JPS5585097A - Method of fabricating multilayer circuit board - Google Patents
Method of fabricating multilayer circuit boardInfo
- Publication number
- JPS5585097A JPS5585097A JP15757078A JP15757078A JPS5585097A JP S5585097 A JPS5585097 A JP S5585097A JP 15757078 A JP15757078 A JP 15757078A JP 15757078 A JP15757078 A JP 15757078A JP S5585097 A JPS5585097 A JP S5585097A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- fabricating multilayer
- fabricating
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15757078A JPS5585097A (en) | 1978-12-22 | 1978-12-22 | Method of fabricating multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15757078A JPS5585097A (en) | 1978-12-22 | 1978-12-22 | Method of fabricating multilayer circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5585097A true JPS5585097A (en) | 1980-06-26 |
Family
ID=15652567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15757078A Pending JPS5585097A (en) | 1978-12-22 | 1978-12-22 | Method of fabricating multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585097A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856499A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Thick film circuit board and method of producing same |
JP2006066859A (en) * | 2004-08-24 | 2006-03-09 | Samsung Electro Mech Co Ltd | Manufacturing method for package substrate with fine circuit pattern by anodic oxidation |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50144079A (en) * | 1974-05-09 | 1975-11-19 | ||
JPS5380564A (en) * | 1976-12-24 | 1978-07-17 | Nippon Electric Co | Method of producing multilayer thin film circuit |
-
1978
- 1978-12-22 JP JP15757078A patent/JPS5585097A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50144079A (en) * | 1974-05-09 | 1975-11-19 | ||
JPS5380564A (en) * | 1976-12-24 | 1978-07-17 | Nippon Electric Co | Method of producing multilayer thin film circuit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856499A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Thick film circuit board and method of producing same |
JPS6364918B2 (en) * | 1981-09-30 | 1988-12-14 | ||
JP2006066859A (en) * | 2004-08-24 | 2006-03-09 | Samsung Electro Mech Co Ltd | Manufacturing method for package substrate with fine circuit pattern by anodic oxidation |
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