JP2010067899A - Resin sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically and reliably clean a die. <P>SOLUTION: The resin sealing device 100 includes: a frame supply part 110 for housing a frame for production therein; a resin supply part 116 for supplying a resin for production for resin-sealing the frame for production; and a die 118 for carrying out resin sealing with the frame for production and the resin for production arranged therein. The frame supply part 110 includes a dedicated magazine 110Z for housing a dummy frame used for cleaning the die 118; and a resin for cleaning, used for cleaning the die 118, is arranged in the resin supply part 116 at a position 116Z different from that of the resin for production. The resin sealing device includes a device control part 140 controlling to execute resin sealing by changing over the frame for production and the resin for production to the dummy frame and the resin for cleaning, respectively, by a preset number of times of resin sealing. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device for resin-sealing a production frame on which a semiconductor chip is mounted.

  In a resin sealing device, a resin (referred to as a production resin) that is a sealing material is deposited as an adhering material on the mold surface during the operation, which may hinder high-quality resin sealing. . Therefore, in order to remove the deposits on the mold surface regularly or irregularly, it is necessary to clean the mold surface. Therefore, for example, in the resin sealing device described in Patent Document 1, a cleaning resin having a color or reflectance different from that of the production resin and a dummy different from the production frame (frame on which the semiconductor chip is mounted) are used. It has been proposed to perform mold cleaning using a frame (frame for mold cleaning on which a semiconductor chip is not mounted).

  In Patent Document 1, the difference in resin color or reflectance is recognized by a camera at a specific portion of a resin passage of a chute, which is a shared resin supply means, and a dummy frame is supplied according to the determination of the cleaning resin. The mold cleaning can be automated. In Patent Document 1, since a dummy frame is used for mold cleaning instead of the production frame, the semiconductor chip is not wasted and the mold can be cleaned at low cost.

JP 59-119736 A

  However, in Patent Document 1, since the production resin and the cleaning resin need to have different colors or reflectances, there are large restrictions on the production resin and the cleaning resin. In other words, if the visual difference is not clear, it is difficult to perform mold cleaning in Patent Document 1.

  In Patent Document 1, the production resin and the cleaning resin also serve as a chute. Therefore, when the amount of resin actually supplied from the chute to the mold deviates, the supply order of the production resin and cleaning resin observed with the camera, and the actual production resin and cleaning resin supply It will be out of order. In that case, the production frame may be resin-sealed with a cleaning resin, and the production frame is wasted. Similarly, there is a case where the dummy frame is resin-sealed with a production resin, and there is a possibility that a molded product produced from the production frame is mixed with a molded product produced from the production frame.

  The present invention has been made to solve such problems, and an object thereof is to provide a resin sealing device that can automatically and reliably clean a mold.

  The present invention includes a frame supply unit that stores a production frame, a resin supply unit that supplies a production resin for resin-sealing the production frame, the production frame, and the production resin. In the resin sealing device having a mold for resin sealing, the frame supply unit has a dedicated magazine for storing a dummy frame used for cleaning the mold, and the resin A cleaning resin used for cleaning the mold is disposed at a position different from the production resin in the supply unit, and the production frame is inserted into the dummy frame at a preset number of resin sealing times. Furthermore, the above-mentioned problem is solved by providing a control means for controlling the production resin to be switched to the cleaning resin to perform resin sealing.

  As described above, the cleaning resin and the production resin can be clearly distinguished from each other by arranging the cleaning resin and the production resin at different positions in the resin supply unit. Need not be visually different. For this reason, as the cleaning resin, it is possible to select and use an optimal resin for mold cleaning.

  Further, since the dummy frame is stored in the dedicated magazine in the frame supply unit, the distinction between the dummy frame and the production frame becomes clear. At the same time, the dummy frame can be easily loaded without making a mistake. For this reason, it can implement without making the expense concerning a metal mold | die cleaning expensive, without using a production | generation frame wastefully.

