JPS59104197A - 過マンガン酸塩および苛性処理溶液を使用してプリント回路板の孔を浄化する加工法 - Google Patents
過マンガン酸塩および苛性処理溶液を使用してプリント回路板の孔を浄化する加工法Info
- Publication number
- JPS59104197A JPS59104197A JP58170562A JP17056283A JPS59104197A JP S59104197 A JPS59104197 A JP S59104197A JP 58170562 A JP58170562 A JP 58170562A JP 17056283 A JP17056283 A JP 17056283A JP S59104197 A JPS59104197 A JP S59104197A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solution
- permanganate
- resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 55
- 239000003518 caustics Substances 0.000 title 1
- 238000003754 machining Methods 0.000 title 1
- 239000000243 solution Substances 0.000 claims description 125
- 239000011347 resin Substances 0.000 claims description 75
- 229920005989 resin Polymers 0.000 claims description 75
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical group [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 66
- 238000003672 processing method Methods 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 230000008569 process Effects 0.000 claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 34
- 239000011148 porous material Substances 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 31
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 27
- 238000011109 contamination Methods 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 20
- 239000004642 Polyimide Substances 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 16
- 238000001465 metallisation Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 14
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- 238000004140 cleaning Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000454 electroless metal deposition Methods 0.000 claims description 12
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000006386 neutralization reaction Methods 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 4
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical compound [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 claims description 2
- 239000000314 lubricant Substances 0.000 claims description 2
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 claims description 2
- 239000010970 precious metal Substances 0.000 claims 2
- 241000180579 Arca Species 0.000 claims 1
- 206010070834 Sensitisation Diseases 0.000 claims 1
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- 239000011159 matrix material Substances 0.000 claims 1
- 230000008313 sensitization Effects 0.000 claims 1
- SFKTYEXKZXBQRQ-UHFFFAOYSA-J thorium(4+);tetrahydroxide Chemical group [OH-].[OH-].[OH-].[OH-].[Th+4] SFKTYEXKZXBQRQ-UHFFFAOYSA-J 0.000 claims 1
- 239000010410 layer Substances 0.000 description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 62
- 239000010949 copper Substances 0.000 description 61
- 229910052802 copper Inorganic materials 0.000 description 58
- 229910052748 manganese Inorganic materials 0.000 description 25
- 239000011572 manganese Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- 238000007747 plating Methods 0.000 description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 239000011521 glass Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000012545 processing Methods 0.000 description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 230000007547 defect Effects 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 238000007772 electroless plating Methods 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000003472 neutralizing effect Effects 0.000 description 9
- 235000011121 sodium hydroxide Nutrition 0.000 description 9
- 238000005553 drilling Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 239000002689 soil Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000003197 catalytic effect Effects 0.000 description 7
- -1 polyethylene Polymers 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 239000000080 wetting agent Substances 0.000 description 6
