interval for each mold sealing process) to remove fine dust and dirt that has adhered to the inside of the mold. It is necessary to do it. In this case, in the past, the mold sealing process was stopped periodically and the worker used an airbrush to clean the dust (e.g. particulate resin scum, etc.) inside the mold, but this was not completely removed. There are many things that cannot be done.

For this reason, recently, workers set a mold cleaning resin (for example, melamine resin) and a dummy frame (i.e., a frame that is not related to commercialization and does not contain semiconductor elements) and repeat several times to clean the dummy mold. There is a method for performing molding.

However, in this mold cleaning process,
An operator manually pours cleaning resin into the mold (cavity) at regular intervals during the mold 9 sealing process, and removes dust and the like from the surface of the cavity together with the cleaning resin. Furthermore, the mold cleaning process must be performed under mold conditions (for example, resin filling pressure) that are different from those used in normal product molding. For this reason, in the past, it was difficult to fully automate the mold sealing process including the mold cleaning process, and there was a drawback that the processing efficiency of the mold sealing process was reduced.

[Purpose of the invention]

This invention was made in view of the above circumstances, and its purpose is to automate the mold cleaning process for removing dust, etc. inside the mold with a simple configuration, and to seal resin molds of semiconductor devices. An object of the present invention is to provide a self-cleaning mold device that can improve process efficiency.

[Summary of the invention]

In a method of performing mold cleaning processing using a cleaning resin, the present invention detects and determines a sealing resin and a cleaning resin having a different color or reflectance by using an optical detection and determination device or the like. Do this. Based on the result of this detection and determination, the controller performs control so that when the cleaning resin is supplied into the mold, the dummy frame is supplied into the mold in conjunction with the supply of the cleaning resin into the mold. The controller sets mold conditions for cleaning and controls the mold cleaning process, for example, according to a preprogrammed procedure. This realizes automation of the mold cleaning process.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. The figure shows the configuration of a molding device according to the present invention. In the figure, reference numeral 1 denotes a mold body, which includes an upper mold 2 and a lower mold 3 that constitute the mold. Upper mold 2 and lower mold 3 are
Each has heaters 2a and 3a. Upper mold 2
is held by an upper mold holding plate 5 supported by a support 4 with respect to the mold body 1. Further, the lower mold 3 is directly coated on the mold body 1 and is arranged to face the upper mold 2. A resin supply device (hereinafter referred to as a chute) 6 supplies resin into the mold (ie, the cavity of the lower mold 3). This chute 6 is disposed on the upper die holding plate 5 and is configured to feed normally solid resin to the bottom of the single (tufflet) 11M resin transfer press 2. A resin transfer press (hereinafter referred to as a transfer press) 7 includes a resin transfer piston 8, and the operation of the piston 8 sends resin to molds (upper mold 2 and lower mold 3). In this case, shoot 6
The resin supplied from the transfer press 7 is set at a predetermined position under the transfer press 7 by the resin guide 9.

Furthermore, in the present invention, an optical detection device (hereinafter, a sensor ) 10 are provided. In this case, the sensor 10 emits light to the resin 18 through the transparent part 6a, for example, since the part 6a of the chute 6 is not a transparent part, and outputs the reflected light as a detection signal A obtained by converting the reflected light into an electric signal.

The controller 11 determines whether or not the cleaning resin 18 is present based on the detection signal A from the sensor 10, and outputs a control signal B according to the determination result.

C, Dt- are output respectively. This controller 11 includes, for example, a microprocessor, and performs control operations based on a preset program. Here, for the mold as described above, a product frame (a frame for a product on which a semiconductor element is bonded) 12 and a dummy frame (a frame for gold lining) 13 are attached.
One of the two is transported. In this case, frame 12.
13 are conveyed to the mold from, for example, dedicated frame storage trays 14 and 15, and each frame storage tray 14 and 15 is set at the loading position of the mold by the loader-side elevator 16. The loader side elevator 16 is driven up and down by a motor 22 and an elevator screw shaft 23, and its drive is controlled by a control signal B from the controller 11. That is, the rotational drive of the motor 22 is controlled by the control signal B. Furthermore, in the mold as described above, the molded product frame 12a and the dummy frame 13m are storage trays 2θ that are driven up and down by an elevator 19 on the unloader side.

It is stored in each of the two rooms. The unloader side elevator 19, like the loader side elevator 16, is driven up and down by a motor 24 and an elevator screw shaft 25. In this case, the drive control of the elevator 19 is performed by the controller 11.
This is done by control signal C from .

The operation of this configuration will be explained. first,
In the case of mode sealing processing for the normal product frame 12, the storage tray 14 is set at the loading position.
From there, the product frame 12 is transported to a mold (lower mold 3).

In this case, the product frame 12 is the storage tray 14.
may be omitted and the material may be directly conveyed to the mold from the pounding step or the like. When the product frame 12 is set on the lower mold 3, the lower mold 3 rises from the mold body 1 and comes into close contact with the upper mold 2. On the other hand, a sealing resin 17 is sequentially supplied to the bottom of the transfer press 2 from CETRO. The sealing resin 17 is sent downward by the piston 8 of the transfer azores 27. Then, the sealing resin 17, which has been made into a nearly liquid state by the heater 2a of the upper mold 2, is sealed into the cavity A of the lower mold 3. Furthermore, after a predetermined curing time, the lower mold 3 moves downward and separates from the upper mold 2. The resin-sealed product frame 12a is taken out from the lower mold 3 by a frame unloader device (not shown) or the like and transported to the storage tray 20 on the unload side. The series of operations in this mold sealing process is described in 1.
I'll call it shot.

Next, the mold cleaning process will be explained. After the mold sealing process as described above is repeated, for example, several dozen times or more, that is, after a certain number of shots have passed, a mold cleaning process is automatically performed. That is,
In this invention, the cleaning resin 18 is set in advance in the sealing resin 17 in the chute 6 at a constant interval. In this case, the cleaning resin 18 used has a different color (or reflectance) from the sealing resin 17 as described above.

As a result, after a certain number of shots have elapsed, the cleaning resin 18 passes through the chute 6 and is set at a position below the transfer resin 7.

At this time, the sensor 0 detects the cleaning resin 18 separately from the sealing resin 17 by its reflected light, for example, through the transparent portion 6a of the chute 6, as described above. Sensor 0 outputs its detection signal At-controller 11 .

The controller 11 performs a control operation based on the detection signal A to perform the mold cleaning process. That is, the controller 11 outputs control signals B and C'i to drive the motors 22 and 24f, respectively, to move the loader-side elevator 6 and the unloader-side elevator 9, for example, downward. Accordingly, each of the storage trays 15, 21 on the loader side and the unloader side moves downward and stops at predetermined positions (loading position and unloading position). Then, the storage tray 15 on the loader side is brought into close contact with the upper die 2 as in the case of the sealing process, and the cleaning resin 18 sent out by the truss 7 apress 7 is sealed therein. In this case, the cleaning resin 18 is in a nearly liquid state by the heating heater 2a of the upper mold 2. Then, a molding process is performed using a combination of the dummy frame 13 and the cleaning resin 18 in a mold. Incidentally, in this case, the mold conditions (for example, conditions such as curing time and resin filling pressure) are different from those of the mold for the product frame. Therefore, the controller 11
outputs a control signal (command signal) D to the mold body 1, and controls the molding process so that the molding process is performed under the molding conditions necessary for the cleaning process. The dummy frame 13a sealed with the cleaning resin 18 is then taken out from the mold by an unloader device (not shown) and transported to the storage tray 21. Therefore, when the dummy frame 13a is taken out from the mold,
Dust and the like adhering to the cavities of the upper mold 2 and lower mold 3 of the mold are removed from the mold together with the cleaning resin 18.

In this way, the mold cleaning process is automatically performed, and when it is finished, both the loader-side elevator 16 and the unloader-side elevator 19 return to their positions during the normal mold sealing process. In this case, the state will naturally be restored to its original state under the control of the controller 11. In addition, after the leaning process as described above,
Even when performing a shot using a combination of the dummy frame 13 and the sealing resin 17, this can be easily realized by setting the dummy frame 13 on the storage tray 14 of the product frame 12 in advance. In FIG. 1, if there is no need to stock the product frame 12af, the storage tray 20'c on the unloader side may be omitted and the product may be sent to the transport rail.

〔Effect of the invention〕

As detailed above, according to the present invention, in a molding device that performs a mold cleaning process using a mold cleaning resin, the cleaning resin is supplied to the mold in advance at regular intervals, and the cleaning resin is supplied to the mold in conjunction with this supply. Automatically transports the dummy frame to the mold. Thereby, the mold cleaning process can be performed automatically without relying on manual work by an operator. Therefore, it is possible to fully automate the resin mold encapsulation process for semiconductor devices, including the mold cleaning process, and the process efficiency can be greatly improved.

[Brief explanation of drawings]

The figure is a schematic diagram of a self-cleaning mold device according to an embodiment of the present invention. 2...Upper die, 3...Lower die, 6...Chute, 1θ
... Optical detection device, 1 No. ... Controller, 12
...Product frame, 13...Dummy frame, 17
...Sealing resin, 18...Cleaning resin. Applicant's agent Patent attorney Takehiko Suzue 16C

Claims (1)

[Claims] A supply means for supplying both a semiconductor device encapsulating resin and a mold cleaning resin having different color fade or reflectance to the encapsulating resin to a mold at a certain timing, and supplying by this supply means. detection and determination means for distinguishing and detecting the sealing resin and mold cleaning resin by color or reflectance, and when the mold cleaning resin is supplied based on the detection result of the detection and determination means; An automatic cleaning type molding apparatus characterized by comprising a control means for supplying a mold cleaning dummy frame to the mold and controlling a mold cleaning process operation.