CA1159159A - Housing member for semiconductor devices - Google Patents

Abstract

49,274 ABSTRACT OF THE DISCLOSURE
The present invention is directed to a semicon-ductor housing consisting of a cup-shaped bottom member and a hood-shaped top member, into the interior of which is poured a sealing compound, or filler, at least up to a plane of separation between the top and bottom portions.
The top portion is provided with an apron or skirting which overlaps the separation within the housing, between the apron and the overlapped region of the bottom member there is a clearance which is filled with the sealing compound until below the plane of separation.

Description

~ 1 ,S`~

1 49,274 HOUSING MEMBER FOR SEMICONDUCTOR DEVICES
BACKGROUND OE THE INVENTION
Field of the Invention:
_ _ _ _ The present invention is in the field of semi-conductor housing or case members.
escription of the Prior Art:
Semiconductor housings having a top and bottom member are known.
In order to seal off the plane of separation between the top and bottom members and to prevent the emergence of the sealing compound, it is possible with such a semiconductor housing to stick the top and bottom members together prior to pouring in the sealing compound.
It is also possible to lay an elastic sealing gasket in the plane of separation. However, the above measures can only be carried out using an additional working opera-tions, and every additional operation increases the possi-bility of a reduced yield.
SUMMARY OF THE INVENTION
The present invention comprises a semiconductor housing consisting of a cup-shaped bottom member and a hood-shaped top member, the interior of the housing being filled with a sealing compound which is poured to a level at least as high as the plane of separation between the top and bottom members, the top member of the housing being provided with an apron or skirt portion which over-laps, within the housing, the plane of separation and between the apron and the overlapped region of the bottom .~

2 49,274 member there is a gap which is filled with the sealing compound to a point just below the plane of separation.
DESCRIPTION OF THE DRAWING
_ _ _ For a better understanding of the present inven-tion, reference should be had to the following detailed discussion and drawing in which the single figure is a side view in section of a semiconductor housing setting forth the teachings of this invention.
DESCRIPTION OF PREFERRED EMBODIMENT
_ _ .
With reference to the drawing, there is shown a housing 10 made in accordance with the teachings of this invention for a semiconductor device.
The housing 10 is provided with a cup-shaped bottom member 12 which includes a base portion 13 and a sidewall portion 14. The bottom member including side-wall 14 is constructed of a suitable metal as for example, copper or steel.
Seated on the sidewall portion 14 is a hood-shaped top member 16 made, for example, of a resin such as, for example, a cured epoxy or silicone resin.
The bottom part 12 and the top part 16 meet at a plane of separation 18.
Within the housing 10, the hood-shaped top member 16 is provided with an apron or skirt 20 which overlaps the plane of separation 18. Between the apron 20 and the part of the wall 14 overlapped by the apron 20 is a gap or clearance 22. The gap 22 is filled with a seal-ing compound as, for example, an epoxy or silicone resin to below the plane of separation 18, thereby sealing off the separating plane and preventing any escape of the sealing compound without the need for sticking together the two housing parts or using an elastic sealing gasket in the plane of separation.
In order to effect the seal, the housing is first filled with sealing compound to the level indicated by the broken line 24. This level lies below the plane of separation 18. The sealing compound is allowed to harden

3 49,274 or cure so that a seal consistirlg of hardened sealing compound henceforth lies in the gap 22. After -the harden-ing or curing process, the housinc; is additionally ~illed with sealing compound to the desired height, indicated by way of example by the broken line 26. This additional sealing compound cannot, in any way, leak out along the plane of separation 18.
As illustrated, the wall 14 of the bottom member 12 has a smaller wall thickness in the region overlapped by the apron 20 than the wall 14 outside the overlapped region. On the other hand, the wall thickness of the top member 16 is essentially the same all over. It is also possible, however, to make the thickness of the wall 14 essentially the same all over and to allow the apron 20 to project into the interior the housing.

Claims (5)

4 49,274 We claim as our invention:

1. A housing for a semiconductor device consisting of a cup-shaped bottom member, having a base portion and a wall portion, said bottom member including said side walls, being comprised of a metal, and a hood-shaped top member having an apron portion which over-laps a portion of the wall portion within the housing, the apron and the overlapped portion of the wall forming a gap therebetween.

2. The housing of claim 1 in which the wall portion overlapped by the apron is of a lesser thickness than the remainder of the wall.

3. The housing of claim 2 in which the thickness of the top member is uniform.

4. A semiconductor housing consisting of a cup-shaped bottom member, having a base portion and a wall portion, said bottom member, including said side walls, being comprised of a metal, and a hood-shaped top member said top member being comprised of a resin, the top member having an apron portion which overlaps a portion of the wall portion within the housing, a plane of separation between said top member and said wall of said bottom member, the apron and the overlapped portion of the wall forming a gap therebetween, said gap being filled with a sealing compound to a point just below the plane of separation.

5. The housing of claim 4 in which the wall portion overlapped by the apron is of lesser thickness than the remainder of the wall.