JPS59110141A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS59110141A
JPS59110141A JP57219917A JP21991782A JPS59110141A JP S59110141 A JPS59110141 A JP S59110141A JP 57219917 A JP57219917 A JP 57219917A JP 21991782 A JP21991782 A JP 21991782A JP S59110141 A JPS59110141 A JP S59110141A
Authority
JP
Japan
Prior art keywords
resin
hole
electrode
inner hole
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57219917A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6238866B2 (enExample
Inventor
Shigeyuki Ishii
石井　重幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP57219917A priority Critical patent/JPS59110141A/ja
Publication of JPS59110141A publication Critical patent/JPS59110141A/ja
Publication of JPS6238866B2 publication Critical patent/JPS6238866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57219917A 1982-12-15 1982-12-15 半導体装置の製造方法 Granted JPS59110141A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57219917A JPS59110141A (ja) 1982-12-15 1982-12-15 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57219917A JPS59110141A (ja) 1982-12-15 1982-12-15 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59110141A true JPS59110141A (ja) 1984-06-26
JPS6238866B2 JPS6238866B2 (enExample) 1987-08-20

Family

ID=16743042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57219917A Granted JPS59110141A (ja) 1982-12-15 1982-12-15 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59110141A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01296649A (ja) * 1988-05-24 1989-11-30 Mitsubishi Electric Corp 半導体装置
US6703310B2 (en) * 2001-06-14 2004-03-09 Shinko Electric Industries Co., Ltd. Semiconductor device and method of production of same
WO2018207279A1 (ja) * 2017-05-10 2018-11-15 三菱電機株式会社 半導体装置、及び、その製造方法、並びに、電力変換装置、及び、移動体
JP2021111655A (ja) * 2020-01-07 2021-08-02 三菱電機株式会社 半導体モジュール
EP4270466A1 (en) * 2022-04-25 2023-11-01 Infineon Technologies AG Power semiconductor module arrangements and methods for producing power semiconductor module arrangements

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01296649A (ja) * 1988-05-24 1989-11-30 Mitsubishi Electric Corp 半導体装置
US6703310B2 (en) * 2001-06-14 2004-03-09 Shinko Electric Industries Co., Ltd. Semiconductor device and method of production of same
WO2018207279A1 (ja) * 2017-05-10 2018-11-15 三菱電機株式会社 半導体装置、及び、その製造方法、並びに、電力変換装置、及び、移動体
JPWO2018207279A1 (ja) * 2017-05-10 2019-07-25 三菱電機株式会社 半導体装置、及び、その製造方法、並びに、電力変換装置、及び、移動体
CN110603638A (zh) * 2017-05-10 2019-12-20 三菱电机株式会社 半导体装置及其制造方法、以及电力转换装置及移动体
US11239124B2 (en) 2017-05-10 2022-02-01 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body
CN110603638B (zh) * 2017-05-10 2023-04-18 三菱电机株式会社 半导体装置及其制造方法、以及电力转换装置及移动体
JP2021111655A (ja) * 2020-01-07 2021-08-02 三菱電機株式会社 半導体モジュール
US11587841B2 (en) 2020-01-07 2023-02-21 Mitsubishi Electric Corporation Semiconductor module
EP4270466A1 (en) * 2022-04-25 2023-11-01 Infineon Technologies AG Power semiconductor module arrangements and methods for producing power semiconductor module arrangements

Also Published As

Publication number Publication date
JPS6238866B2 (enExample) 1987-08-20

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