- 238000001994 activation Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000012286 potassium permanganate Substances 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000005340 laminated glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 238000010899 nucleation Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000012260 resinous material Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- UWPPADMWQVNQFC-UHFFFAOYSA-J tetrachlorostannane;hydrochloride Chemical compound Cl.Cl[Sn](Cl)(Cl)Cl UWPPADMWQVNQFC-UHFFFAOYSA-J 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
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- 230000000712 assembly Effects 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
- 239000012267 brine Substances 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000000701 coagulant Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000001687 destabilization Effects 0.000 description 2
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
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- 238000003918 potentiometric titration Methods 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- XXSPKSHUSWQAIZ-UHFFFAOYSA-L 36026-88-7 Chemical compound [Ni+2].[O-]P=O.[O-]P=O XXSPKSHUSWQAIZ-UHFFFAOYSA-L 0.000 description 1
- OQVYMXCRDHDTTH-UHFFFAOYSA-N 4-(diethoxyphosphorylmethyl)-2-[4-(diethoxyphosphorylmethyl)pyridin-2-yl]pyridine Chemical compound CCOP(=O)(OCC)CC1=CC=NC(C=2N=CC=C(CP(=O)(OCC)OCC)C=2)=C1 OQVYMXCRDHDTTH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 241001643623 Enteles Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical class [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
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- 239000004280 Sodium formate Substances 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
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- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910001422 barium ion Inorganic materials 0.000 description 1
- ZZCNKSMCIZCVDR-UHFFFAOYSA-N barium(2+);dioxido(dioxo)manganese Chemical class [Ba+2].[O-][Mn]([O-])(=O)=O ZZCNKSMCIZCVDR-UHFFFAOYSA-N 0.000 description 1
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- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
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- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
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- 238000009472 formulation Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
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- SUPUVLWGKPVHBQ-UHFFFAOYSA-M lithium sulfite Chemical compound [Li+].OS([O-])=O SUPUVLWGKPVHBQ-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- CVMIVKAWUQZOBP-UHFFFAOYSA-L manganic acid Chemical compound O[Mn](O)(=O)=O CVMIVKAWUQZOBP-UHFFFAOYSA-L 0.000 description 1
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- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- ZMLDXWLZKKZVSS-UHFFFAOYSA-N palladium tin Chemical compound [Pd].[Sn] ZMLDXWLZKKZVSS-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 239000009719 polyimide resin Substances 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000001476 sodium potassium tartrate Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003892 tartrate salts Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Detergent Compositions (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US443160 | 1982-11-19 | ||
| US06/443,160 US4425380A (en) | 1982-11-19 | 1982-11-19 | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59104197A true JPS59104197A (ja) | 1984-06-15 |
| JPS6366079B2 JPS6366079B2 (en, 2012) | 1988-12-19 |
Family
ID=23759658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58170562A Granted JPS59104197A (ja) | 1982-11-19 | 1983-09-14 | 過マンガン酸塩および苛性処理溶液を使用してプリント回路板の孔を浄化する加工法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4425380A (en, 2012) |
| EP (1) | EP0109920B1 (en, 2012) |
| JP (1) | JPS59104197A (en, 2012) |
| AT (1) | ATE40627T1 (en, 2012) |
| AU (1) | AU1966883A (en, 2012) |
| CH (1) | CH662692A5 (en, 2012) |