  Furthermore, since the mold cleaning is performed by switching the number of times of resin sealing set in advance, it is possible to prevent forgetting to clean the mold, and there is no need to stop the mold for manual cleaning. Can be eliminated, and rational operation of the resin sealing device can be realized. That is, it is possible to minimize the decrease in productivity due to mold cleaning. At the same time, the resin sealing can be kept in high quality.

  The present invention provides a resin sealing method in which a production frame housed in a frame supply unit is sealed with a mold using a production resin in a resin supply unit, and the mold is attached to the frame supply unit. A dedicated magazine for storing a dummy frame used for cleaning, and a cleaning resin used for cleaning the mold in a position different from that for the production resin. The resin sealing is characterized in that the resin sealing is performed by switching the production frame to the dummy frame and the production resin to the cleaning resin at a preset number of times of resin sealing. It can also be realized by a stopping method.

  In addition, when the release resin for reducing the adhesion of the production resin to the mold is arranged at a position different from the production resin, the control means The cleaning frame is used for the dummy frame a predetermined number of times, then the release resin is used for the predetermined number of times, and the production resin is used for the predetermined number of times. It is possible to restart the resin sealing using the production resin. That is, since the release resin is applied after the mold cleaning with the cleaning resin is completed, it is possible to prevent the production resin from adhering to the mold over a long period of time. Therefore, the resin sealing can be kept in high quality for a long period. At that time, since the resin sealing is performed using a dummy frame a predetermined number of times after the treatment with the release resin, the quality of the resin sealing was confirmed without wasting an expensive production frame. The resin sealing by the production frame can be resumed.

  In the present invention, the dummy frame is further provided with a release resin for reducing adhesion of the production resin to the mold at a position different from the production resin. On the other hand, a resin sealing method characterized in that the cleaning resin is used a predetermined number of times, and then the release resin is used a predetermined number of times, and the production resin is predetermined It can also be realized by a resin sealing method characterized in that the resin sealing with the production resin can be resumed after the use is repeated.

  By applying the present invention, it is possible to provide a resin sealing device that can automatically and reliably clean the mold.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic diagram showing the entire device mechanism part of a resin sealing device according to an embodiment of the present invention, FIG. 2 is a schematic diagram showing the device control unit, and FIG. 3 is an operation flow for explaining automatic mold cleaning. Figure.

  Initially, the schematic structure of the resin sealing apparatus concerning embodiment of this invention is demonstrated using FIG. 1, FIG. “Production frame” indicates a lead frame or substrate on which a semiconductor chip is mounted, and “dummy frame” indicates a lead frame or substrate on which a semiconductor chip is not mounted. “Production resin” refers to a resin used to seal a semiconductor chip when applied to a production frame. “Resin for cleaning” is applied to a dummy frame and applied to the mold surface. A resin used to remove the attached production resin.

  As shown in FIG. 1, the resin sealing device 100 includes a device mechanism unit 102 and includes a frame supply unit 110 that stores a production frame, and a resin that supplies a production resin for resin-sealing the production frame. It has the supply part 116 and the metal mold | die 118 (four metal mold | die 118A, 118B, 118C, 118D in this embodiment) by which a production | generation frame and production resin are arrange | positioned and resin sealing is performed. For this reason, the resin sealing device 100 can perform resin sealing of the production frame housed in the frame supply unit 110 with the mold 118 using the production resin of the resin supply unit 116. The resin sealing device 100 constitutes a so-called multi-press that also serves as a component other than the mold 118. Here, the frame supply unit 110 has a dedicated magazine 110 </ b> Z for storing a dummy frame used for cleaning the mold 118. In the resin supply unit 116, a cleaning resin used for cleaning the mold 118 is disposed at a position 116Z different from the production resin.

  Further, as shown in FIG. 2, the resin sealing device 100 includes a device control unit 140 that is a control unit for controlling the device mechanism unit 102. The apparatus control unit 140 performs control so as to perform resin sealing by switching the production frame to the dummy frame and the production resin to the cleaning resin at a preset number of times of resin sealing.

  Hereinafter, each component of the resin sealing device 100 will be described in detail.

  As shown in FIG. 1, the device mechanism unit 102 of the resin sealing device 100 mainly includes a frame supply unit 110, a resin supply unit 116, a mold 118, and a molded product storage unit 132 provided on the base 108. And having.

