JPS5867054A - 半導体装置用リ−ドフレ−ム - Google Patents

半導体装置用リ−ドフレ−ム

Info

Publication number
JPS5867054A
JPS5867054A JP16675681A JP16675681A JPS5867054A JP S5867054 A JPS5867054 A JP S5867054A JP 16675681 A JP16675681 A JP 16675681A JP 16675681 A JP16675681 A JP 16675681A JP S5867054 A JPS5867054 A JP S5867054A
Authority
JP
Japan
Prior art keywords
lead frame
pellet
semiconductor device
pair
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16675681A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328826B2 (enrdf_load_stackoverflow
Inventor
Shigeki Takeo
竹尾　重樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16675681A priority Critical patent/JPS5867054A/ja
Publication of JPS5867054A publication Critical patent/JPS5867054A/ja
Publication of JPH0328826B2 publication Critical patent/JPH0328826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16675681A 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム Granted JPS5867054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16675681A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16675681A JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5867054A true JPS5867054A (ja) 1983-04-21
JPH0328826B2 JPH0328826B2 (enrdf_load_stackoverflow) 1991-04-22

Family

ID=15837141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16675681A Granted JPS5867054A (ja) 1981-10-19 1981-10-19 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5867054A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0328826B2 (enrdf_load_stackoverflow) 1991-04-22

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