JPS5585097A - Method of fabricating multilayer circuit board - Google Patents

Method of fabricating multilayer circuit board

Info

Publication number
JPS5585097A
JPS5585097A JP15757078A JP15757078A JPS5585097A JP S5585097 A JPS5585097 A JP S5585097A JP 15757078 A JP15757078 A JP 15757078A JP 15757078 A JP15757078 A JP 15757078A JP S5585097 A JPS5585097 A JP S5585097A
Authority
JP
Japan
Prior art keywords
circuit board
multilayer circuit
fabricating multilayer
fabricating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15757078A
Other languages
Japanese (ja)
Inventor
Yuukichi Takeda
Kenji Yamamoto
Keiji Kurosawa
Kiyoshi Takagi
Takeo Tokiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15757078A priority Critical patent/JPS5585097A/en
Publication of JPS5585097A publication Critical patent/JPS5585097A/en
Pending legal-status Critical Current

Links

JP15757078A 1978-12-22 1978-12-22 Method of fabricating multilayer circuit board Pending JPS5585097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15757078A JPS5585097A (en) 1978-12-22 1978-12-22 Method of fabricating multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15757078A JPS5585097A (en) 1978-12-22 1978-12-22 Method of fabricating multilayer circuit board

Publications (1)

Publication Number Publication Date
JPS5585097A true JPS5585097A (en) 1980-06-26

Family

ID=15652567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15757078A Pending JPS5585097A (en) 1978-12-22 1978-12-22 Method of fabricating multilayer circuit board

Country Status (1)

Country Link
JP (1) JPS5585097A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856499A (en) * 1981-09-30 1983-04-04 株式会社東芝 Thick film circuit board and method of producing same
JP2006066859A (en) * 2004-08-24 2006-03-09 Samsung Electro Mech Co Ltd Manufacturing method for package substrate with fine circuit pattern by anodic oxidation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144079A (en) * 1974-05-09 1975-11-19
JPS5380564A (en) * 1976-12-24 1978-07-17 Nippon Electric Co Method of producing multilayer thin film circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144079A (en) * 1974-05-09 1975-11-19
JPS5380564A (en) * 1976-12-24 1978-07-17 Nippon Electric Co Method of producing multilayer thin film circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856499A (en) * 1981-09-30 1983-04-04 株式会社東芝 Thick film circuit board and method of producing same
JPS6364918B2 (en) * 1981-09-30 1988-12-14
JP2006066859A (en) * 2004-08-24 2006-03-09 Samsung Electro Mech Co Ltd Manufacturing method for package substrate with fine circuit pattern by anodic oxidation

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