JPS5864095A - Multilayer circuit board with connecting pins - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer wiring board with connection pins, in which external connection pins are attached to the multilayer wiring board.

With the advancement of integrated circuit technology, the mounting of elements on a substrate has progressed from mounting nine individual transistors to mounting semiconductor integrated circuits and then mounting multiple LSIs. Accordingly, in hybrid integrated circuits, it is necessary to configure high-density circuits on the same substrate, and since the circuit density that can be mounted on a liquid substrate is limited, it is necessary to further improve the mounting density. , a multilayer wiring board with multiple layers of internal wiring is used.

Conventionally, used as a multilayer wiring board for thick film hybrid integrated circuits.

A multilayer ceramic substrate with excellent insulation, heat dissipation properties, and mechanical strength is used.

In FIG. 1, external connection pins are attached to this type of multilayer wiring board. FIG. 2 is a front sectional view showing the configuration of a conventional example of a multilayer wiring board with connection pins. In the figure, 1 is a first multilayer wiring board, and 2 is a connection pin. The first multilayer wiring board 1 is composed of a multilayer ceramic plate 11 and a first conductor 12 made of Mo, W, etc. ◎The first conductor 12 is composed of a plurality of laminated ceramic materials. Wiring is conducted inside and on the surface of the multilayer ceramic board 11. A multilayer wiring board with connection pins having such a structure is produced by screen-printing wiring with a conductive paste such as Mo or W on a green sheet while the ceramic material is in a state before sintering, a so-called green sheet state. A plurality of ceramic materials wired in this manner are aligned and laminated, and then sintered to form the first multilayer wiring board 1, and then the connecting claw pins 2 are brazed to manufacture it.

Wiring on a substrate is generally divided into power supply wiring, which is a relatively coarse wiring used as a power supply or ground, and signal wiring, which is a high-density and fine wiring for signals. Therefore, in the multilayer wiring board with connection pins shown in FIG. 1, the signal wiring of the board was also wired inside and on the surface of the multilayer ceramic board 11. However, in the conventional manufacturing process, since the ceramic material is sintered at a high temperature, there is a limit in reducing the thickness of the two individual ceramic materials and in making the line width of the signal wiring finer. In addition, due to high temperature sintering, the first conductor 1 used for wiring
No. 2 has been limited to high melting point metals such as Mo and W, which can withstand the sintering temperature of ceramic materials.

Therefore, for example, in a multi-chip LSI in which multiple LSI chips are mounted on a board, the board plays the role of a carrier, so a board where the electrical resistance of the first conductor 12 is large is not desirable in terms of circuit characteristics. .

An object of the present invention is to provide a multilayer wiring board with connection pins in which a high-density and fine wiring layer is formed.

Another object of the present invention is to provide a multilayer wiring board with connection pins that makes it possible to use ordinary conductive metals with low electrical resistance as conductors for signal wiring.

According to the present invention, an external connection is made to a first multilayer wiring board that is composed of a multilayer ceramic plate in which a plurality of ceramic materials are laminated, and a first conductor wired inside and on the surface of the multilayer ceramic plate. In a multilayer wiring board with connection pins on which connection pins are attached.

A multilayer inorganic insulating board in which a plurality of low-temperature fired inorganic insulating materials are laminated on a part of the surface of the first multilayer wiring board, and a second conductor wired inside and on the surface of the multilayer inorganic insulating board. A second multilayer wiring board is formed such that both groove electric bodies are electrically connected, and another part of the surface of the first multilayer wiring board is connected to the first multilayer wiring board. A multilayer wiring board with external connection pins fixed to a conductor is obtained.

Hereinafter, nine embodiments of the present invention will be described with reference to the drawings. FIG. 2 is a front sectional view showing the structure of one embodiment of the present invention. In the figure, 1 is a first multilayer wiring board, 2
, 2' are connection pins, and 20 is a second multilayer wiring board. The first multilayer wiring board 1 includes a multilayer ceramic board 11 in which a plurality of ceramic materials are laminated, and a first conductor made of Mo or W wired inside and on the surface of the multilayer ceramic board 11, as in the conventional case. 12, and its manufacturing method is the same as the conventional one. On the other hand, the second multilayer wiring board 2o is a multilayer inorganic insulating board 2 in which a plurality of low-temperature fired inorganic insulating materials are laminated.
1, and a second conductor 22 wired inside and on the surface of the multilayer inorganic insulating board 21.

As shown in the figure, a second multilayer wiring board 20 is formed on a part of the surface of the first multilayer wiring board 1 so that both groove electric bodies 12 and 22 are electrically connected.

In addition, the connecting pins 2 and 2' are fixed to the first conductor 12 at other parts of the surface of the first multilayer wiring board 1 (in this embodiment, the peripheral parts). Examples of low-temperature fired inorganic insulating materials that are commonly used include Sumiceram (trade name) manufactured by Susumu Kagaku Kogyo ■, which can be fired at 100 degrees Celsius, and Aron Ceramic manufactured by Toagosei Chemical Industry ■ (trade name), which can be fired at 150 degrees Celsius. .

With such a configuration, the wiring of the first multilayer wiring board 1 has the above-mentioned drawbacks, and is therefore used for power supply wiring, which requires rough wiring for the power supply and ground. On the other hand, since the second multilayer wiring board 2o is composed of an inorganic insulating board 21 fired at a low temperature, the thickness of each board can be reduced, and the line width of the wiring can also be made fine. 2 multilayer wiring board 2o
The wiring is used as a signal wiring, which is a high-density and fine wiring for signals.

Also, by attaching the connecting wires 2, 2' to each side where the second multilayer wiring board 20 is formed.

First,! 7) Features of the multilayer wiring board 1. heat dissipation.

We were able to take advantage of its mechanical strength.

Furthermore, since the second multilayer wiring board 20 uses a multilayer inorganic insulating board 21 made of a low-temperature fired inorganic insulating material, the second conductor 22 wired inside and on the surface of the multilayer inorganic insulating board 21 The material is conventional M.

Ordinary conductive metal Cu, whose electrical resistance is a fraction of that of copper or W, can be used. Therefore, the circuit characteristics of the substrate have been greatly improved.

As is clear from the above description, there are two aspects of the present invention.

A multilayer wiring board with connection pins that can form high-density, fine wiring layers and has good circuit characteristics can be constructed.

[Brief explanation of drawings]

FIG. 1 is a front sectional view showing the configuration of a conventional example. FIG. 2 is a front sectional view showing the configuration of an embodiment of the present invention. Explanation of symbols: 1 is the first multilayer wiring board, 2.2' is the connection pin,
11 is a multilayer ceramic plate, 12 is a first conductor, 2
0 is a second multilayer wiring board, 21 is a multilayer inorganic insulating board,
22 denotes the second conductor, respectively.

Claims (1)

[Claims] 1. External connection pins are attached to a first multilayer wiring board consisting of a multilayer ceramic board in which a plurality of ceramic materials are laminated and a first conductor wired inside and on the surface of the multilayer ceramic board. In the multilayer wiring board with connection pins, the second conductor is composed of a multilayer inorganic insulating board in which a plurality of low-temperature fired inorganic insulating materials are laminated, and a second conductor wired inside and on the surface of the multilayer inorganic insulating board. No. 29 Multilayer Wiring Board No. 29 A multilayer wiring board in which both groove electric bodies are formed to be electrically connected to a part of the surface of the first multilayer wiring board, and the external connection pins are connected to the first multilayer wiring board. A multilayer wiring board with non-connection pins, characterized in that another portion of the surface of the multilayer wiring board is fixed to the first conductor.