  As shown in FIG. 1, the frame supply unit 110 includes a plurality of magazines 110 </ b> A to 110 </ b> D and stores a production frame. In the present embodiment, the production frame is different for each of the molds 118A to 118D, so that the storage position is distinguished. Therefore, the correspondence between the molds 118A to 118D and the production frame is determined by the apparatus control unit 140 based on the difference in position. In addition to the magazines 110A to 110D, a dedicated magazine 110Z for storing dummy frames is also provided.

  A production frame or a dummy frame (collectively referred to as a frame) is pulled out of the magazines 110A to 110D or the dedicated magazine 110Z by a transport hand (not shown) and transported onto the turning table 112. The turning table 112 aligns the direction of the frame on which it is placed and arranges the frame on the preheater unit 114. The preheater unit 114 has a function of raising and holding the arranged frames to a specific temperature.

  In the resin supply unit 116, as shown in FIG. 1, tablet-like production resin, cleaning resin, and release resin (collectively referred to as tablet resin) used for resin sealing are supplied. The production resin is disposed at the position 116A of the resin supply unit 116, but the cleaning resin and the release resin are disposed at a position 116Z different from the production resin of the resin supply unit 116. At the position 116Z, the cleaning resin and the release resin are arranged at different positions. Based on the difference in position, the apparatus control unit 140 determines whether the resin is a cleaning resin or a release resin. The release resin has a wax effect that makes it difficult to reattach the production resin to the mold surface after the production resin is peeled off from the mold 118 and cleaned with a cleaning resin. Resin used.

  The supplied tablet resin and frame are conveyed by a loader 124 on an X-direction guide 122 laid over the entire X direction on the base 108 (the loader 124 is also used as four molds 118A to 118D). . The tablet resin and the frame to be conveyed are set on the mold 118.

  As shown in FIG. 1, the mold 118 includes four molds 118A to 118D. In this embodiment, the production frames used for the dies 118A to 118D are different. For this reason, the production frame is identified from the difference in the storage position and supplied to the molds 118A to 118D according to the position, and resin sealing of a plurality of types of molded products is performed. For this reason, while keeping the resin sealing device 100 compact, it is possible to produce a small amount of various types of molded products without increasing the price.

  The mold 118 is composed of an upper mold and a lower mold (not shown). In the mold 118, the lower mold moves relative to the fixed upper mold, and the lower mold is in close contact with the upper mold, thereby forming a sealed space (referred to as a cavity) for resin-sealing the product to be molded. . The mold 118 is configured to push out the tablet resin set at a predetermined position of the mold 118 in a melted state with a plunger and introduce the molten tablet resin into the cavity through the resin flow path (transfer). Known as a structure for molding). Although the temperature of the mold 118 can be changed, in this embodiment, the mold 118 is kept at a constant temperature regardless of the type of resin. However, when the curing temperature varies depending on the type of resin, the temperature of the mold 118 is adjusted according to the resin.

  As shown in FIG. 1, the unloader 126 is movable in the X direction on the X direction guide 122, takes out a frame (referred to as a molded product) formed by the mold 118, and moves it onto the cooling stage 128. The molded product is placed on the cooling stage 128 for a predetermined time and cooled. The cooled molded product is moved to the gate break portion 130, and an unnecessary portion (referred to as a cull portion) of the molded product is separated (gate-breaked). Then, the molded product from which the cull portion is separated is moved to the storage stage unit 133 and stored in the magazines 132 </ b> A to 132 </ b> D of the molded product storage unit 132 using the storage loader 134. Here, regarding the molded product to which the dummy frame is applied, since the dummy frame is pulled out from the dedicated magazine 110Z, the apparatus control unit 140 determines the frame and is stored in the dedicated magazine 132Z different from the magazines 132A to 132D. Will be destroyed.

