CN109819585A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN109819585A CN109819585A CN201711160327.5A CN201711160327A CN109819585A CN 109819585 A CN109819585 A CN 109819585A CN 201711160327 A CN201711160327 A CN 201711160327A CN 109819585 A CN109819585 A CN 109819585A
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- Prior art keywords
- layer
- conductive
- circuit layer
- conductive circuit
- line
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of circuit boards.A kind of circuit board includes flexible circuit board, the first ceramic substrate for being covered on the flexible circuit board ends both side surface, the second ceramic substrate for being covered on first ceramic base plate surface and the soldermask layer for being covered on second ceramic base plate surface.The flexible circuit board includes the first conductive circuit layer.First ceramic substrate includes the second conductive circuit layer.Second ceramic substrate includes third conductive circuit layer.The first conductive through hole is formed on first ceramic substrate.First conductive through hole is directly electrically connected first conductive circuit layer and second conductive circuit layer.The second conductive through hole is formed on second ceramic substrate.Second conductive through hole is directly electrically connected second conductive circuit layer and the third conductive circuit layer.The invention further relates to a kind of production methods of circuit board.
Description
Technical field
The present invention relates to circuit board and its production fields more particularly to a kind of circuit board and preparation method thereof.
Background technique
Increasingly developed with chip technology, circuit board develops progressively towards frivolous direction.It is used for camera mould group now
Circuit board be divided into two kinds of gluing ceramic substrate on Rigid Flex and flexible circuit board.
Rigid Flex is connected by way of wire bonding, and input/output pin must draw from integrated circuit surrounding
Out, and due to the difficulty of welding gold thread diameter production, the engagement pad of connection cannot be made small, when integrated circuit pixel or function
When increasing to a certain extent, circuit board cannot be met the requirements.
On flexible circuit board (FPC) in gluing ceramic substrate structure, since ceramic substrate uses printing technology, line
Road cannot be made thin.And ceramic substrate is subsequent needs to connect by way of anisotropic conductive adhesive paste (ACF) with FPC, it is desirable that FPC
Planarization it is very high, process difficulty is big, and integral manufacturing is at high cost.
Summary of the invention
In view of this, it is necessary to provide a kind of circuit boards and preparation method thereof for overcoming the above problem.
A kind of circuit board includes flexible circuit board, the first ceramic base for being covered on the flexible circuit board ends both side surface
Plate, the second ceramic substrate for being covered on first ceramic base plate surface and it is covered on the anti-of second ceramic base plate surface
Layer.The flexible circuit board includes the first conductive circuit layer.First ceramic substrate includes the second conductive circuit layer.It is described
Second ceramic substrate includes third conductive circuit layer.The first conductive through hole is formed on first ceramic substrate.Described first
Conductive through hole is directly electrically connected first conductive circuit layer and second conductive circuit layer.Shape on second ceramic substrate
At there is the second conductive through hole.Second conductive through hole is directly electrically connected second conductive circuit layer and the third conductor wire
Road floor.
A kind of production method of circuit board, includes the following steps:
One flexible copper clad substrate is provided, makes to form the first conducting wire in the enterprising row line of flexible copper clad substrate
Layer；
Four the first ceramic substrates are provided, four first ceramic substrates are covered and are bonded in first conducting wire
On layer；
Route is carried out to first ceramic substrate to make to form second conductive circuit layer and in first ceramics
The first conductive through hole is formed on substrate, first conductive through hole is directly electrically connected second conductive circuit layer and described first
Conductive circuit layer；
Four the second ceramic substrates are provided, four second ceramic substrates are covered and are bonded in second conducting wire
On layer；
Route is carried out to second ceramic substrate to make to form the third conductive circuit layer and in second ceramics
The second conductive through hole is formed on substrate, second conductive through hole is directly electrically connected the third conductive circuit layer and described second
Conductive circuit layer；
Soldermask layer is formed on the surface of the third conductive circuit layer.
Compared with prior art, the production method of the circuit board provided by the invention, it is first ceramic substrate, described
The route production method of second ceramic substrate can make fine-line as the route production method of the flexible circuit board；
And since the circuit board is using ceramic substrate production, flip-chip can be passed through between the circuit board and external integrated
Mode be combined, improve engagement pad face battle array distributed quantity.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the flexible copper clad substrate that better embodiment of the present invention provides.
