JPS5586195A - Method of fabricating multilayer circuit board - Google Patents

Method of fabricating multilayer circuit board

Info

Publication number
JPS5586195A
JPS5586195A JP15860378A JP15860378A JPS5586195A JP S5586195 A JPS5586195 A JP S5586195A JP 15860378 A JP15860378 A JP 15860378A JP 15860378 A JP15860378 A JP 15860378A JP S5586195 A JPS5586195 A JP S5586195A
Authority
JP
Japan
Prior art keywords
circuit board
multilayer circuit
fabricating multilayer
fabricating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15860378A
Other languages
Japanese (ja)
Other versions
JPS5846079B2 (en
Inventor
Nobuo Kamehara
Kouichi Niwa
Kiyouhei Murakawa
Zenzou Henmi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15860378A priority Critical patent/JPS5846079B2/en
Publication of JPS5586195A publication Critical patent/JPS5586195A/en
Publication of JPS5846079B2 publication Critical patent/JPS5846079B2/en
Expired legal-status Critical Current

Links

JP15860378A 1978-12-25 1978-12-25 Multilayer wiring board manufacturing method Expired JPS5846079B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15860378A JPS5846079B2 (en) 1978-12-25 1978-12-25 Multilayer wiring board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15860378A JPS5846079B2 (en) 1978-12-25 1978-12-25 Multilayer wiring board manufacturing method

Publications (2)

Publication Number Publication Date
JPS5586195A true JPS5586195A (en) 1980-06-28
JPS5846079B2 JPS5846079B2 (en) 1983-10-14

Family

ID=15675298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15860378A Expired JPS5846079B2 (en) 1978-12-25 1978-12-25 Multilayer wiring board manufacturing method

Country Status (1)

Country Link
JP (1) JPS5846079B2 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57201097A (en) * 1981-06-04 1982-12-09 Nippon Electric Co Multilayer circuit board
JPS5816596A (en) * 1981-07-23 1983-01-31 日本電気株式会社 High density multilayer circuit board
JPS5853892A (en) * 1981-09-25 1983-03-30 日本電気株式会社 Hybrid multilayer circuit board
JPS5864095A (en) * 1981-10-14 1983-04-16 日本電気株式会社 Multilayer circuit board with connecting pins
JPS5864094A (en) * 1981-10-14 1983-04-16 日本電気株式会社 Multilayer circuit board with connecting pins
JPS5867474A (en) * 1981-10-19 1983-04-22 Toshiba Corp Thermal head
JPS5933161A (en) * 1982-08-18 1984-02-22 Matsushita Electric Ind Co Ltd Thermal head
JPS6062948U (en) * 1983-10-05 1985-05-02 ローム株式会社 thermal print head
JPH01156078A (en) * 1987-12-14 1989-06-19 Ngk Spark Plug Co Ltd Substrate for thermal head
JPH0368195A (en) * 1989-08-05 1991-03-25 Nippondenso Co Ltd Laminated ceramic board and manufacture thereof
JP2007286036A (en) * 2005-12-01 2007-11-01 National Institute For Materials Science Material testing device and material test piece

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151808A (en) * 1984-08-20 1986-03-14 Fujitsu Ltd Structure of ringed compound magnetic core

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57201097A (en) * 1981-06-04 1982-12-09 Nippon Electric Co Multilayer circuit board
JPS5816596A (en) * 1981-07-23 1983-01-31 日本電気株式会社 High density multilayer circuit board
JPS5853892A (en) * 1981-09-25 1983-03-30 日本電気株式会社 Hybrid multilayer circuit board
JPS5864095A (en) * 1981-10-14 1983-04-16 日本電気株式会社 Multilayer circuit board with connecting pins
JPS5864094A (en) * 1981-10-14 1983-04-16 日本電気株式会社 Multilayer circuit board with connecting pins
JPH0210597B2 (en) * 1981-10-14 1990-03-08 Nippon Electric Co
JPS6236873B2 (en) * 1981-10-19 1987-08-10 Tokyo Shibaura Electric Co
JPS5867474A (en) * 1981-10-19 1983-04-22 Toshiba Corp Thermal head
JPS5933161A (en) * 1982-08-18 1984-02-22 Matsushita Electric Ind Co Ltd Thermal head
JPH028773Y2 (en) * 1983-10-05 1990-03-02
JPS6062948U (en) * 1983-10-05 1985-05-02 ローム株式会社 thermal print head
JPH01156078A (en) * 1987-12-14 1989-06-19 Ngk Spark Plug Co Ltd Substrate for thermal head
JPH0368195A (en) * 1989-08-05 1991-03-25 Nippondenso Co Ltd Laminated ceramic board and manufacture thereof
JP2007286036A (en) * 2005-12-01 2007-11-01 National Institute For Materials Science Material testing device and material test piece

Also Published As

Publication number Publication date
JPS5846079B2 (en) 1983-10-14

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