AT346957B - Verfahren zur lochwandmetallisierung - Google Patents

Verfahren zur lochwandmetallisierung

Info

Publication number
AT346957B
AT346957B AT845775A AT845775A AT346957B AT 346957 B AT346957 B AT 346957B AT 845775 A AT845775 A AT 845775A AT 845775 A AT845775 A AT 845775A AT 346957 B AT346957 B AT 346957B
Authority
AT
Austria
Prior art keywords
metalization
hole wall
hole
wall
wall metalization
Prior art date
Application number
AT845775A
Other languages
English (en)
Other versions
ATA845775A (de
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Publication of ATA845775A publication Critical patent/ATA845775A/de
Application granted granted Critical
Publication of AT346957B publication Critical patent/AT346957B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
AT845775A 1974-11-07 1975-11-06 Verfahren zur lochwandmetallisierung AT346957B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52189074A 1974-11-07 1974-11-07

Publications (2)

Publication Number Publication Date
ATA845775A ATA845775A (de) 1978-04-15
AT346957B true AT346957B (de) 1978-12-11

Family

ID=24078571

Family Applications (1)

Application Number Title Priority Date Filing Date
AT845775A AT346957B (de) 1974-11-07 1975-11-06 Verfahren zur lochwandmetallisierung

Country Status (13)

Country Link
JP (1) JPS595616B2 (de)
AT (1) AT346957B (de)
AU (1) AU500570B2 (de)
CH (1) CH619823A5 (de)
DE (1) DE2550598C3 (de)
DK (1) DK154600C (de)
ES (1) ES442440A1 (de)
FR (1) FR2290822A1 (de)
GB (1) GB1479556A (de)
IT (1) IT1052168B (de)
NL (1) NL180684C (de)
SE (1) SE447045B (de)
ZA (1) ZA756783B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060805A1 (de) * 1981-03-18 1982-09-22 Kollmorgen Technologies Corporation Herstellverfahren für und nach diesem Verfahren hergestellte Leiterplatten
AT1147U1 (de) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik Schliesszylinder und bzw. oder flachschlüssel

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
US4425380A (en) 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
JPS60154416U (ja) * 1984-03-23 1985-10-15 三国　慶耿 除雪機の投雪シユ−ト
US4820548A (en) * 1984-06-07 1989-04-11 Enthone, Incorporated Three step process for treating plastics with alkaline permanganate solutions
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
TR200000962T2 (tr) 1997-09-01 2001-07-23 Maschinenfabrik Rieter Ag Ayarlı çekme tertibatı.
JP5330474B2 (ja) * 2011-09-22 2013-10-30 上村工業株式会社 デスミア液及びデスミア処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276927A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Smoothing of mechanically drilled holes
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3652351A (en) * 1970-05-13 1972-03-28 Carus Corp Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060805A1 (de) * 1981-03-18 1982-09-22 Kollmorgen Technologies Corporation Herstellverfahren für und nach diesem Verfahren hergestellte Leiterplatten
AT1147U1 (de) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik Schliesszylinder und bzw. oder flachschlüssel

Also Published As

Publication number Publication date
FR2290822A1 (fr) 1976-06-04
NL180684C (nl) 1987-04-01
JPS5170268A (de) 1976-06-17
DE2550598B2 (de) 1978-07-13
DK485175A (da) 1976-05-08
NL7512992A (nl) 1976-05-11
SE447045B (sv) 1986-10-20
DE2550598A1 (de) 1976-05-13
NL180684B (nl) 1986-11-03
SE7512335L (sv) 1976-05-10
CH619823A5 (en) 1980-10-15
ES442440A1 (es) 1977-04-01
AU8632875A (en) 1977-05-12
DK154600C (da) 1989-04-17
JPS595616B2 (ja) 1984-02-06
DE2550598C3 (de) 1979-03-08
ATA845775A (de) 1978-04-15
DK154600B (da) 1988-11-28
FR2290822B1 (de) 1978-05-12
GB1479556A (en) 1977-07-13
IT1052168B (it) 1981-06-20
ZA756783B (en) 1976-10-27
AU500570B2 (en) 1979-05-24

Similar Documents

Publication Publication Date Title
BG26398A3 (bg) Метод за получаване на n-фосфонометилглицин
BG26389A3 (bg) Метод за получаване на заместени пурини
BG26516A3 (bg) Метод за получаване на n-фосфонометил-глицин
AT346957B (de) Verfahren zur lochwandmetallisierung
AT344883B (de) Verfahren zur gewinnung von intravenoesvertraeglichem gammaglobulin
AT341637B (de) Verfahren zur losungsmittelentparaffinierung
DD130661A5 (de) Verfahren zur herstellung von aminoglycosid-antibiotica
DD130150A5 (de) Verfahren fuer die darstellung von antibakteriellen aminoglycisidderivaten
BG23541A3 (bg) Метод за получаване на пиридобензодиазепинони
AT338971B (de) Verfahren zur herstellung von moenomycin
BG27230A3 (bg) Метод за получаване на субституирани индоленини
AT351672B (de) Verfahren zur gewinnung von iv-vertraeglichen gammaglobulinen
AT310941B (de) Verfahren zur Isolierung eines fibrinstabilisierenden Faktors
ATA233375A (de) Verfahren u. vorrichtung zur kontinuierlichen grafitierung
BG27227A3 (bg) Метод за получаване на 11-дозокси-15-заместени омега- пентанорпростагландини
BE829345A (nl) Werkwijze voor de winning van ortho-fenyleenol
AT342087B (de) Verfahren zur herstellung von dicyan
BE834246A (fr) Inhibiteurs de corrosion
AT331608B (de) Verfahren zur phosphatierung von metallen
ATA668674A (de) Verfahren zur herstellung von fertigteilmauer- pfeilern
BG26381A3 (bg) Метод за получаване на заместени фенилпиперазини
BG26393A3 (bg) Метод за получаване на деацетоксицефалоспорини
BG25998A3 (bg) Метод за получаване на 3-цефем-3-сулфонатни естерни съединения
AT338748B (de) Verfahren zur herstellung von acetoxybutanalen
AT310940B (de) Verfahren zur Isolierung eines fibrinstabilisierenden Faktors

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee