JPS59109143U - 半導体素子の樹脂封入成形用金型装置 - Google Patents

半導体素子の樹脂封入成形用金型装置

Info

Publication number
JPS59109143U
JPS59109143U JP1983002032U JP203283U JPS59109143U JP S59109143 U JPS59109143 U JP S59109143U JP 1983002032 U JP1983002032 U JP 1983002032U JP 203283 U JP203283 U JP 203283U JP S59109143 U JPS59109143 U JP S59109143U
Authority
JP
Japan
Prior art keywords
resin
semiconductor elements
resin encapsulation
semiconductor element
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983002032U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311723Y2 (enrdf_load_stackoverflow
Inventor
道男 長田
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP1983002032U priority Critical patent/JPS59109143U/ja
Publication of JPS59109143U publication Critical patent/JPS59109143U/ja
Application granted granted Critical
Publication of JPS6311723Y2 publication Critical patent/JPS6311723Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1983002032U 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置 Granted JPS59109143U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983002032U JPS59109143U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983002032U JPS59109143U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Publications (2)

Publication Number Publication Date
JPS59109143U true JPS59109143U (ja) 1984-07-23
JPS6311723Y2 JPS6311723Y2 (enrdf_load_stackoverflow) 1988-04-05

Family

ID=30133730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983002032U Granted JPS59109143U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Country Status (1)

Country Link
JP (1) JPS59109143U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078807A1 (ja) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078807A1 (ja) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法

Also Published As

Publication number Publication date
JPS6311723Y2 (enrdf_load_stackoverflow) 1988-04-05

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