JPS59106113A - コンデンサ−用絶縁体の製造方法 - Google Patents

コンデンサ−用絶縁体の製造方法

Info

Publication number
JPS59106113A
JPS59106113A JP57217457A JP21745782A JPS59106113A JP S59106113 A JPS59106113 A JP S59106113A JP 57217457 A JP57217457 A JP 57217457A JP 21745782 A JP21745782 A JP 21745782A JP S59106113 A JPS59106113 A JP S59106113A
Authority
JP
Japan
Prior art keywords
insulator
molds
capacitor
mold
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57217457A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317326B2 (enrdf_load_stackoverflow
Inventor
川崎　勇力
泰弘 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP57217457A priority Critical patent/JPS59106113A/ja
Publication of JPS59106113A publication Critical patent/JPS59106113A/ja
Publication of JPS6317326B2 publication Critical patent/JPS6317326B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57217457A 1982-12-11 1982-12-11 コンデンサ−用絶縁体の製造方法 Granted JPS59106113A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57217457A JPS59106113A (ja) 1982-12-11 1982-12-11 コンデンサ−用絶縁体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57217457A JPS59106113A (ja) 1982-12-11 1982-12-11 コンデンサ−用絶縁体の製造方法

Publications (2)

Publication Number Publication Date
JPS59106113A true JPS59106113A (ja) 1984-06-19
JPS6317326B2 JPS6317326B2 (enrdf_load_stackoverflow) 1988-04-13

Family

ID=16704524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57217457A Granted JPS59106113A (ja) 1982-12-11 1982-12-11 コンデンサ−用絶縁体の製造方法

Country Status (1)

Country Link
JP (1) JPS59106113A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6317326B2 (enrdf_load_stackoverflow) 1988-04-13

Similar Documents

Publication Publication Date Title
CN112643962A (zh) 一种手机保护套的注塑工艺
JPS59106113A (ja) コンデンサ−用絶縁体の製造方法
JPS59107508A (ja) コンデンサ−用絶縁体の成形金型
JP2003031434A (ja) チップインダクタ部品の製造方法
CN110355933A (zh) Pcb板封装外壳的成型方法
CN221112625U (zh) 一种同时注塑两排端子的模具组件
JPS5881137A (ja) 合成樹脂製品の成形方法
JPH01170088A (ja) モールド回路基板の製造方法
CN215359593U (zh) 一种用于夹盘生产的成型模具
CN118712139A (zh) 一种车规级igbt结构件及制备方法和电极子单元
JPS59143334A (ja) 半導体装置の製造方法
JPS5981126A (ja) レジンモ−ルド製品の製造方法
CN201070821Y (zh) 四板模模具结构
JP2742638B2 (ja) 半導体装置用の樹脂封止金型
JPH02135765A (ja) 半導体装置用リードフレーム
JPH0153501B2 (enrdf_load_stackoverflow)
JPS63162206A (ja) 樹脂成形装置
JP3368768B2 (ja) 樹脂成形品の製法およびそのための型構造
JP3070795B2 (ja) 半導体装置用箱形樹脂成形体の成形方法およびそれによって成形された箱形樹脂成形体
JPS587619U (ja) 成形装置
JP2000114292A (ja) 半導体装置およびその製造方法
JPH0812877B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0739230Y2 (ja) トランスファ成形用金型
CN116344443A (zh) 一种封装模具、封装方法以及封装结构
JPH023299B2 (enrdf_load_stackoverflow)