JPS6322615B2 - - Google Patents
Info
- Publication number
- JPS6322615B2 JPS6322615B2 JP57183205A JP18320582A JPS6322615B2 JP S6322615 B2 JPS6322615 B2 JP S6322615B2 JP 57183205 A JP57183205 A JP 57183205A JP 18320582 A JP18320582 A JP 18320582A JP S6322615 B2 JPS6322615 B2 JP S6322615B2
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- semiconductor element
- semiconductor device
- ground
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/00—
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- H10W70/635—
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- H10W70/657—
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- H10W76/157—
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- H10W70/682—
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- H10W70/685—
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- H10W72/07551—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/5449—
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- H10W72/547—
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- H10W72/552—
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- H10W72/884—
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- H10W72/932—
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- H10W90/754—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57183205A JPS5972749A (ja) | 1982-10-19 | 1982-10-19 | 半導体装置 |
| US06/511,935 US4608592A (en) | 1982-07-09 | 1983-07-08 | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57183205A JPS5972749A (ja) | 1982-10-19 | 1982-10-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5972749A JPS5972749A (ja) | 1984-04-24 |
| JPS6322615B2 true JPS6322615B2 (enExample) | 1988-05-12 |
Family
ID=16131610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57183205A Granted JPS5972749A (ja) | 1982-07-09 | 1982-10-19 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972749A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3626151C3 (de) * | 1986-08-01 | 1995-06-14 | Siemens Ag | Spannungszuführungsanordnung für eine integrierte Halbleiterschaltung |
| US5206188A (en) * | 1990-01-31 | 1993-04-27 | Ibiden Co., Ltd. | Method of manufacturing a high lead count circuit board |
| JPH06103721B2 (ja) * | 1990-09-25 | 1994-12-14 | 松下電工株式会社 | 半導体チップキャリア |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336468A (en) * | 1976-09-17 | 1978-04-04 | Hitachi Ltd | Package for integrated circuit |
| JPS55165662A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
| JPS6016749B2 (ja) * | 1979-07-26 | 1985-04-27 | 富士通株式会社 | 集積回路用パツケ−ジ |
| JPS57211754A (en) * | 1981-06-24 | 1982-12-25 | Fujitsu Ltd | Package |
| JPS5910240A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置 |
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1982
- 1982-10-19 JP JP57183205A patent/JPS5972749A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5972749A (ja) | 1984-04-24 |
Similar Documents
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