DK154600C - Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis. - Google Patents

Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis.

Info

Publication number
DK154600C
DK154600C DK485175A DK485175A DK154600C DK 154600 C DK154600 C DK 154600C DK 485175 A DK485175 A DK 485175A DK 485175 A DK485175 A DK 485175A DK 154600 C DK154600 C DK 154600C
Authority
DK
Denmark
Prior art keywords
plate
procedure
treatment
form dust
dust base
Prior art date
Application number
DK485175A
Other languages
English (en)
Other versions
DK485175A (da
DK154600B (da
Inventor
Joseph Polichette
Edward Leech
John Branigan
Joseph Hammond
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK485175A publication Critical patent/DK485175A/da
Publication of DK154600B publication Critical patent/DK154600B/da
Application granted granted Critical
Publication of DK154600C publication Critical patent/DK154600C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
DK485175A 1974-11-07 1975-10-28 Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis. DK154600C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52189074A 1974-11-07 1974-11-07
US52189074 1974-11-07

Publications (3)

Publication Number Publication Date
DK485175A DK485175A (da) 1976-05-08
DK154600B DK154600B (da) 1988-11-28
DK154600C true DK154600C (da) 1989-04-17

Family

ID=24078571

Family Applications (1)

Application Number Title Priority Date Filing Date
DK485175A DK154600C (da) 1974-11-07 1975-10-28 Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis.

Country Status (13)

Country Link
JP (1) JPS595616B2 (da)
AT (1) AT346957B (da)
AU (1) AU500570B2 (da)
CH (1) CH619823A5 (da)
DE (1) DE2550598C3 (da)
DK (1) DK154600C (da)
ES (1) ES442440A1 (da)
FR (1) FR2290822A1 (da)
GB (1) GB1479556A (da)
IT (1) IT1052168B (da)
NL (1) NL180684C (da)
SE (1) SE447045B (da)
ZA (1) ZA756783B (da)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110415C2 (de) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
US4425380A (en) 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
JPS60154416U (ja) * 1984-03-23 1985-10-15 三国　慶耿 除雪機の投雪シユ−ト
US4820548A (en) * 1984-06-07 1989-04-11 Enthone, Incorporated Three step process for treating plastics with alkaline permanganate solutions
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
AT1147U1 (de) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik Schliesszylinder und bzw. oder flachschlüssel
TR200000962T2 (tr) 1997-09-01 2001-07-23 Maschinenfabrik Rieter Ag Ayarlı çekme tertibatı.
JP5330474B2 (ja) * 2011-09-22 2013-10-30 上村工業株式会社 デスミア液及びデスミア処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276927A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Smoothing of mechanically drilled holes
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3652351A (en) * 1970-05-13 1972-03-28 Carus Corp Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung

Also Published As

Publication number Publication date
FR2290822A1 (fr) 1976-06-04
NL180684C (nl) 1987-04-01
JPS5170268A (da) 1976-06-17
DE2550598B2 (de) 1978-07-13
DK485175A (da) 1976-05-08
AT346957B (de) 1978-12-11
NL7512992A (nl) 1976-05-11
SE447045B (sv) 1986-10-20
DE2550598A1 (de) 1976-05-13
NL180684B (nl) 1986-11-03
SE7512335L (sv) 1976-05-10
CH619823A5 (en) 1980-10-15
ES442440A1 (es) 1977-04-01
AU8632875A (en) 1977-05-12
JPS595616B2 (ja) 1984-02-06
DE2550598C3 (de) 1979-03-08
ATA845775A (de) 1978-04-15
DK154600B (da) 1988-11-28
FR2290822B1 (da) 1978-05-12
GB1479556A (en) 1977-07-13
IT1052168B (it) 1981-06-20
ZA756783B (en) 1976-10-27
AU500570B2 (en) 1979-05-24

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Legal Events

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