Fig. 2 is that the flexible copper clad substrate in Fig. 1 makes the diagrammatic cross-section after forming the first conductive layer by route.
Fig. 3 is that the flexible region both side surface of the flexible circuit board in Fig. 2 pastes the diagrammatic cross-section after cover film.
Fig. 4 is that the two sides in the increasing layer region of the flexible circuit board in Fig. 3 cover the diagrammatic cross-section after the first ceramic substrate.
Fig. 5 is that the first ceramic substrate in Fig. 4 makes the diagrammatic cross-section after forming the second conductive circuit layer.
Fig. 6 is the diagrammatic cross-section after the first ceramic base plate surface in Fig. 5 covers after the second ceramic substrate.
Fig. 7 is that the second ceramic substrate in Fig. 6 makes the diagrammatic cross-section after forming third conductive circuit layer.
The second ceramic base plate surface in Fig. 8 Fig. 7 forms the diagrammatic cross-section after soldermask layer.
Main element symbol description
Circuit board 100
Flexible copper clad substrate 110
Insulating layer 112
First copper foil layer 114
Flexible region 115
Increasing layer area 116
First conductive circuit layer 118
Flexible circuit board 120
Cover film 130
Film layer 132
First glue-line 134
First ceramic substrate 140
First ceramic bases 142
Second copper foil layer 144
Second glue-line 146
Second conductive circuit layer 148
First conductive through hole 149
Second ceramic substrate 150
Second ceramic bases 152
Third copper foil layer 154
Third glue-line 156
Third conductive circuit layer 158
Second conductive through hole 159
Soldermask layer 160
Engagement pad 170
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
100 production method of the circuit board that the technical program provides includes the following steps:
The first step, referring to Fig. 1, providing a flexible copper clad substrate 110.
The flexible copper clad substrate 110 is dual platen.The flexible copper clad substrate 110 includes insulating layer 112 and is formed
In the first copper foil layer 114 of 112 opposite sides of insulating layer.The flexible copper clad substrate 110 is divided into flexible region 115 and connection
In the increasing layer area 116 of 115 opposite sides of flexible region.
Second step, referring to Fig. 2, the first copper foil layer 114 of the flexible copper clad substrate 110 is located at increasing layer area 116
Part carries out route and makes to form the first conductive circuit layer 118, so that the flexible copper clad substrate 110 is made as flexible circuit
Plate 120.
In the present embodiment, first conductive circuit layer 118 on first copper foil layer 114 by pasting dry film, exposing
The pattern transfers such as light and development complete.
Two cover films 130 are covered in the flexibility referring to Fig. 3, providing two cover films 130 by third step
115 surface of area.
In the present embodiment, the structure of two cover films 130 is identical.Every cover film 130 includes phase mutual connection
The film layer 132 of touching and the first glue-line 134.First glue-line 134 is between the film layer 132 and the flexible region 115.
The size of the cover film 130 is roughly the same with 115 size of flexible region.
4th step, referring to Fig. 4, providing four the first ceramic substrates 140.Four first ceramic substrates 140 are pressed
It covers and is bonded in the increasing layer area 116.
First ceramic substrate 140 includes one first ceramic bases 142, one second copper foil layer 144 and one second glue
Layer 146.Second copper foil layer 144 and second glue-line 146 are located at opposite two of first ceramic bases 142
A surface.Specifically, second glue-line 146 is pasted to and is pressed together on the surface of first conductive circuit layer 118, is made described
First ceramic substrate 140 is bonded in the increasing layer area 116.Second glue-line 146 and 134 height of the first glue-line are neat
It is flat.First ceramic bases 142 are identical as 132 thickness of film layer, highly flush.
5th step, please refers to Fig. 4 and Fig. 5, carries out route to first ceramic substrate 140 and makes to form described second and lead
Electric line layer 148.
Specifically, second copper foil layer 144 is made into second conductive circuit layer 148.First ceramic base
Multiple first conductive through holes 149 are formed between bottom 142 and second glue-line 146.The multiple first conductive through hole 149 is led
Lead to second conductive circuit layer 148 and first conductive circuit layer 118, is electrically connected second conductive circuit layer 148
First conductive circuit layer 118.