| DE (2) | DE3341431C3 (en, 2012) |
| FR (1) | FR2536623B1 (en, 2012) |
| GB (1) | GB2134140B (en, 2012) |
| IL (1) | IL70040A (en, 2012) |
| ZA (1) | ZA837099B (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62287690A (ja) * | 1986-06-06 | 1987-12-14 | 日立エーアイシー株式会社 | 印刷配線板の製造方法 |
| JPS6338588A (ja) * | 1986-08-01 | 1988-02-19 | Seiken Kagaku Kk | アルカリ性剥離液 |
| CN112087872A (zh) * | 2020-09-30 | 2020-12-15 | 生益电子股份有限公司 | 一种混压pcb的除胶工艺 |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4597988A (en) * | 1983-06-06 | 1986-07-01 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
| US4756930A (en) * | 1983-06-06 | 1988-07-12 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
| US4515829A (en) * | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
| US4601999A (en) * | 1983-11-09 | 1986-07-22 | William B. Retallick | Metal support for a catalyst |
| US4592852A (en) * | 1984-06-07 | 1986-06-03 | Enthone, Incorporated | Composition and process for treating plastics with alkaline permanganate solutions |
| US4820548A (en) * | 1984-06-07 | 1989-04-11 | Enthone, Incorporated | Three step process for treating plastics with alkaline permanganate solutions |
| US4629636A (en) * | 1984-06-07 | 1986-12-16 | Enthone, Incorporated | Process for treating plastics with alkaline permanganate solutions |
| US4948630A (en) * | 1984-06-07 | 1990-08-14 | Enthone, Inc. | Three step process for treating plastics with alkaline permanganate solutions |
| US4601784A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
| US4601783A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards |
| GB8613960D0 (en) * | 1986-06-09 | 1986-07-16 | Omi International Gb Ltd | Treating laminates |
| EP0251923A3 (en) * | 1986-07-01 | 1990-06-06 | Digital Equipment Corporation | On-line filtration of potassium permanganate solutions |
| US4885036A (en) * | 1986-07-01 | 1989-12-05 | Digital Equipment Corporation | On-line filtration of potassium permanganate |
| US4749552A (en) * | 1986-08-06 | 1988-06-07 | Ebara Densan Ltd. | Automatic titration analysis apparatus |
| US4976990A (en) * | 1986-09-30 | 1990-12-11 | Macdermid, Incorporated | Process for metallizing non-conductive substrates |
| DE3638630A1 (de) * | 1986-11-11 | 1988-05-26 | Schering Ag | Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten |
| US4940510A (en) * | 1987-06-01 | 1990-07-10 | Digital Equipment Corporation | Method of etching in the presence of positive photoresist |
| US4913931A (en) * | 1987-08-18 | 1990-04-03 | Frederickson Jeffrey W | Method and solution for the prevention of smear in the manufacture of printed circuit boards |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
| JPH0719959B2 (ja) * | 1988-04-25 | 1995-03-06 | マクダーミツド インコーポレーテツド | 金属被覆化用プリント回路通し孔の製法及び組成物 |
| US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
| US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
| IT1232863B (it) * | 1989-06-27 | 1992-03-05 | Alfachimici Spa | Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione |
| US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
| US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
| US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
| US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
| US5062930A (en) * | 1990-07-24 | 1991-11-05 | Shipley Company Inc. | Electrolytic permanganate generation |
| US6242400B1 (en) | 1990-11-05 | 2001-06-05 | Ekc Technology, Inc. | Method of stripping resists from substrates using hydroxylamine and alkanolamine |
| US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| US6000411A (en) * | 1990-11-05 | 1999-12-14 | Ekc Technology, Inc. | Cleaning compositions for removing etching residue and method of using |
| US5198096A (en) * | 1990-11-28 | 1993-03-30 | General Electric Company | Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5229169A (en) * | 1992-01-21 | 1993-07-20 | General Electric Company | Adhesion of electroless coatings to resinous articles by treatment with permanganate |
