JPS6322614B2 - - Google Patents

Info

Publication number
JPS6322614B2
JPS6322614B2 JP57119306A JP11930682A JPS6322614B2 JP S6322614 B2 JPS6322614 B2 JP S6322614B2 JP 57119306 A JP57119306 A JP 57119306A JP 11930682 A JP11930682 A JP 11930682A JP S6322614 B2 JPS6322614 B2 JP S6322614B2
Authority
JP
Japan
Prior art keywords
bonding pad
semiconductor element
semiconductor device
metal wiring
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57119306A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5910240A (ja
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57119306A priority Critical patent/JPS5910240A/ja
Priority to US06/511,935 priority patent/US4608592A/en
Publication of JPS5910240A publication Critical patent/JPS5910240A/ja
Publication of JPS6322614B2 publication Critical patent/JPS6322614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W70/635—
    • H10W70/657—
    • H10W72/00—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/552—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP57119306A 1982-07-09 1982-07-09 半導体装置 Granted JPS5910240A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57119306A JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置
US06/511,935 US4608592A (en) 1982-07-09 1983-07-08 Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57119306A JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS5910240A JPS5910240A (ja) 1984-01-19
JPS6322614B2 true JPS6322614B2 (enExample) 1988-05-12

Family

ID=14758154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119306A Granted JPS5910240A (ja) 1982-07-09 1982-07-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5910240A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972749A (ja) * 1982-10-19 1984-04-24 Nec Corp 半導体装置
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
JPS62112354A (ja) * 1985-11-12 1987-05-23 Nippon Telegr & Teleph Corp <Ntt> 集積回路パツケ−ジ
JPH0810734B2 (ja) * 1990-08-14 1996-01-31 松下電工株式会社 半導体チップキャリア

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57211754A (en) * 1981-06-24 1982-12-25 Fujitsu Ltd Package

Also Published As

Publication number Publication date
JPS5910240A (ja) 1984-01-19

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