JPS6062948U - thermal print head - Google Patents

thermal print head

Info

Publication number
JPS6062948U
JPS6062948U JP15491783U JP15491783U JPS6062948U JP S6062948 U JPS6062948 U JP S6062948U JP 15491783 U JP15491783 U JP 15491783U JP 15491783 U JP15491783 U JP 15491783U JP S6062948 U JPS6062948 U JP S6062948U
Authority
JP
Japan
Prior art keywords
print head
thermal print
heat generating
substrate
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15491783U
Other languages
Japanese (ja)
Other versions
JPH028773Y2 (en
Inventor
隆也 長畑
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to JP15491783U priority Critical patent/JPS6062948U/en
Publication of JPS6062948U publication Critical patent/JPS6062948U/en
Application granted granted Critical
Publication of JPH028773Y2 publication Critical patent/JPH028773Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の実施例を示す断面図、第２−　図は
一部の平面図である。 １・・・基板、ＩＡ・・・端縁、２・・・グレーズ、３
・・・共通導電層、３Ｂ・・・端部、４・・・絶縁層、
５・・・抵抗層、５Ａ・・・発熱部分、６，７・・・導
電層。FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a partial plan view. 1... Board, IA... Edge, 2... Glaze, 3
... Common conductive layer, 3B... End portion, 4... Insulating layer,
5... Resistance layer, 5A... Heat generating portion, 6, 7... Conductive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の一方の端縁に接近して設けた発熱部分をはさんで
対をなす導電層を設け、対をなす前記導電層のうち前記
端縁側に設けられた導電層の端部を、前記発熱部分と前
記基板との間に絶縁層を介して設は返れた共通導電層の
端部に重ねて形成してなるサーマルプリントヘッド。A pair of conductive layers is provided sandwiching a heat generating portion provided close to one edge of the substrate, and an end portion of the conductive layer provided on the edge side of the pair of conductive layers is connected to the heat generating portion. A thermal print head formed by overlapping an end of a common conductive layer which is placed between the part and the substrate with an insulating layer interposed therebetween.
JP15491783U 1983-10-05 1983-10-05 thermal print head Granted JPS6062948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15491783U JPS6062948U (en) 1983-10-05 1983-10-05 thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15491783U JPS6062948U (en) 1983-10-05 1983-10-05 thermal print head

Publications (2)

Publication Number Publication Date
JPS6062948U true JPS6062948U (en) 1985-05-02
JPH028773Y2 JPH028773Y2 (en) 1990-03-02

Family

ID=30342296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15491783U Granted JPS6062948U (en) 1983-10-05 1983-10-05 thermal print head

Country Status (1)

Country Link
JP (1) JPS6062948U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54123039A (en) * 1978-03-17 1979-09-25 Nippon Toki Kk Thermosensitive recording head
JPS5565576A (en) * 1978-11-09 1980-05-17 Fujitsu Ltd Thermal head
JPS5586195A (en) * 1978-12-25 1980-06-28 Fujitsu Ltd Method of fabricating multilayer circuit board
JPS56125343U (en) * 1980-02-25 1981-09-24

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54123039A (en) * 1978-03-17 1979-09-25 Nippon Toki Kk Thermosensitive recording head
JPS5565576A (en) * 1978-11-09 1980-05-17 Fujitsu Ltd Thermal head
JPS5586195A (en) * 1978-12-25 1980-06-28 Fujitsu Ltd Method of fabricating multilayer circuit board
JPS56125343U (en) * 1980-02-25 1981-09-24

Also Published As

Publication number Publication date
JPH028773Y2 (en) 1990-03-02

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