JPS6311723Y2 - - Google Patents
Info
- Publication number
- JPS6311723Y2 JPS6311723Y2 JP1983002032U JP203283U JPS6311723Y2 JP S6311723 Y2 JPS6311723 Y2 JP S6311723Y2 JP 1983002032 U JP1983002032 U JP 1983002032U JP 203283 U JP203283 U JP 203283U JP S6311723 Y2 JPS6311723 Y2 JP S6311723Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- mold
- lead frame
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 44
- 238000000465 moulding Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983002032U JPS59109143U (ja) | 1983-01-11 | 1983-01-11 | 半導体素子の樹脂封入成形用金型装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983002032U JPS59109143U (ja) | 1983-01-11 | 1983-01-11 | 半導体素子の樹脂封入成形用金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59109143U JPS59109143U (ja) | 1984-07-23 |
| JPS6311723Y2 true JPS6311723Y2 (enrdf_load_stackoverflow) | 1988-04-05 |
Family
ID=30133730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983002032U Granted JPS59109143U (ja) | 1983-01-11 | 1983-01-11 | 半導体素子の樹脂封入成形用金型装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59109143U (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005078807A1 (ja) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法 |
-
1983
- 1983-01-11 JP JP1983002032U patent/JPS59109143U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59109143U (ja) | 1984-07-23 |
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