JPS5878433A - 半導体装置の樹脂封止成形装置 - Google Patents

半導体装置の樹脂封止成形装置

Info

Publication number
JPS5878433A
JPS5878433A JP17740781A JP17740781A JPS5878433A JP S5878433 A JPS5878433 A JP S5878433A JP 17740781 A JP17740781 A JP 17740781A JP 17740781 A JP17740781 A JP 17740781A JP S5878433 A JPS5878433 A JP S5878433A
Authority
JP
Japan
Prior art keywords
resin
mold
sealing
drag
injection mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17740781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6248372B2 (enrdf_load_stackoverflow
Inventor
Seiji Takemura
竹村　誠次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17740781A priority Critical patent/JPS5878433A/ja
Publication of JPS5878433A publication Critical patent/JPS5878433A/ja
Publication of JPS6248372B2 publication Critical patent/JPS6248372B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP17740781A 1981-11-04 1981-11-04 半導体装置の樹脂封止成形装置 Granted JPS5878433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17740781A JPS5878433A (ja) 1981-11-04 1981-11-04 半導体装置の樹脂封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17740781A JPS5878433A (ja) 1981-11-04 1981-11-04 半導体装置の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPS5878433A true JPS5878433A (ja) 1983-05-12
JPS6248372B2 JPS6248372B2 (enrdf_load_stackoverflow) 1987-10-13

Family

ID=16030386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17740781A Granted JPS5878433A (ja) 1981-11-04 1981-11-04 半導体装置の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JPS5878433A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59207635A (ja) * 1983-05-11 1984-11-24 Nec Kyushu Ltd 半導体素子の樹脂封止装置
JP2012146808A (ja) * 2011-01-12 2012-08-02 Towa Corp 電子部品の樹脂封止成形装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037400U (enrdf_load_stackoverflow) * 1973-07-26 1975-04-18
JPS5334629U (enrdf_load_stackoverflow) * 1976-08-31 1978-03-27
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5850582A (ja) * 1981-09-22 1983-03-25 株式会社東芝 発光ダイオ−ドを用いたデイスプレイ装置
JPS6248372A (ja) * 1985-08-26 1987-03-03 デ−．デ−．ウイリアムソン　カムパニ−　インコ−ポレ−テツド 過圧条件下での濃縮塩安定およびビ−ル安定アンモニアカラメル色の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037400U (enrdf_load_stackoverflow) * 1973-07-26 1975-04-18
JPS5334629U (enrdf_load_stackoverflow) * 1976-08-31 1978-03-27
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS5850582A (ja) * 1981-09-22 1983-03-25 株式会社東芝 発光ダイオ−ドを用いたデイスプレイ装置
JPS6248372A (ja) * 1985-08-26 1987-03-03 デ−．デ−．ウイリアムソン　カムパニ−　インコ−ポレ−テツド 過圧条件下での濃縮塩安定およびビ−ル安定アンモニアカラメル色の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59207635A (ja) * 1983-05-11 1984-11-24 Nec Kyushu Ltd 半導体素子の樹脂封止装置
JP2012146808A (ja) * 2011-01-12 2012-08-02 Towa Corp 電子部品の樹脂封止成形装置

Also Published As

Publication number Publication date
JPS6248372B2 (enrdf_load_stackoverflow) 1987-10-13

Similar Documents

Publication Publication Date Title
KR102157944B1 (ko) 수지 밀봉 방법
JP4262468B2 (ja) 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4336499B2 (ja) 電子部品の樹脂封止成形方法及び装置
JP6598642B2 (ja) 樹脂封止装置及び樹脂封止方法
US5429488A (en) Encapsulating molding equipment and method
US2382200A (en) Molding apparatus
GB1333352A (en) High production isostatic moulding device
JP2009039985A (ja) 光素子の樹脂封止成形方法及び装置
KR102527948B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JP4553944B2 (ja) 樹脂モールド方法および樹脂モールド装置
JP3896274B2 (ja) 半導体樹脂封止装置
KR100419356B1 (ko) 전자 부품, 전자 부품의 수지 밀봉 방법 및 장치
KR20190017683A (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JP2005053143A (ja) 樹脂モールド方法および樹脂モールド装置
JPS5878433A (ja) 半導体装置の樹脂封止成形装置
CN108943552A (zh) 一种精密模压封装模具
KR20120100080A (ko) 반도체 패키지의 성형 장치
JP3999909B2 (ja) 樹脂封止装置及び封止方法
JP7121613B2 (ja) 樹脂成形装置、成形型装置、及び樹脂成形品の製造方法
JPS6258657B2 (enrdf_load_stackoverflow)
KR100608609B1 (ko) 반도체 칩 패키지 몰딩 장치
JPS59231823A (ja) 半導体装置の樹脂封止成形装置
JPH06210658A (ja) 樹脂成形用金型装置
JP3137297B2 (ja) トランスファ成形装置
JPS61292329A (ja) 半導体樹脂封止用成形装置