| US5290597A (en) * | 1992-04-27 | 1994-03-01 | General Electric Company | Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon |
| US5311660A (en) * | 1993-02-10 | 1994-05-17 | International Business Machines Corporation | Methyl chloroform-free desmear process in additive circuitization |
| US6303181B1 (en) | 1993-05-17 | 2001-10-16 | Electrochemicals Inc. | Direct metallization process employing a cationic conditioner and a binder |
| US6710259B2 (en) * | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
| US6171468B1 (en) | 1993-05-17 | 2001-01-09 | Electrochemicals Inc. | Direct metallization process |
| US5374338A (en) * | 1993-10-27 | 1994-12-20 | International Business Machines Corporation | Selective electroetch of copper and other metals |
| US5567329A (en) * | 1995-01-27 | 1996-10-22 | Martin Marietta Corporation | Method and system for fabricating a multilayer laminate for a printed wiring board, and a printed wiring board formed thereby |
| US5595668A (en) * | 1995-04-05 | 1997-01-21 | Electro-Films Incorporated | Laser slag removal |
| US5998237A (en) * | 1996-09-17 | 1999-12-07 | Enthone-Omi, Inc. | Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion |
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| US6139762A (en) * | 1998-12-11 | 2000-10-31 | Shipley Company, L.L.C. | Methods for manufacture of electronic devices |
| EP1138804A3 (de) * | 2000-03-27 | 2003-06-25 | Infineon Technologies AG | Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu |
| US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| US6454954B1 (en) * | 2000-05-22 | 2002-09-24 | Shipley Company, L.L.C. | Desmear etchant and use thereof |
| US20050238812A1 (en) * | 2002-06-04 | 2005-10-27 | Bhangale Sunil M | Method for electroless metalisation of polymer substrate |
| US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
| US7364666B2 (en) * | 2004-12-21 | 2008-04-29 | 3M Innovative Properties Company | Flexible circuits and method of making same |
| JP5022576B2 (ja) * | 2005-07-08 | 2012-09-12 | 株式会社ジャパンディスプレイイースト | 表示パネルおよび表示装置 |
| KR100663266B1 (ko) * | 2005-07-11 | 2007-01-02 | 삼성전기주식회사 | 미세 배선의 형성방법 및 도전성 기판 |
| JP4452222B2 (ja) * | 2005-09-07 | 2010-04-21 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
| KR101277875B1 (ko) * | 2006-10-12 | 2013-06-21 | 엘지디스플레이 주식회사 | 사용자 위치 감응형 액정 표시 장치 및 그 구동 방법 |
| US7858146B2 (en) * | 2007-06-29 | 2010-12-28 | Rohm And Haas Electronic Materials Llc | Method of electrolessly depositing metal on the walls of through-holes |
| DE102007041991A1 (de) * | 2007-09-05 | 2009-03-12 | Fülling, Rainer, Dr. | Verfahren zur Reinigung von Substraten durch Oxidationsmittel und Reduktionsmittel sowie die Verwendung von Oxidationsmitteln zur Oxidation von extrazellulären polymeren Substanzen |
| US8247050B2 (en) | 2009-06-02 | 2012-08-21 | Integran Technologies, Inc. | Metal-coated polymer article of high durability and vacuum and/or pressure integrity |
| US8906515B2 (en) * | 2009-06-02 | 2014-12-09 | Integran Technologies, Inc. | Metal-clad polymer article |
| US8394507B2 (en) | 2009-06-02 | 2013-03-12 | Integran Technologies, Inc. | Metal-clad polymer article |
| US8741392B2 (en) * | 2009-06-02 | 2014-06-03 | Integran Technologies, Inc. | Anodically assisted chemical etching of conductive polymers and polymer composites |
| US9004240B2 (en) | 2013-02-27 | 2015-04-14 | Integran Technologies Inc. | Friction liner |
| JP6350064B2 (ja) * | 2013-10-09 | 2018-07-04 | 日立化成株式会社 | 多層配線基板の製造方法 |
| US10381322B1 (en) | 2018-04-23 | 2019-08-13 | Sandisk Technologies Llc | Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same |
| US10879260B2 (en) | 2019-02-28 | 2020-12-29 | Sandisk Technologies Llc | Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same |
| CN116744562A (zh) * | 2023-07-20 | 2023-09-12 | 清远市富盈电子有限公司 | 一种高频高速pcb的加工方法及其制成的pcb板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388164A (en) * | 1977-01-12 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA812207A (en) | 1969-05-06 | Hooker Chemical Corporation | Method of treating metal surfaces | |
