TWI314030B - Method for making cable with a conductive bump array, and method for connecting the cable to a task object - Google Patents

Description

1314030 IX. Description of the Invention: [Technical Field] The present invention relates to a cable with a microbump array and a bonding method thereof, and it is particularly necessary to use an anisotropic conductive paste/film by forming on a wire The microbump array is electrically connected to the corresponding connection of the substrate or the 1 c element. [Prior Art] Aisotropic-conductive Paste (ACP) or anisotropic conductive fnm (ACF) is the next in the wire and 1C components, as well as the LCD glass substrate and pCB bonding technology. Combined roles. The composition of the anisotropic conductive film/glue contains small particles of metal particles and is uniformly distributed in the colloid. When the cable is to be bonded to the LCD glass substrate or pCB, the anisotropic conductive film/glue is used for bonding, so the metal particles in the colloid will be interposed between the circuit and the LCD glass substrate a pCB, the anisotropic conductive film / The position at which the glue is pressed, the metal particles in the inner colloid act as electrical conductors, thereby transmitting a signal. The metal particles that are not pressed are not turned on, and the glue is also used as a binder to bond the board and substrate or the board and the |c component. As shown in the sixth figure A and B, the conductive line (7 1 ) on the cable (7 〇) is bonded to a substrate (72) by using an anisotropic conductive paste/film (8 〇). The square conductive paste (8 〇) is a metal particle (8 i ) contained therein as a binder, and the substrate (72) may be a substrate of -PCB or a glass substrate of -Lcd. The wire formed on the LCD glass substrate may be a transparent electrode (work 1314030 τ 0) or an aluminum wire. a — as shown in the seventh figure, to use the metal bumps (7 4 ) on the anisotropic conductive adhesive/film (8 〇) junction component (7 3 ) and the wires on the cable (7 1 2 ) (7) 1) The combination of the 'IC it piece (7 3 ) gold, the convex ghost C74) is also transmitted through the metal in the anisotropic conductive paste/film (8 〇): the particle (81) and the line (71) are electrically connected to each other. . See the figure of the person in the month, using a non-conductive glue/film (8 ·=) (N〇n_C〇ndUCtive fi|m or paste, NCF, NCP) knot 2 way '丨C疋 (7 3) The metal bumps (7*) are electrically connected by the bonding force of the non-conductive glue/film (8 2 ) and the wires (7 work), because there is no conductive metal particles as a medium, It is completely dependent on the strength of the glue, so its reliability is not good, so it is not widely used. Even if the anisotropic conductive paste/film (8 Å) is used as described above, there are still the following disadvantages: the space of the colloidal flow and thus the electrical failure.

1. There must be a problem that the distribution of the metal particles in the connotation is uneven around the joint. Size 2 • The line width and line spacing of the wire must be designed to take into account the size of the metal particles. Otherwise, a short circuit or poor circuit conduction may occur. 3. The anisotropic conductive adhesive/film process is complicated. Causes anisotropic conductivity 4 · Due to the special metal/particles used in the metal particles, the supply source is limited. SUMMARY OF THE INVENTION In view of the above-mentioned conventional use of an anisotropic conductive paste, a disadvantage of the derivative of the film, the main object of the 1314030 invention is to provide a wire arrangement method with a microbump array, and the cable system obtained by the method is directly Corresponding contact force L c D The glass substrate or the wire on the PCB does not require the use of an anisotropic conductive paste/film. In order to achieve the above object, the wire arranging method of the present invention comprises: forming a plurality of metal wires on a surface of a substrate; coating-resisting dry on the metal wires, and forming the photoresist dry film layer in the yttrium a plurality of photoresist openings; a metal microbump in the force blocking opening and removing the photoresist dry film layer, wherein the metal microbump is formed on the metal wire; plating a protective layer on the metal microbump surface. Just as the complex photoresist openings can be arranged in a matrix shape. The plurality of photoresist openings are evenly distributed on the surface of the substrate. • The aforementioned metal microbumps can be formed by electroplating or electroless plating. • The wire obtained by the method, when bonded to the LCD glass substrate or the wire on the p CB, the conductive microbump can directly contact the wire on the substrate or p φ CB, and only need to be non- The conductive adhesive/film can be bonded. [Embodiment] The inner valley of the present invention is made of microbump arrays on the wires of the wires, so that the wires can be bonded to the Lcd glass substrate, the PCB or the 丨C τ, and the anisotropic conductive film can be omitted. (ACF) or anisotropic conduction: (CP) The microbump array (mjCro_bump array) replaces the metal particles in the ACF or ACP, and only a commonly available non-conductive glue is required for wire bonding (eg N〇n_c〇nductjvepaste). 1314030 Please refer to Fig. A and B for the first step of forming a plurality of metal wires on a substrate, such as a flexible board or a printed circuit board (PCB) (to form a row of wires (1 〇). See second As shown in FIGS. A and B, in the surface on which the wires (11) are formed, a photoresist dry film layer (1 3 ) having a matrix-arranged photoresist opening is formed by using a photomask. Since the first opening hole (1 2 ) is an array pattern, it is evenly distributed on the line (should be on the surface of the metal wire (11), and the surface is not deliberately). What must be considered is the line spacing and line width factor of the metal wire (; /), and then determine the distribution density of the photoresist opening (12). The photoresist opening on the array (i 2 wire (U) forms a 45 degree refresh angle Γ and metal, 4 ^ degree angle, and ensure that there is a photoresist opening (i 2 ) on the metal wire (1 1 ). Please refer to the third figure A, B, using the electric record or no key , forming conductive micro-bumps (Η) at the position of the photoresist opening (12), since the photoresist opening (12) is evenly distributed on the surface of the wiring, even in The position of the metal wire (11) is a photoresist opening (Η), and the process is only formed on the metal surface, so the above-mentioned conductive microbump (1 ^ wire (1 1 ) is formed. After the process of the electric ore is completed, the system is removed. The photoresist dry film layer (13), formed by the micro (four) (14) array and then the surface mineral tin, recorded or gold as a surface protective layer, such a complete cable (10) architecture has formed 'and The connection of the cable (i 〇): the method of 'how to combine the cable (10) to an lcd glass substrate or a printed circuit board. Please refer to the fourth figure A, B, Xin, + ...., 厅 别 别 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 The substrate (7〇) may be a substrate of a -P匚B or a glass substrate of a CD, and the wire formed on the CD substrate may be a transparent electrode (I To) or a line, the aforementioned micro The bump (14) is in contact with the wire or the contact of the substrate (7 。). Similarly, as shown in the fifth figure, the cable (i 〇) of the present invention is The microbump (1 4 ) applied to the bonding - 1 C component (7 3 ) 'wire line (丄〇) corresponds to the metal bump (7 4 ) contacting the I c element (bottom 3), both of which The same is also bonded by a non-conductive glue (2 〇). In summary, the present invention uses only the wires formed with the micro bumps to be bonded to the glass substrate of the LCD or the printed circuit board, and only non-conductive is used. The adhesive material can be used, and it is not necessary to use the expensive anisotropic conductive adhesive/film. Therefore, there is a considerable improvement in the cost reduction and process complexity, so the case is in accordance with the premise of the invention patent requirements.提出Proposed application according to law • Please 0 [Simplified description of the drawing] The first figure A is a cross-sectional view of the wire formed on a soft board or pc B of the present invention. Figure B: is a schematic view of the bottom surface of the first Figure A. Fig. 2A is a cross-sectional view showing the formation of a photoresist dry film layer on the wiring line of the present invention. Figure B: is a schematic view of the bottom surface of the second 圊a. 8 1314030 FIG. 3A is a cross-sectional view showing the formation of conductive microbumps on the wire in the present invention. Figure B is a schematic view of the bottom surface of the third figure a. Figure 4A is a schematic view showing the bonding of the cable of the present invention to a substrate. Figure 4B is a top plan view of the fourth figure a. The fifth figure is a schematic view of the assembly of the present invention to the c-element. Fig. 3 and Fig. A are cross-sectional views of a substrate which is bonded to a substrate by an anisotropic conductive film or a conductive paste.

