JPS5519853A - Method of manufacturing circuit board - Google Patents
Method of manufacturing circuit boardInfo
- Publication number
- JPS5519853A JPS5519853A JP9274778A JP9274778A JPS5519853A JP S5519853 A JPS5519853 A JP S5519853A JP 9274778 A JP9274778 A JP 9274778A JP 9274778 A JP9274778 A JP 9274778A JP S5519853 A JPS5519853 A JP S5519853A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- manufacturing circuit
- manufacturing
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9274778A JPS5519853A (en) | 1978-07-29 | 1978-07-29 | Method of manufacturing circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9274778A JPS5519853A (en) | 1978-07-29 | 1978-07-29 | Method of manufacturing circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5519853A true JPS5519853A (en) | 1980-02-12 |
Family
ID=14062999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9274778A Pending JPS5519853A (en) | 1978-07-29 | 1978-07-29 | Method of manufacturing circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5519853A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6252989A (en) * | 1985-08-31 | 1987-03-07 | 日本メクトロン株式会社 | Metal based double-side flexible circuit board |
JPS6286896A (en) * | 1985-10-14 | 1987-04-21 | 銘光目黒工業株式会社 | Manufacture of printed circuit board with metal core |
WO2011002031A1 (en) * | 2009-06-30 | 2011-01-06 | 三洋電機株式会社 | Substrate for mounting components, and semiconductor module |
JP2012104794A (en) * | 2010-11-05 | 2012-05-31 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method for the same |
JP2013127122A (en) * | 2010-12-24 | 2013-06-27 | Samsung Electro-Mechanics Co Ltd | Heat radiating substrate using electrodeposition coating, and method for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51106052A (en) * | 1975-02-04 | 1976-09-20 | Takatsugu Komatsu | INSATSUHAISENKIBANNOSEIZOHOHO |
-
1978
- 1978-07-29 JP JP9274778A patent/JPS5519853A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51106052A (en) * | 1975-02-04 | 1976-09-20 | Takatsugu Komatsu | INSATSUHAISENKIBANNOSEIZOHOHO |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6252989A (en) * | 1985-08-31 | 1987-03-07 | 日本メクトロン株式会社 | Metal based double-side flexible circuit board |
JPS6286896A (en) * | 1985-10-14 | 1987-04-21 | 銘光目黒工業株式会社 | Manufacture of printed circuit board with metal core |
WO2011002031A1 (en) * | 2009-06-30 | 2011-01-06 | 三洋電機株式会社 | Substrate for mounting components, and semiconductor module |
JPWO2011002031A1 (en) * | 2009-06-30 | 2012-12-13 | 三洋電機株式会社 | Device mounting substrate and semiconductor module |
US9024446B2 (en) | 2009-06-30 | 2015-05-05 | Panasonic Intellectual Property Management Co., Ltd. | Element mounting substrate and semiconductor module |
JP2012104794A (en) * | 2010-11-05 | 2012-05-31 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method for the same |
JP2013127122A (en) * | 2010-12-24 | 2013-06-27 | Samsung Electro-Mechanics Co Ltd | Heat radiating substrate using electrodeposition coating, and method for manufacturing the same |
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