JPS5910240A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5910240A
JPS5910240A JP57119306A JP11930682A JPS5910240A JP S5910240 A JPS5910240 A JP S5910240A JP 57119306 A JP57119306 A JP 57119306A JP 11930682 A JP11930682 A JP 11930682A JP S5910240 A JPS5910240 A JP S5910240A
Authority
JP
Japan
Prior art keywords
bonding pads
electrodes
external lead
metal wiring
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57119306A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322614B2 (enExample
Inventor
Takashi Miyamoto
隆 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57119306A priority Critical patent/JPS5910240A/ja
Priority to US06/511,935 priority patent/US4608592A/en
Publication of JPS5910240A publication Critical patent/JPS5910240A/ja
Publication of JPS6322614B2 publication Critical patent/JPS6322614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP57119306A 1982-07-09 1982-07-09 半導体装置 Granted JPS5910240A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57119306A JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置
US06/511,935 US4608592A (en) 1982-07-09 1983-07-08 Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57119306A JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS5910240A true JPS5910240A (ja) 1984-01-19
JPS6322614B2 JPS6322614B2 (enExample) 1988-05-12

Family

ID=14758154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119306A Granted JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5910240A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972749A (ja) * 1982-10-19 1984-04-24 Nec Corp 半導体装置
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
JPS62112354A (ja) * 1985-11-12 1987-05-23 Nippon Telegr & Teleph Corp <Ntt> 集積回路パツケ−ジ
JPS63500692A (ja) * 1985-08-27 1988-03-10 ヒユ−ズ・エアクラフト・カンパニ− 超小形電子パッケ−ジ
JPH0497548A (ja) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd 半導体チップキャリア

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57211754A (en) * 1981-06-24 1982-12-25 Fujitsu Ltd Package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57211754A (en) * 1981-06-24 1982-12-25 Fujitsu Ltd Package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972749A (ja) * 1982-10-19 1984-04-24 Nec Corp 半導体装置
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
JPS63500692A (ja) * 1985-08-27 1988-03-10 ヒユ−ズ・エアクラフト・カンパニ− 超小形電子パッケ−ジ
JPS62112354A (ja) * 1985-11-12 1987-05-23 Nippon Telegr & Teleph Corp <Ntt> 集積回路パツケ−ジ
JPH0497548A (ja) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd 半導体チップキャリア

Also Published As

Publication number Publication date
JPS6322614B2 (enExample) 1988-05-12

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