JPS5967944U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5967944U
JPS5967944U JP1982163787U JP16378782U JPS5967944U JP S5967944 U JPS5967944 U JP S5967944U JP 1982163787 U JP1982163787 U JP 1982163787U JP 16378782 U JP16378782 U JP 16378782U JP S5967944 U JPS5967944 U JP S5967944U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
insulating film
encapsulated semiconductor
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982163787U
Other languages
English (en)
Other versions
JPS6233329Y2 (ja
Inventor
正 酒井
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982163787U priority Critical patent/JPS5967944U/ja
Publication of JPS5967944U publication Critical patent/JPS5967944U/ja
Application granted granted Critical
Publication of JPS6233329Y2 publication Critical patent/JPS6233329Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は従来の樹脂封止型半導体装置の一例
を示す実装時の断面図及び樹脂モールド成形時の金型断
面図、第３図は本考案の一実施例を示す断面図、第４図
及び第５図は第３図の半導体装置の樹脂モールド成形時
の金型断面図及び放熱板成形時の概略断面図である。 ２０・・・・・・固着基板、２４・・・・・・絶縁膜、
２５・・・・・・外装樹脂材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板兼用の固着基板の素子を固着しない裏面に予め絶
    縁膜を被着形成させ、且つ、前記絶縁膜の周縁部上まで
    外装樹脂材をモールド成形して、絶縁膜の中央部を露出
    させたことを特徴とする樹脂封止型半導体装置。
JP1982163787U 1982-10-27 1982-10-27 樹脂封止型半導体装置 Granted JPS5967944U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982163787U JPS5967944U (ja) 1982-10-27 1982-10-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982163787U JPS5967944U (ja) 1982-10-27 1982-10-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5967944U true JPS5967944U (ja) 1984-05-08
JPS6233329Y2 JPS6233329Y2 (ja) 1987-08-26

Family

ID=30359270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982163787U Granted JPS5967944U (ja) 1982-10-27 1982-10-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5967944U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086342A (ja) * 2004-09-16 2006-03-30 Toyota Motor Corp 樹脂封入型半導体装置
JP2013243323A (ja) * 2012-05-23 2013-12-05 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
WO2015037072A1 (ja) * 2013-09-11 2015-03-19 三菱電機株式会社 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086342A (ja) * 2004-09-16 2006-03-30 Toyota Motor Corp 樹脂封入型半導体装置
JP2013243323A (ja) * 2012-05-23 2013-12-05 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
WO2015037072A1 (ja) * 2013-09-11 2015-03-19 三菱電機株式会社 半導体装置及びその製造方法
JPWO2015037072A1 (ja) * 2013-09-11 2017-03-02 三菱電機株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6233329Y2 (ja) 1987-08-26

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