  As shown in FIG. 2, the device mechanism 102 of the resin sealing device 100 is controlled by a device controller 140 that is a control means. That is, the apparatus control unit 140 includes a frame supply unit 110, a resin supply unit 116, a mold 118, a loader 124, an unloader 126, a molded product storage unit 132, a storage stage unit 133, a storage loader 134, and the like that constitute the device mechanism unit 102. Can be controlled. That is, the device control unit 140 recognizes the difference in the storage position of each production frame and the dummy frame and the difference in the placement position of the production resin, the cleaning resin, and the release resin. The selection of the molds 118A to 118D, the resin sealing conditions in the mold 118, and the storage position of the molded product can be controlled without making a mistake.

  Further, as described above, the apparatus control unit 140 performs control so that the resin sealing is performed by switching the production frame to the dummy frame and the production resin to the cleaning resin at the preset number of times of resin sealing SH1. To do. At that time, the apparatus control unit 140 uses the cleaning resin for the dummy frame a predetermined number of times SH2, then uses the release resin for the predetermined number of times SH3, and further uses the production resin for the predetermined number of times SH4. It is possible to switch from the dummy frame to the production frame and resume production resin sealing using the production resin. The predetermined number of times SH2 is set to the number of times that the production resin adhered to the mold 118 can be completely peeled off. The predetermined number of times SH3 is set to the number of times that the mold 118 has a sufficient wax effect, and the predetermined number of times SH4. Is set to the number of times that the sealing quality of the mold 118 is sufficiently confirmed. The resin sealing times SH1 to SH4 can be set in advance for each of the molds 118A to 118D in the apparatus control unit 140.

  Next, an example of the automatic cleaning operation in the resin sealing device 100 will be described with reference to FIG. Here, for convenience of explanation, it is assumed that only the mold 118A is to be cleaned and cleaning is performed.

  First, when the resin sealing device 100 is activated, the device control unit 140 confirms (reads) a setting for using the automatic cleaning function of the mold 118 (step S2). Here, the automatic cleaning function is used for the purpose of explaining the automatic cleaning operation. Of course, the operator can also choose not to use the automatic cleaning function. In that case, the apparatus control unit 140 informs the operator of the cleaning time via a display device (not shown) connected to the apparatus control unit 140 and urges cleaning at a predetermined resin sealing number SH1. Can be.

  After determining the use of the automatic cleaning function, a molded product is produced using the production frame stored in the magazine 110A of the frame supply unit 110 and the production resin at the position 116A of the resin supply unit 116 (step S4). .

  Specifically, the apparatus control unit 140 performs control so that the transport hand pulls out the production frame from the magazines 110A to 110D. Under the control of the apparatus control unit 140, the drawn production frame is mounted on the mold 118 by the loader 124 via the turning table 112 and the preheater unit 114. At the same time, the apparatus control unit 140 moves the production resin from the position 116 </ b> A of the resin supply unit 116 by the loader 124 and mounts it on the mold 118. Under the control of the apparatus control unit 140, the position of the upper mold and the lower mold constituting the mold 118 is moved, and the pressure in the cavity formed by the upper mold and the lower mold is reduced, and the production frame becomes the production resin. With resin sealing. The resin-sealed molded product is moved to the gate break unit 130 via the cooling stage 128 by the unloader 126 under the control of the device control unit 140. The gate-breaked molded product is placed on the storage stage 133 by the unloader 126, and is controlled by the apparatus control unit 140 so as to be stored in the magazines 132A to 132D by the storage loader 134. The above process is repeated to produce a molded product (resin sealing). At this time, the apparatus controller 140 measures the number of times of resin sealing (number of production shots) in each of the molds 118A to 118D.

  It is determined whether or not the resin sealing times (set production shot times) SH1 set in advance for each of the molds 118A to 118D is reached (step S6).

  Then, for the mold 118A that has reached a preset number of resin sealing times (set number of production shots) SH1, the dummy frame housed in the dedicated magazine 110Z of the frame supply unit 110 and the position 116Z of the resin supply unit 116 are cleaned. The mold 118A is controlled under the sealing conditions for cleaning using the resin for cleaning, and the cleaning operation is executed (steps S8 and S10).