| US3141797A (en) | 1961-09-07 | 1964-07-21 | Lubrizol Corp | Phosphating process |
| US3276927A (en) | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Smoothing of mechanically drilled holes |
| US3276106A (en) | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Preparation of multilayer boards for electrical connections between layers |
| US3425947A (en) | 1966-05-02 | 1969-02-04 | Hooker Chemical Corp | Method of treating metal surfaces |
| US3515649A (en) | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
| US3647699A (en) | 1967-12-22 | 1972-03-07 | Gen Motors Corp | Surface conditioner composition for abs resin |
| US3652417A (en) | 1968-03-01 | 1972-03-28 | Carus Corp | Stabilization of alkali metal permanganate in alkaline solution |
| US3652351A (en) | 1970-05-13 | 1972-03-28 | Carus Corp | Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions |
| US3689303A (en) | 1970-12-21 | 1972-09-05 | Crown City Plating Co | Process for electroless plating of abs resins |
| DE2239908C3 (de) * | 1972-08-14 | 1979-12-13 | Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel | Basismaterial zur Herstellung gedruckter Schaltungen |
| US4042729A (en) | 1972-12-13 | 1977-08-16 | Kollmorgen Technologies Corporation | Process for the activation of resinous bodies for adherent metallization |
| US3962496A (en) | 1974-11-07 | 1976-06-08 | Photocircuits Division Of Kollmorgen | Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization |
| DK154600C (da) * | 1974-11-07 | 1989-04-17 | Kollmorgen Tech Corp | Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis. |
| US4054693A (en) | 1974-11-07 | 1977-10-18 | Kollmorgen Technologies Corporation | Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition |
| DK485275A (da) * | 1974-11-07 | 1976-05-08 | Kollmorgen Corp | Fremgangsmade og blanding til fremstilling af emner med et fast vedheftende metallag pa harpiksagtige overflader |
-
1982
- 1982-11-19 US US06/443,160 patent/US4425380A/en not_active Expired - Lifetime
-
1983
- 1983-09-14 JP JP58170562A patent/JPS59104197A/ja active Granted
- 1983-09-23 ZA ZA837099A patent/ZA837099B/xx unknown
- 1983-09-28 AU AU19668/83A patent/AU1966883A/en not_active Abandoned
- 1983-10-24 IL IL70040A patent/IL70040A/xx unknown
- 1983-11-01 GB GB08329133A patent/GB2134140B/en not_active Expired
- 1983-11-11 DE DE3341431A patent/DE3341431C3/de not_active Expired - Lifetime
- 1983-11-11 AT AT83730109T patent/ATE40627T1/de not_active IP Right Cessation
- 1983-11-11 EP EP83730109A patent/EP0109920B1/de not_active Expired
- 1983-11-11 DE DE8383730109T patent/DE3379153D1/de not_active Expired
- 1983-11-17 FR FR8318290A patent/FR2536623B1/fr not_active Expired
- 1983-11-17 CH CH6221/83A patent/CH662692A5/de not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388164A (en) * | 1977-01-12 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62287690A (ja) * | 1986-06-06 | 1987-12-14 | 日立エーアイシー株式会社 | 印刷配線板の製造方法 |
| JPS6338588A (ja) * | 1986-08-01 | 1988-02-19 | Seiken Kagaku Kk | アルカリ性剥離液 |
| CN112087872A (zh) * | 2020-09-30 | 2020-12-15 | 生益电子股份有限公司 | 一种混压pcb的除胶工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0109920A3 (en) | 1985-09-18 |
| IL70040A0 (en) | 1984-01-31 |
| JPS6366079B2 (en, 2012) | 1988-12-19 |
| DE3341431C2 (en, 2012) | 1989-10-05 |
| CH662692A5 (de) | 1987-10-15 |
| GB2134140A (en) | 1984-08-08 |
| DE3341431C3 (de) | 1995-06-01 |
| ATE40627T1 (de) | 1989-02-15 |
| DE3379153D1 (en) | 1989-03-09 |
| GB2134140B (en) | 1986-11-26 |
| FR2536623A1 (fr) | 1984-05-25 |
| AU1966883A (en) | 1984-05-24 |
| EP0109920B1 (de) | 1989-02-01 |
| IL70040A (en) | 1988-08-31 |
| ZA837099B (en) | 1984-11-28 |
| GB8329133D0 (en) | 1983-12-07 |
| DE3341431A1 (de) | 1984-05-24 |
| FR2536623B1 (fr) | 1987-03-20 |
| EP0109920A2 (de) | 1984-05-30 |
| US4425380A (en) | 1984-01-10 |
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