6th step, referring to Fig. 6, providing four the second ceramic substrates 150.Four second ceramic substrates 150 are pressed
It covers and is bonded in second conductive circuit layer 148.
Second ceramic substrate 150 includes one second ceramic bases 152, a third copper foil layer 154 and a third glue
Layer 156.The third copper foil layer 154 and the third glue-line 156 are located at opposite two of second ceramic bases 152
A surface.Specifically, the third glue-line 156 is pasted to and is pressed together on the surface of second conductive circuit layer 148, is made described
Second ceramic substrate 150 is bonded in second conductive circuit layer 148.
7th step, please refers to Fig. 6 and Fig. 7, carries out route to second ceramic substrate 150 and makes to form the third and lead
Electric line layer 158.
Specifically, the third copper foil layer 154 is made into the third conductive circuit layer 158.Second ceramic base
Multiple second conductive through holes 159 are formed between bottom 152 and the third glue-line 156.The multiple second conductive through hole 159 is led
Lead to the third conductive circuit layer 158 and second conductive circuit layer 148, is electrically connected the third conductive circuit layer 158
Second conductive circuit layer 148.
8th step, referring to Fig. 8, soldermask layer 160 is formed on the surface of the third conductive circuit layer 158, it is described anti-welding
Layer 160, which covers the third conductive circuit layer 158 and exposes corresponding third conductive circuit layer 158, forms multiple engagement pads 170,
To obtain the circuit board 100.
Referring to Fig. 8, the circuit board 100 includes the flexible circuit board 120, is covered on the flexible circuit board 120
First ceramic substrate 140 in two sides increasing layer area 116, second pottery for being covered on 140 surface of the first ceramic substrate
Porcelain substrate 150 and the soldermask layer 160 for being covered on 150 surface of the second ceramic substrate.The flexible circuit board 120 includes
The insulating layer 112 and it is formed in the first conductive circuit layer 118 described in 112 surface of insulating layer.First ceramic substrate
140 include second conductive circuit layer 148.Second ceramic substrate 150 includes the third conductive circuit layer 158.Institute
It states the second conductive circuit layer 148 and is respectively turned on electrical connection first conductive circuit layer 118 and the third conductive circuit layer
158。
Compared with prior art, the production method of the circuit board 100 provided by the invention, first ceramic substrate
140, the route production method of second ceramic substrate 150, can as the route production method of the flexible circuit board 120
Make fine-line；And since the circuit board 100 is using ceramic substrate production, the circuit board 100 and external integrated
Between can be combined by way of flip-chip, improve engagement pad face battle array distributed quantity.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (10)
1. a kind of circuit board comprising a flexible circuit board, the first pottery for being covered on the flexible circuit board ends both side surface
Porcelain substrate, the second ceramic substrate for being covered on first ceramic base plate surface and it is covered on second ceramic base plate surface
Soldermask layer, the flexible circuit board include the first conductive circuit layer, first ceramic substrate include the second conductive circuit layer,
Second ceramic substrate includes third conductive circuit layer, and the first conductive through hole is formed on first ceramic substrate, described
First conductive through hole is directly electrically connected first conductive circuit layer and second conductive circuit layer, second ceramic substrate
On be formed with the second conductive through hole, second conductive through hole is directly electrically connected second conductive circuit layer and the third is led
Electric line layer.
2. circuit board as described in claim 1, which is characterized in that the third conductive circuit layer is sudden and violent from the soldermask layer
Dew, forms multiple engagement pads.
3. circuit board as described in claim 1, which is characterized in that first ceramic substrate further include the first ceramic bases with
The opposite two sides of first ceramic bases, institute is arranged in second glue-line, second conductive circuit layer and second glue-line
The second glue-line is stated to cover on first conductive layer, first conductive through hole be formed in first ceramic bases with it is described
In second glue-line, second conductive circuit layer and first conductive circuit layer is connected in first conductive through hole, is made described
Second conductive circuit layer is electrically connected first conductive circuit layer.
4. circuit board as described in claim 1, which is characterized in that second ceramic substrate further include the second ceramic bases with
The opposite two sides of second ceramic bases, institute is arranged in third glue-line, the third conductive circuit layer and the third glue-line
Third glue-line is stated to cover on the second conductive layer, second conductive through hole be formed in second ceramic bases with it is described
In third glue-line, the third conductive circuit layer and second conductive circuit layer is connected in second conductive through hole, is made described
Third conductive circuit layer is electrically connected second conductive circuit layer.
