JPS5791246U - - Google Patents

Info

Publication number
JPS5791246U
JPS5791246U JP1980169991U JP16999180U JPS5791246U JP S5791246 U JPS5791246 U JP S5791246U JP 1980169991 U JP1980169991 U JP 1980169991U JP 16999180 U JP16999180 U JP 16999180U JP S5791246 U JPS5791246 U JP S5791246U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980169991U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980169991U priority Critical patent/JPS5791246U/ja
Publication of JPS5791246U publication Critical patent/JPS5791246U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1980169991U 1980-11-26 1980-11-26 Pending JPS5791246U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980169991U JPS5791246U (enrdf_load_stackoverflow) 1980-11-26 1980-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980169991U JPS5791246U (enrdf_load_stackoverflow) 1980-11-26 1980-11-26

Publications (1)

Publication Number Publication Date
JPS5791246U true JPS5791246U (enrdf_load_stackoverflow) 1982-06-04

Family

ID=29528463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980169991U Pending JPS5791246U (enrdf_load_stackoverflow) 1980-11-26 1980-11-26

Country Status (1)

Country Link
JP (1) JPS5791246U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587322A (ja) * 1981-07-06 1983-01-17 Kazuo Bando 樹脂封入成形方法とその金型装置
JPS6433937A (en) * 1987-07-30 1989-02-03 Toshiba Corp Semiconductor device and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378527A (en) * 1976-12-21 1978-07-12 Kubota Ltd Hydraulic clutch device for vehicle

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378527A (en) * 1976-12-21 1978-07-12 Kubota Ltd Hydraulic clutch device for vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587322A (ja) * 1981-07-06 1983-01-17 Kazuo Bando 樹脂封入成形方法とその金型装置
JPS6433937A (en) * 1987-07-30 1989-02-03 Toshiba Corp Semiconductor device and manufacture thereof

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