To the sixth figure B·· is the top view of the sixth figure eight. The seventh Q. is a cross-sectional view of the use of an anisotropic conductive paste or a conductive member. Electro-film combined with the cable. Figure 8: A section of the C-component of the Xizhili. Use non-conductive glue / film bonding cable to

I [Main component symbol description ^ 1 〇 ) Cable (1 2 ) Resistor opening (1 4 ) Microbump (7 0 ) Cable (7 2 ) Substrate

(1 1) Metal line (1 3 ) Photoresist dry film layer (2 〇) Non-conductive glue (7 1 ) Line (7 3 ) IC component (80) Anisotropic conductive adhesive / film (8 2 ) Non-conductive Glue/film

Claims (1)

I314030, the scope of patent application Case No.: 94107683 Modified on January 17, 1997 - Replacement Page L A method for manufacturing a microbump cable comprising: providing a row of substrate; =^ is a portion of the wire covering the substrate of the Wei wire, and exposing The wire substrate of the wire substrate is disposed on the surface of the substrate and the wire and the exposed wire are exposed. The portion of the plurality of photoresist openings falls on the microbump The photoresist on the metal wire is opened in the hole such that the plurality of metal protrudes from the surface of the metal wire by the bump. According to the method of the invention, there is a method for manufacturing a micro & block line, wherein the plurality of photoresist openings are arranged in a matrix shape. The method for manufacturing a microbump line according to the first item of the scope is described in the method for manufacturing a microbump line according to item 1 of the metal micro lobe, the metal microprotrusion 5, =^ The method for manufacturing a microbump line further comprises an electron mirror-protective layer on the surface of the metal microbump, and the protective layer can be tin, recorded or gold. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The metal wire forms a 45-degree clip. The read 8 is as follows: the micro-bump line is as described in the application specification, at least one of the openings: simultaneously covering the metal wire and the exposed: Line 9. As described in the scope of the patent application, at least the correction of the micro-blocks - two financial Wei Jin mm = into: the line with micro-bumps, as described in the patent law _ 丨 所述 所述 11 , a mandrel on a wire as in claim 10 of the patent application, and a wire on a to-be-joined object "i the = non-V-electric glue between the wire and the object to be joined, facility Corresponding contact of the block with the wire. Reinforced 5 ohm metal micro-convex 5 hai to be bonded 12. The bonding of the wire as described in claim n is an LCD glass substrate. σ / , 13. The wire of the range described in item u is joined by a printed circuit board (pCB). / 'The object to be joined 14. A row with microbumps The method comprises the steps of: providing a row of wire substrates; forming a plurality of metal wires covering a portion of the wire substrate; and leaving the wire substrate; 314030. Case number: 94107683 revised on January 17, 1997 Forming a photoresist layer covering the plurality of metal wires and the exposed wire substrate; forming a plurality of photoresist openings uniformly distributed in the photoresist layer, the arrangement direction of the plurality of photoresist openings and the plurality The metal wires are arranged in different directions such that a portion of the plurality of photoresist openings fall on the plurality of metal wires, and the other portion of the plurality of drops falls on the exposed wire substrate; and -12-