5. circuit board as described in claim 1, which is characterized in that the flexible circuit board further includes an insulating layer, and described
One conductive circuit layer is formed in the opposite two sides of insulating layer.
6. a kind of production method of circuit board, includes the following steps:
One flexible copper clad substrate is provided, makes to form the first conductive circuit layer in the enterprising row line of flexible copper clad substrate；
Four the first ceramic substrates are provided, four first ceramic substrates are covered and are bonded in first conductive circuit layer
On；
Route is carried out to first ceramic substrate to make to form second conductive circuit layer and in first ceramic substrate
The first conductive through hole of upper formation, first conductive through hole are directly electrically connected second conductive circuit layer and first conduction
Line layer；
Four the second ceramic substrates are provided, four second ceramic substrates are covered and are bonded in second conductive circuit layer
On；
Route is carried out to second ceramic substrate to make to form the third conductive circuit layer and in second ceramic substrate
The second conductive through hole of upper formation, second conductive through hole are directly electrically connected the third conductive circuit layer and second conduction
Line layer；
Soldermask layer is formed on the surface of the third conductive circuit layer.
7. the production method of circuit board as claimed in claim 6, which is characterized in that when forming soldermask layer step, part institute
The exposure from the soldermask layer of third conductive circuit layer is stated, multiple engagement pads are formed.
8. the production method of circuit board as claimed in claim 6, which is characterized in that first ceramic substrate further includes first
Ceramic bases, the second copper foil layer and the second glue-line, second copper foil layer and second glue-line setting are in first ceramics
The opposite two sides of substrate, second glue-line cover on first conductive layer, are carrying out line to the secondth copper foil layer
When road makes to form second conductive circuit layer, first conductive through hole runs through first ceramic bases and described second
Glue-line, first conductive through hole are connected second conductive circuit layer and first conductive circuit layer, make described second to lead
Electric line layer is electrically connected first conductive circuit layer.
9. the production method of circuit board as claimed in claim 6, which is characterized in that second ceramic substrate also includes the second pottery
Porcelain substrate, third copper foil layer and third glue-line, the third copper foil layer and the third glue-line are arranged in second ceramic base
The opposite two sides at bottom, the third glue-line cover on the second conductive layer, are carrying out route system to the third copper foil layer
When forming the third conductive circuit layer, second conductive through hole is through second ceramic bases and the third glue
The third conductive circuit layer and second conductive circuit layer is connected in layer, second conductive through hole, keeps the third conductive
Line layer is electrically connected second conductive circuit layer.
10. the production method of circuit board as claimed in claim 6, which is characterized in that the flexible copper clad substrate further includes one
Insulating layer and the first copper foil layer, first copper foil layer are formed in the opposite two sides of insulating layer, to the flexible copper clad substrate into
When row line makes, first copper foil layer is produced to form first conductive circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711160327.5A CN109819585A (en) | 2017-11-20 | 2017-11-20 | Circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711160327.5A CN109819585A (en) | 2017-11-20 | 2017-11-20 | Circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109819585A true CN109819585A (en) | 2019-05-28 |
Family
ID=66598132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711160327.5A Pending CN109819585A (en) | 2017-11-20 | 2017-11-20 | Circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109819585A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420653A (en) * | 2019-08-23 | 2021-02-26 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH053161B2 (en) * | 1983-02-25 | 1993-01-14 | Nippon Electric Co | |
| US6306511B1 (en) * | 1999-07-27 | 2001-10-23 | Murata Manufacturing Co., Ltd. | Hybrid laminate and manufacturing method therefor |
| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
-
2017
- 2017-11-20 CN CN201711160327.5A patent/CN109819585A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH053161B2 (en) * | 1983-02-25 | 1993-01-14 | Nippon Electric Co | |
| US6306511B1 (en) * | 1999-07-27 | 2001-10-23 | Murata Manufacturing Co., Ltd. | Hybrid laminate and manufacturing method therefor |
| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420653A (en) * | 2019-08-23 | 2021-02-26 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
| CN112420653B (en) * | 2019-08-23 | 2023-12-08 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
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Application publication date: 20190528 |