JPS587322A - 樹脂封入成形方法とその金型装置 - Google Patents

樹脂封入成形方法とその金型装置

Info

Publication number
JPS587322A
JPS587322A JP10524681A JP10524681A JPS587322A JP S587322 A JPS587322 A JP S587322A JP 10524681 A JP10524681 A JP 10524681A JP 10524681 A JP10524681 A JP 10524681A JP S587322 A JPS587322 A JP S587322A
Authority
JP
Japan
Prior art keywords
cavity
lead frame
heat sink
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10524681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS622456B2 (enrdf_load_stackoverflow
Inventor
Kazuo Bando
坂東　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10524681A priority Critical patent/JPS587322A/ja
Publication of JPS587322A publication Critical patent/JPS587322A/ja
Publication of JPS622456B2 publication Critical patent/JPS622456B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B29C33/0044—Moulds or cores; Details thereof or accessories therefor with sealing means or the like for sealing off parts of inserts projecting into the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP10524681A 1981-07-06 1981-07-06 樹脂封入成形方法とその金型装置 Granted JPS587322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10524681A JPS587322A (ja) 1981-07-06 1981-07-06 樹脂封入成形方法とその金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10524681A JPS587322A (ja) 1981-07-06 1981-07-06 樹脂封入成形方法とその金型装置

Publications (2)

Publication Number Publication Date
JPS587322A true JPS587322A (ja) 1983-01-17
JPS622456B2 JPS622456B2 (enrdf_load_stackoverflow) 1987-01-20

Family

ID=14402284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10524681A Granted JPS587322A (ja) 1981-07-06 1981-07-06 樹脂封入成形方法とその金型装置

Country Status (1)

Country Link
JP (1) JPS587322A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038001A (ja) * 1983-08-09 1985-02-27 Nippon Zeon Co Ltd 蒸溜塔の制御方法
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US5035594A (en) * 1989-08-11 1991-07-30 Toyo Seikan Kaisha, Ltd. Compression molding apparatus
US5091341A (en) * 1989-05-22 1992-02-25 Kabushiki Kaisha Toshiba Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
JP2009140951A (ja) * 2007-12-03 2009-06-25 Denso Corp 電子装置の製造方法
JP2014143240A (ja) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd モールド金型、該モールド金型を用いた樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置
JP2015173170A (ja) * 2014-03-11 2015-10-01 セイコーインスツル株式会社 樹脂封止金型およびそれを用いた半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791246U (enrdf_load_stackoverflow) * 1980-11-26 1982-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791246U (enrdf_load_stackoverflow) * 1980-11-26 1982-06-04

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
JPS6038001A (ja) * 1983-08-09 1985-02-27 Nippon Zeon Co Ltd 蒸溜塔の制御方法
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US5091341A (en) * 1989-05-22 1992-02-25 Kabushiki Kaisha Toshiba Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
US5035594A (en) * 1989-08-11 1991-07-30 Toyo Seikan Kaisha, Ltd. Compression molding apparatus
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
JP2009140951A (ja) * 2007-12-03 2009-06-25 Denso Corp 電子装置の製造方法
JP2014143240A (ja) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd モールド金型、該モールド金型を用いた樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置
JP2015173170A (ja) * 2014-03-11 2015-10-01 セイコーインスツル株式会社 樹脂封止金型およびそれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
JPS622456B2 (enrdf_load_stackoverflow) 1987-01-20

Similar Documents

Publication Publication Date Title
JPS587322A (ja) 樹脂封入成形方法とその金型装置
US5254501A (en) Same-side gated process for encapsulating semiconductor devices
JP4118353B2 (ja) 樹脂封止型半導体装置の製造方法およびモールド金型
EP1060507B1 (en) Mould part, mould and method for encapsulating electronic components mounted on a carrier
JP2626971B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPH10270606A (ja) パッケージ型半導体装置の構造
JP3236691B2 (ja) 電子部品の封止成形方法及び金型
JPS6294312A (ja) モ−ルド金型
JP3246037B2 (ja) 半導体チップのトランスファーモールド用金型
KR100233002B1 (ko) 반도체 패키지의 몰딩 금형
JPH01134955A (ja) 半導体類のパッケージ成形方法とその成形装置及び成形用金型
JPH02265721A (ja) 半導体装置用封入金型
JP3332031B2 (ja) 樹脂モールド装置
JPH0994834A (ja) 樹脂成形装置およびそれを用いて製造した半導体集積回路装置
JPH07114213B2 (ja) 半導体装置用リードフレーム
JPH06224240A (ja) 樹脂モールド成形品及び金型
JPH058102Y2 (enrdf_load_stackoverflow)
JP3652146B2 (ja) 半導体装置の樹脂封止金型
JPH04333245A (ja) プラスチック集積回路パッケージを製造するための金型
JPH0739230Y2 (ja) トランスファ成形用金型
KR100251865B1 (ko) 반도체 패키지 제조용 몰드금형
JPH08124954A (ja) 電子部品の樹脂モールド方法および樹脂モールド装置
JPH0421416A (ja) マルチプランジャ金型
JPH04326529A (ja) 樹脂封止方法
JPH0463443A (ja) 電子部品の樹脂封止成形装置及びエジェクターピンの押込用治具