JPS5871646A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5871646A
JPS5871646A JP56171641A JP17164181A JPS5871646A JP S5871646 A JPS5871646 A JP S5871646A JP 56171641 A JP56171641 A JP 56171641A JP 17164181 A JP17164181 A JP 17164181A JP S5871646 A JPS5871646 A JP S5871646A
Authority
JP
Japan
Prior art keywords
wirings
wiring
ceramic substrate
pad
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56171641A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224948B2 (enExample
Inventor
Masanobu Obara
小原　雅信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56171641A priority Critical patent/JPS5871646A/ja
Publication of JPS5871646A publication Critical patent/JPS5871646A/ja
Publication of JPS6224948B2 publication Critical patent/JPS6224948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/60—
    • H10W70/611—
    • H10W90/724—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56171641A 1981-10-24 1981-10-24 半導体装置 Granted JPS5871646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS5871646A true JPS5871646A (ja) 1983-04-28
JPS6224948B2 JPS6224948B2 (enExample) 1987-05-30

Family

ID=15926965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56171641A Granted JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS5871646A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127357A (ja) * 1981-12-31 1983-07-29 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 集積回路チツプ・モジユ−ル
JPS63102399A (ja) * 1986-10-20 1988-05-07 富士通株式会社 多層プリント配線基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516106U (ja) * 1991-08-05 1993-03-02 株式会社小松製作所 切粉処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030474A (enExample) * 1973-07-17 1975-03-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030474A (enExample) * 1973-07-17 1975-03-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127357A (ja) * 1981-12-31 1983-07-29 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 集積回路チツプ・モジユ−ル
JPS63102399A (ja) * 1986-10-20 1988-05-07 富士通株式会社 多層プリント配線基板

Also Published As

Publication number Publication date
JPS6224948B2 (enExample) 1987-05-30

Similar Documents

Publication Publication Date Title
US5394303A (en) Semiconductor device
US7009293B2 (en) Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument
CN101515554B (zh) 半导体器件的制造方法、半导体器件以及配线基板
US4949224A (en) Structure for mounting a semiconductor device
JPS5839048A (ja) フレキシブル領域接着テ−プ
JP2010153901A (ja) ボンディングパッドを有する半導体装置及びその形成方法
JPS62101062A (ja) 集積回路装置実装モジユ−ル
US4843191A (en) Interconnection technique using dielectric layers
JPS6170743A (ja) 電気相互連結テ−プ
JPH04273451A (ja) 半導体装置
JP2001177050A (ja) 半導体装置
JPS5871646A (ja) 半導体装置
JPS60105269A (ja) ハイブリツド回路の製造方法
CN109066134A (zh) 一种连接件、电路板组件及终端设备
JP4213672B2 (ja) 半導体装置及びその製造方法
JPS59222947A (ja) 半導体装置およびその製造方法
JPS59194460A (ja) 半導体装置
JPH02230749A (ja) 半導体チップ及び該チップを用いた半導体装置
JP2001085600A (ja) 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器
JPH01220494A (ja) 多層配線基板
JPH0219978B2 (enExample)
JP2970595B2 (ja) Ｂｇａ型半導体装置
TWI314030B (en) Method for making cable with a conductive bump array, and method for connecting the cable to a task object
JPS6240734A (ja) 半導体装置
JPH06338539A (ja) 半導体素子の接続方法