JPS5519853A - Method of manufacturing circuit board - Google Patents

Method of manufacturing circuit board

Info

Publication number
JPS5519853A
JPS5519853A JP9274778A JP9274778A JPS5519853A JP S5519853 A JPS5519853 A JP S5519853A JP 9274778 A JP9274778 A JP 9274778A JP 9274778 A JP9274778 A JP 9274778A JP S5519853 A JPS5519853 A JP S5519853A
Authority
JP
Japan
Prior art keywords
circuit board
manufacturing circuit
manufacturing
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9274778A
Other languages
Japanese (ja)
Inventor
Tetsurou Inoue
Masashi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akai Electric Co Ltd
Original Assignee
Akai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akai Electric Co Ltd filed Critical Akai Electric Co Ltd
Priority to JP9274778A priority Critical patent/JPS5519853A/en
Publication of JPS5519853A publication Critical patent/JPS5519853A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP9274778A 1978-07-29 1978-07-29 Method of manufacturing circuit board Pending JPS5519853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9274778A JPS5519853A (en) 1978-07-29 1978-07-29 Method of manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9274778A JPS5519853A (en) 1978-07-29 1978-07-29 Method of manufacturing circuit board

Publications (1)

Publication Number Publication Date
JPS5519853A true JPS5519853A (en) 1980-02-12

Family

ID=14062999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9274778A Pending JPS5519853A (en) 1978-07-29 1978-07-29 Method of manufacturing circuit board

Country Status (1)

Country Link
JP (1) JPS5519853A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252989A (en) * 1985-08-31 1987-03-07 日本メクトロン株式会社 Metal based double-side flexible circuit board
JPS6286896A (en) * 1985-10-14 1987-04-21 銘光目黒工業株式会社 Manufacture of printed circuit board with metal core
WO2011002031A1 (en) * 2009-06-30 2011-01-06 三洋電機株式会社 Substrate for mounting components, and semiconductor module
JP2012104794A (en) * 2010-11-05 2012-05-31 Samsung Electro-Mechanics Co Ltd Heat dissipation substrate and manufacturing method for the same
JP2013127122A (en) * 2010-12-24 2013-06-27 Samsung Electro-Mechanics Co Ltd Heat radiating substrate using electrodeposition coating, and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106052A (en) * 1975-02-04 1976-09-20 Takatsugu Komatsu INSATSUHAISENKIBANNOSEIZOHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106052A (en) * 1975-02-04 1976-09-20 Takatsugu Komatsu INSATSUHAISENKIBANNOSEIZOHOHO

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252989A (en) * 1985-08-31 1987-03-07 日本メクトロン株式会社 Metal based double-side flexible circuit board
JPS6286896A (en) * 1985-10-14 1987-04-21 銘光目黒工業株式会社 Manufacture of printed circuit board with metal core
WO2011002031A1 (en) * 2009-06-30 2011-01-06 三洋電機株式会社 Substrate for mounting components, and semiconductor module
JPWO2011002031A1 (en) * 2009-06-30 2012-12-13 三洋電機株式会社 Device mounting substrate and semiconductor module
US9024446B2 (en) 2009-06-30 2015-05-05 Panasonic Intellectual Property Management Co., Ltd. Element mounting substrate and semiconductor module
JP2012104794A (en) * 2010-11-05 2012-05-31 Samsung Electro-Mechanics Co Ltd Heat dissipation substrate and manufacturing method for the same
JP2013127122A (en) * 2010-12-24 2013-06-27 Samsung Electro-Mechanics Co Ltd Heat radiating substrate using electrodeposition coating, and method for manufacturing the same

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