ZA756783B - Method for cleaning holes in resincontaining materials - Google Patents

Method for cleaning holes in resincontaining materials

Info

Publication number
ZA756783B
ZA756783B ZA00756783A ZA756783A ZA756783B ZA 756783 B ZA756783 B ZA 756783B ZA 00756783 A ZA00756783 A ZA 00756783A ZA 756783 A ZA756783 A ZA 756783A ZA 756783 B ZA756783 B ZA 756783B
Authority
ZA
South Africa
Prior art keywords
resincontaining
materials
cleaning holes
cleaning
holes
Prior art date
Application number
ZA00756783A
Other languages
English (en)
Inventor
J Polichette
E Leech
J Branigan
J Hammond
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of ZA756783B publication Critical patent/ZA756783B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0055After-treatment, e.g. cleaning or desmearing of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793Aqueous alkaline solution, e.g. for cleaning or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
ZA00756783A 1974-11-07 1975-10-28 Method for cleaning holes in resincontaining materials ZA756783B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52189074A 1974-11-07 1974-11-07

Publications (1)

Publication Number Publication Date
ZA756783B true ZA756783B (en) 1976-10-27

Family

ID=24078571

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00756783A ZA756783B (en) 1974-11-07 1975-10-28 Method for cleaning holes in resincontaining materials

Country Status (13)

Country Link
JP (1) JPS595616B2 (xx)
AT (1) AT346957B (xx)
AU (1) AU500570B2 (xx)
CH (1) CH619823A5 (xx)
DE (1) DE2550598C3 (xx)
DK (1) DK154600C (xx)
ES (1) ES442440A1 (xx)
FR (1) FR2290822A1 (xx)
GB (1) GB1479556A (xx)
IT (1) IT1052168B (xx)
NL (1) NL180684C (xx)
SE (1) SE447045B (xx)
ZA (1) ZA756783B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110415C2 (de) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
JPS60154416U (ja) * 1984-03-23 1985-10-15 三国 慶耿 除雪機の投雪シユ−ト
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
US4820548A (en) * 1984-06-07 1989-04-11 Enthone, Incorporated Three step process for treating plastics with alkaline permanganate solutions
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
AT1147U1 (de) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik Schliesszylinder und bzw. oder flachschlüssel
WO1999011847A1 (de) 1997-09-01 1999-03-11 Maschinenfabrik Rieter Ag Reguliertes streckwerk
JP5330474B2 (ja) * 2011-09-22 2013-10-30 上村工業株式会社 デスミア液及びデスミア処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276927A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Smoothing of mechanically drilled holes
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3652351A (en) * 1970-05-13 1972-03-28 Carus Corp Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung

Also Published As

Publication number Publication date
AU500570B2 (en) 1979-05-24
ES442440A1 (es) 1977-04-01
SE447045B (sv) 1986-10-20
NL180684C (nl) 1987-04-01
FR2290822A1 (fr) 1976-06-04
DK154600C (da) 1989-04-17
ATA845775A (de) 1978-04-15
AT346957B (de) 1978-12-11
NL180684B (nl) 1986-11-03
IT1052168B (it) 1981-06-20
CH619823A5 (en) 1980-10-15
NL7512992A (nl) 1976-05-11
DE2550598A1 (de) 1976-05-13
FR2290822B1 (xx) 1978-05-12
DE2550598B2 (de) 1978-07-13
DK485175A (da) 1976-05-08
DE2550598C3 (de) 1979-03-08
DK154600B (da) 1988-11-28
JPS5170268A (xx) 1976-06-17
JPS595616B2 (ja) 1984-02-06
AU8632875A (en) 1977-05-12
GB1479556A (en) 1977-07-13
SE7512335L (sv) 1976-05-08

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