  Specifically, the apparatus control unit 140 performs control so that the transport hand pulls out the dummy frame from the dedicated magazine 110Z. Under the control of the device control unit 140, the pulled-out dummy frame is mounted on the mold 118A by the loader 124 via the turning table 112 and the preheater unit 114. At the same time, the apparatus control unit 140 moves the cleaning resin from the position 116Z of the resin supply unit 116 by the loader 124 and mounts it on the mold 118A. Under the control of the apparatus control unit 140, the position of the upper mold and the lower mold constituting the mold 118A is moved and the pressure in the cavity formed by the upper mold and the lower mold is reduced, and the dummy frame is made of a cleaning resin. Resin sealed. The resin-sealed molded product is moved to the gate break unit 130 via the cooling stage 128 by the unloader 126 under the control of the device control unit 140. The gate-breaked molded product is placed on the storage stage 133 by the unloader 126 and is controlled by the device control unit 140 so as to be stored in the magazine 132Z by the storage loader 134. The above process is repeated to perform a cleaning operation. At this time, the apparatus controller 140 measures the number of times of resin sealing (the number of cleaning shots) in the mold 118A. In addition, about the metal mold | die 118B-118D which is not applicable, a molded article is produced using a production frame and production resin.

  It is determined whether or not the number of times of resin sealing using the dummy frame and the cleaning resin for the mold 118A has reached a predetermined number of times (set number of cleaning shots) SH2 (step S12).

  When the number of resin sealings in the mold 118A reaches a predetermined number (set cleaning shot number) SH2, the dummy frame stored in the dedicated magazine 110Z of the frame supply unit 110 and the position 116B of the resin supply unit 116 are stored. Using the release resin, the mold 118A is controlled under the sealing conditions suitable for the release operation, and the release operation is executed (steps S14 and S16).

  Specifically, the apparatus control unit 140 performs control so that the transport hand pulls out the dummy frame from the dedicated magazine 110Z. Under the control of the device control unit 140, the pulled-out dummy frame is mounted on the mold 118A by the loader 124 via the turning table 112 and the preheater unit 114. At the same time, the apparatus control unit 140 moves the release resin from the position 116Z of the resin supply unit 116 by the loader 124 and mounts it on the mold 118A. Under the control of the device control unit 140, the position of the upper mold and the lower mold constituting the mold 118A is moved and the pressure in the cavity formed by the upper mold and the lower mold is reduced, and the dummy frame is made of release resin. Resin sealed. The resin-sealed molded product is moved to the gate break unit 130 via the cooling stage 128 by the unloader 126 under the control of the device control unit 140. The gate-breaked molded product is placed on the storage stage 133 by the unloader 126 and is controlled by the device control unit 140 so as to be stored in the magazine 132Z by the storage loader 134. The above steps are repeated to perform mold release work. At this time, the apparatus controller 140 measures the number of times of resin sealing (the number of release shots) in the mold 118A. In addition, about the metal mold | die 118B-118D which is not applicable, a molded article is produced using a production frame and production resin.

  It is determined whether or not the number of resin sealing using the dummy frame and the release resin for the mold 118A has reached a predetermined number of times (set number of release shots) SH3 (step S18).

  When the number of resin sealings in the mold 118A reaches a predetermined number (set release shot number) SH3, the positions of the dummy frame and the resin supply unit 116 stored in the dedicated magazine 110Z of the frame supply unit 110 are set. Using the production resin 116A, the mold 118A is controlled under the sealing conditions suitable for the production of the molded product, and resin sealing (dummy shot) is executed (steps S20 and S22).

  Specifically, the apparatus control unit 140 performs control so that the transport hand pulls out the dummy frame from the dedicated magazine 110Z. Under the control of the device control unit 140, the pulled-out dummy frame is mounted on the mold 118A by the loader 124 via the turning table 112 and the preheater unit 114. At the same time, the apparatus control unit 140 moves the production resin from the position 116A of the resin supply unit 116 by the loader 124 and mounts it on the mold 118A. Under the control of the device control unit 140, the position of the upper mold and the lower mold constituting the mold 118A is moved and the pressure in the cavity formed by the upper mold and the lower mold is reduced, and the dummy frame is made of production resin. Resin sealed. The resin-sealed molded product is moved to the gate break unit 130 via the cooling stage 128 by the unloader 126 under the control of the device control unit 140. The gate-breaked molded product is placed on the storage stage 133 by the unloader 126 and is controlled by the device control unit 140 so as to be stored in the magazine 132Z by the storage loader 134. A dummy shot is performed by repeating the above steps. At this time, the apparatus controller 140 measures the number of times of resin sealing (number of dummy shots) in the mold 118A. In addition, about the metal mold | die 118B-118D which is not applicable, a molded article is produced using a production frame and production resin.

