JPS5864094A - Multilayer circuit board with connecting pins - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer wiring board with connection pins, in which external connection pins are attached to the multilayer wiring board.

With the advancement of integrated circuit technology, the mounting of elements on a substrate has progressed from mounting two individual transistors to mounting seven semiconductor integrated circuits and then mounting multiple LSIs. Accordingly, in hybrid integrated circuits, it is necessary to configure circuits at high density on the same board, and since the circuit density that can be mounted on a single board is limited, it is necessary to further improve the mounting density. , multilayer wiring boards with multilayered internal wiring are used.

Conventionally, used as a multilayer wiring board for thick film hybrid integrated circuits.

A multilayer ceramic substrate with excellent insulation, heat dissipation properties, and mechanical strength is used.

In FIG. 1, external connection pins are attached to this type of multilayer wiring board. FIG. 2 is a front sectional view showing the configuration of a conventional example of a multilayer wiring board with connection pins. In the figure, 1 is a first multilayer wiring board, which includes a multilayer ceramic board 11, and Mo or W.
2 is a connecting pin. As shown in the figure, the first conductor 1
2 is wired inside and on the surface of the multilayer ceramic plate 11 in which a plurality of ceramic materials are laminated. This multilayer wiring board with connection pins has a structure such as this when the ceramic material is in a state before sintering, a so-called green sheet state.
Wiring is screen printed on the green sheet using conductor yeast such as MO or W, and the multiple ceramics and materials wired in this way are aligned and stacked, and then sintered to form the first multilayer wiring. It was manufactured by forming a substrate 1 and then soldering connection pins 2.

In the above manufacturing process, the alignment of multiple wired ceramic materials is determined by mechanical precision, so as the number of layers increases, the density of wiring must be reduced, and there is a limit to the number of layers. At the same time, due to high-temperature sintering, there were limits to reducing the thickness of the individual ceramic materials and making the line width of the wiring finer. Furthermore, since it is sintered at high temperatures,
The first conductor 12 used for the wiring is made of ceramic, a high melting point metal that can withstand the sintering temperature of the material, that is, the above-mentioned M
The electrical resistance of these first conductors 12 is also unfavorable in terms of the circuit characteristics of the substrate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer wiring board with connection pins in which a high-density and fine multilayer wiring board is formed.

Another object of the present invention is to provide a multilayer wiring board with connection pins that makes it possible to use not only Mo and W, which are suitable for high-temperature sintering, but also ordinary conductive metals with low electrical resistance. Our goal is to provide the following.

According to the present invention, a first multilayer wiring board comprising a multilayer ceramic board in which a plurality of ceramics and materials are laminated, and a first conductor wired inside and on the surface of the multilayer ceramic board; In the multilayer wiring board with connection pins having external connection pins electrically connected to the first conductor, a plurality of low temperature fired inorganic insulating materials are laminated on the surface of the first multilayer wiring board. A second multilayer wiring board consisting of a multilayer inorganic insulating board and a second conductor wired inside and on the surface of the multilayer inorganic insulating board is electrically
a multilayer wiring board formed to be connected to a multilayer wiring board, and a multilayer wiring board with connecting pins having external connection pins fixed to the second conductor on the surface of the second multilayer wiring board; ! can get.

Two embodiments of the present invention will be described below with reference to the drawings. Fig. 2 is a front sectional view showing the configuration of one embodiment of the present invention. In the figure, 1 is a first multilayer wiring board, 2' is a connection pin, and 20 is a second multilayer wiring board. As in the conventional case, the first multilayer wiring board l includes a multilayer ceramic board 11 in which a plurality of ceramic materials are laminated, and a first board made of MO or W wired inside and on the surface of the multilayer ceramic board 11.
The manufacturing method is the same as that of the conventional one, and the second conductor 21 is wired inside and on the surface of the multilayer inorganic insulating board 21. As shown in the figure, a first multilayer wiring board 1 and a second multilayer wiring board 2
0 is formed so that both groove electric bodies 12 and 22 are electrically connected to each other on the surface, and a connecting pin 2 is provided.
is the second conductor 22 on the surface of the second multilayer wiring board 20
is fixed to. Examples of low-temperature fired inorganic insulating materials used here include Sumiceram (trade name) manufactured by Jumi Ihigaku Kogyo ■, which can be fired at 100 degrees Celsius, and Aron Ceramic manufactured by Toagosei Chemical Industry ■ (trade name), which can be fired at 150 degrees Celsius. be.

With such a configuration, the number of laminated layers of the conventional first multilayer wiring board 1 can be reduced, so there is no need to take too much consideration to the accuracy of nine-position alignment, and the density can itself be higher than that of the conventional one.

On the other hand, since the second multilayer wiring board is composed of 20 companies and low-temperature fired inorganic insulating boards 21, the thickness of each board can be made thinner, and the wiring lines can also be made finer. Therefore,
Although the new board is constructed by arranging both groove electric bodies 12 and 22 to be electrically connected on the surface of each of the two boards 1,200, the external shape is almost the same as that of the conventional board. , we were able to construct a very high-density and fine substrate.

In addition, by combining the second multilayer wiring board 20, which is suitable for miniaturization and high density, and the first multilayer wiring board 1, which has excellent heat dissipation properties and mechanical strength as described above, each We were able to construct a multilayer wiring board that takes advantage of the board's features.

Furthermore, since the connecting pins 2 are attached to the second multilayer wiring board 20 side, they do not impede heat dissipation from the first multilayer wiring board l. Therefore, the multilayer wiring board with connection pins according to the present invention has excellent insulation properties, heat dissipation properties, and mechanical strength as well as the conventional ones.

Since the second multilayer wiring board 20 uses a multilayer inorganic insulating board 21 made of a low-temperature fired inorganic insulating material, the second conductor 22 wired inside and on the surface of the multilayer inorganic insulating board 21 is As the material, ordinary conductive metal Cu, whose electrical resistance is a fraction of that of conventional Mo or W, can be used, and the number of laminated layers of the first multilayer wiring board 1 is reduced.
The circuit characteristics of the board have also improved compared to the conventional one.

As is clear from the above description, according to the present invention.

It is possible to construct a multilayer wiring board with high-density and fine i-continuation.

[Brief explanation of drawings]

FIG. 1 is a front sectional view showing the configuration of a conventional example. FIG. 2 is a front sectional view showing the configuration of an embodiment of the present invention. Explanation of symbols: 1 is the first multilayer wiring board, 2 is the connection pin. 11 is a multilayer ceramic plate, and 12 is a first conductor. 20 is a second multilayer wiring board, 21 is a multilayer inorganic insulating board, 2
2 represents the second conductor, respectively.

Claims (1)

[Claims] 1. A first multilayer wiring board composed of a multilayer ceramic board in which a plurality of ceramics and materials are laminated, and a first conductor wired inside and on the surface of the multilayer ceramic board, and the first conductor A multilayer wiring board with connection pins that has external connection pins that are electrically connected to the body, a multilayer inorganic insulating board in which a plurality of low-temperature fired inorganic insulating materials are laminated, and the inside and surface of the multilayer inorganic insulating board. A multilayer wiring board formed by forming a second multilayer wiring board composed of a wired second conductor such that both groove electric bodies are electrically connected to the surface of the first multilayer wiring board. A multilayer wiring board with connection pins, wherein the external connection pins are fixed to the second conductor on the surface of the second multilayer wiring board.