JPS6224948B2 - - Google Patents
Info
- Publication number
- JPS6224948B2 JPS6224948B2 JP56171641A JP17164181A JPS6224948B2 JP S6224948 B2 JPS6224948 B2 JP S6224948B2 JP 56171641 A JP56171641 A JP 56171641A JP 17164181 A JP17164181 A JP 17164181A JP S6224948 B2 JPS6224948 B2 JP S6224948B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- bump
- ceramic substrate
- circular
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/60—
-
- H10W70/611—
-
- H10W90/724—
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56171641A JPS5871646A (ja) | 1981-10-24 | 1981-10-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56171641A JPS5871646A (ja) | 1981-10-24 | 1981-10-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5871646A JPS5871646A (ja) | 1983-04-28 |
| JPS6224948B2 true JPS6224948B2 (enExample) | 1987-05-30 |
Family
ID=15926965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56171641A Granted JPS5871646A (ja) | 1981-10-24 | 1981-10-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5871646A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0516106U (ja) * | 1991-08-05 | 1993-03-02 | 株式会社小松製作所 | 切粉処理装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4489364A (en) * | 1981-12-31 | 1984-12-18 | International Business Machines Corporation | Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface |
| JPS63102399A (ja) * | 1986-10-20 | 1988-05-07 | 富士通株式会社 | 多層プリント配線基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030474A (enExample) * | 1973-07-17 | 1975-03-26 |
-
1981
- 1981-10-24 JP JP56171641A patent/JPS5871646A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0516106U (ja) * | 1991-08-05 | 1993-03-02 | 株式会社小松製作所 | 切粉処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5871646A (ja) | 1983-04-28 |
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