  It is determined whether or not the number of resin sealing using the dummy frame and the production resin for the mold 118A has reached a predetermined number of times (set number of dummy shots) SH4 (step S24).

  When the number of resin seals in the mold 118A reaches a predetermined number (set dummy shot number) SH4, the apparatus control unit 140 asks the operator to confirm whether automatic production is to be resumed (step S26).

  When the operator selects automatic production, the mold 118A is controlled using the production frame and production resin under the sealing conditions suitable for production of the molded product, and production is resumed (step S28). At this time, the apparatus controller 140 again measures the number of times of resin sealing in the mold 118A. In addition, about the metal mold | die 118B-118D which is not applicable, a molded article is produced using a production frame and production resin.

  If the operator does not select automatic production, the operation of the mold 118A is stopped (step S30) (that is, the apparatus control unit 140 switches between restarting automatic production and stopping the operation of the mold 118. It can also be said as a switching means). Thereafter, production is resumed by the operator (step S32). At this time, the apparatus controller 140 again measures the number of times of resin sealing in the mold 118A. In addition, about the metal mold | die 118B-118D which is not applicable, a molded article is produced using a production frame and production resin.

  Here, stop of the operation of the resin sealing device 100 is not described, but the operation of the resin sealing device 100 can be stopped in an arbitrary step according to the judgment of the operator. In the above description, only the mold 118A is used. However, the molds 118B to 118D perform automatic cleaning independently of each other with the set optimum number of times of resin sealing regardless of the production status of other molds. It can be carried out.

  As described above, since the cleaning resin and the production resin are arranged at different positions in the resin supply unit 116, the cleaning resin and the production resin can be clearly distinguished from each other. There is no need to make a visual difference. For this reason, as the cleaning resin, it is possible to select and use an optimal resin for mold cleaning.

  Further, since the dummy frame is stored in the dedicated magazine 110Z in the frame supply unit 110, the distinction between the dummy frame and the production frame becomes clear. At the same time, the dummy frame can be easily loaded without making a mistake. For this reason, it can implement without making the expense concerning a metal mold | die cleaning expensive, without using a production | generation frame wastefully.

  Furthermore, since the mold cleaning is performed by switching at a preset resin sealing number (set number of production shots) SH1, it is possible to prevent forgetting to clean the mold 118, and the mold 118 for manual cleaning can be prevented. There is no need to stop the operation, so the troublesomeness can be eliminated and a rational operation of the resin sealing device can be realized. That is, it is possible to minimize the decrease in productivity due to mold cleaning. At the same time, the resin sealing can be kept in high quality.

  Further, since the mold release resin is applied after the mold cleaning with the cleaning resin is completed, it is possible to prevent the production resin from adhering to the mold 118 over a long period of time. That is, the resin sealing can be maintained at a high quality for a long period. At that time, since the resin sealing is performed using a dummy frame a predetermined number of times after the treatment with the release resin, the quality of the resin sealing is confirmed without wasting an expensive production frame. In addition, production using the production frame can be resumed.

  The molded product to which the dummy frame is applied is stored in a dedicated magazine 132Z different from the magazines 132A to 132D. For this reason, the molded product to which the production frame is applied is surely discarded without mixing the molded product at the time of the cleaning operation, the mold release operation, and the dummy shot.

  That is, by applying the present invention, it is possible to provide a resin sealing device 100 that can automatically and reliably clean the mold 118 without visually restricting the production resin and the cleaning resin. Is possible.

  Although the present invention has been described with reference to the present embodiment, the present invention is not limited to the present embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the present embodiment, there are four molds, but the number may be three or less or five or more.

  In the present embodiment, the four molds 118A to 118D are all different, but the present invention is not limited to this, and all the molds have the same shape and the same production frame is applied. Also good.

  In the present embodiment, the sealing conditions and the storage position of the molded product are determined based on the difference between the positions of the frame and the tablet resin. However, the present invention is not limited to this. For example, when a frame is transported by a transport hand, the camera as image recognition means recognizes a predetermined position of the frame, thereby discriminating the difference between the dummy frame and the production frame and the type of the production frame. The information may be combined with the differences in the positions of the frame and the tablet resin, and the device control unit 140 may determine the sealing conditions and the storage position of the molded product. In that case, the mold can be more reliably cleaned without wasting the production frame.

  In this embodiment, the cleaning resin and the release resin are prepared separately, but the present invention is not limited to this. For example, a release resin may not be used, and a cleaning resin having the wax effect of the release resin may be used.

  Further, in this embodiment, the cleaning resin and the release resin are arranged at different positions of the position 116Z of the resin supply unit 116, but the positions may not be clearly separated. This is because the cleaning resin and the release resin are arranged at positions different from the production resin, so that the production resin is clearly distinguished from each other and the production frame is not wasted.

  In the present embodiment, the position 116A and the position 116Z are different from each other in a plan view as shown in FIG. 1, but the present invention is not limited to this. For example, you may make it differ in the paper surface perpendicular | vertical direction in FIG.

  Furthermore, the resin sealing is not limited to the resin sealing by transfer molding, but can be applied to other resin sealing using a plurality of molds. Moreover, the loader and the unloader may be combined.

The schematic diagram showing the whole apparatus mechanism part of the resin sealing apparatus concerning embodiment of this invention Schematic diagram showing the device control unit Operation flow diagram explaining automatic mold cleaning

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102 ... Apparatus mechanism part 110 ... Frame supply part 110A, 110B, 110C, 110D, 110Z, 132A, 132B, 132C, 132D, 132Z ... Magazine 112 ... Turning table 114 ... Preheater part 116 ... Resin supply part 116A, 116Z ... Position 118, 118A, 118B, 118C, 118D ... Die 122 ... X direction guide 124 ... Loader 126 ... Unloader 128 ... Cooling stage 130 ... Gate break part 132 ... Molded product storage part 133 ... Storage stage part 134 ... Storage loader 140 ... device controller

Claims (5)

A frame supply unit for storing the production frame, a resin supply unit for supplying a production resin for resin-sealing the production frame, and the production frame and the production resin are arranged and resin-sealed In a resin sealing device having a mold,
The frame supply unit has a dedicated magazine for storing a dummy frame used for cleaning the mold,
In the resin supply unit, a cleaning resin used for cleaning the mold is disposed at a position different from the production resin,
It comprises control means for controlling the resin sealing by switching the production frame to the dummy frame and the production resin to the cleaning resin at a preset number of times of resin sealing, respectively. Resin sealing device. In claim 1,
A resin sealing device, wherein a release resin for reducing adhesion of the production resin to the mold is disposed at a position different from the production resin in the resin supply unit. . In the resin sealing method in which the production frame stored in the frame supply unit is resin-sealed with a mold using the production resin of the resin supply unit,
A dedicated magazine for storing a dummy frame used for cleaning the mold in the frame supply section;
In the resin supply unit, the cleaning resin used for cleaning the mold is arranged at a position different from the production resin,
Resin sealing is performed by switching the production frame to the dummy frame and switching the production resin to the cleaning resin by a predetermined number of resin sealing times. In claim 3,
In the resin supply unit, further, a release resin for reducing the adhesion of the production resin to the mold is arranged at a position different from the production resin,
The resin sealing method, wherein the cleaning resin is used a predetermined number of times for the dummy frame, and then the release resin is used a predetermined number of times. In claim 4,
Furthermore, after the production resin is used for the dummy frame a predetermined number of times, the resin sealing using the production resin for the production frame can be resumed.

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