JP3188911B2 - Multilayer ceramic substrate, method of manufacturing the same, and semiconductor package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic substrate comprising a low-temperature fired ceramic sheet and having a thick-film resistance portion, more specifically, a multilayer ceramic substrate for accommodating a semiconductor chip or for a hybrid IC, etc. And a manufacturing method thereof, and a semiconductor package.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic equipment, high-density mounting of semiconductor elements and the like has become important. In addition, high density and high integration of semiconductor elements and the like are required, and accordingly, the number of input / output terminals increases, and at the same time, the amount of heat generated by the semiconductor chip tends to increase. In order to cope with these, a package or a multilayer wiring board for mounting a semiconductor chip is required to have the following characteristics, for example. (A) Excellent thermal characteristics such as heat dissipation and heat resistance. (B) Excellent electrical characteristics such as low resistance of the internal wiring of the package and low dielectric constant of the material constituting the package. (C) High reliability (D) Efficient and highly reliable connection to other circuits (E) Small size Also, as the operation speed of the semiconductor element increases, the semiconductor chip is housed. Demands for packages such as less degradation of transmission signals and high signal propagation speed are increasing.

As a semiconductor package that can satisfy such various requirements, a pin grid array (hereinafter abbreviated as PGA) package in which a plurality of ceramic sheets are stacked,
Land grid array (hereinafter abbreviated as LGA) package or quad flat package (hereinafter Q)
FP). Note that these packages may be collectively referred to as a ceramic package hereinafter.

At present, alumina is mainly used as a material for such a ceramic package. For example,
The LGA package can be usually manufactured by the following method.

First, a ceramic green sheet formed by adding a predetermined organic binder (binder), a plasticizer, and the like to raw material alumina powder is processed into a predetermined size, and a hole for a through hole or a via hole is formed by punching or the like. Apply processing. Next, the holes provided in the ceramic green sheet are filled with a metal paste made of tungsten or molybdenum (hereinafter, referred to as a high melting point metal), and these metal pastes are screen-printed on the ceramic green sheet. Thus, a conductive circuit portion including a through hole or a via hole, a land portion (also called a pad portion) as a connection portion with an external circuit, a connection terminal portion with a semiconductor chip (for example, a wire bonding portion), and the like are formed.

After a predetermined number of such ceramic green sheets (usually 3 to 8 layers) are prepared, they are laminated and co-fired at a high temperature of about 1500 to 1600 ° C. in a reducing atmosphere such as hydrogen gas. In order to prevent melting at the time of simultaneous firing at a high temperature of about 1500 to 1600 ° C., a metal paste composed of a high melting point metal is usually used, but the high melting point metal has a high resistance value and a gold wire is applied to the surface of the high melting point metal. It is difficult to perform wire bonding or soldering using the method described above. Therefore, after the high-temperature simultaneous firing, the land portions and the connection terminal portions are subjected to gold plating or nickel plating, and finally the plated terminal portions are cut.

[0007] Other ceramic packages, such as PGA packages, can be fabricated in substantially the same manner as LGA packages.

On the other hand, as the demand for high-density mounting has increased,
To cope with this, multilayer wiring technology is required. A plurality of ceramic green sheets containing alumina as a main component are laminated on one kind of multilayer wiring layer,
There is a multilayer ceramic wiring substrate manufactured by simultaneous firing at a high temperature of ゜ C. This multilayer ceramic wiring board also
Substantially, it can be manufactured by the same method as the above-described method of manufacturing the LGA package. Active elements and passive elements are incorporated in the manufactured multilayer ceramic wiring board.

In order to reduce the size of the entire network,
In some cases, the resistance element is incorporated in a ceramic package. Further, a resistance element is usually incorporated in the multilayer ceramic wiring board. Hereinafter, the multilayer ceramic substrate includes a ceramic package and a multilayer ceramic wiring substrate. In this case, generally, a resistor, which is a discrete component, is attached to the surface of the multilayer ceramic substrate, or a thick-film resistance portion is formed on the surface of the multilayer ceramic substrate. When a resistor is mounted on the surface of a multilayer ceramic substrate, the overall size of the multilayer ceramic substrate becomes large, or the design of the multilayer ceramic substrate is restricted. It is desirable to form it. Therefore, usually, after manufacturing a multilayer ceramic substrate, a resistive paste is screen-printed on the surface thereof, and then the resistive paste is fired to form a thick-film resistive portion.

[0010]

As described above, in the conventional method for manufacturing a multilayer ceramic substrate, the region where the thick-film resistance portion can be formed is only the outermost surface and the smooth surface of the multilayer ceramic substrate. For example, when fabricating an LGA package having a terminating resistor composed of a thick-film resistance part in the middle of a signal line, the thick-film resistance part may
It can only be formed on the outermost surface of the A package. FIG. 8 is a schematic sectional view of a conventional LGA package having such a structure.

The conventional LGA package 10 shown in FIG.
0 is composed of a plurality of laminated low-temperature fired ceramic sheets 118, for example. The LGA package 100 includes a connection terminal portion 112 for connecting to a semiconductor chip, a land portion 114, and conductive circuit portions 116A, 116B, 116C. The conductor circuit portion 116A is a signal line, the conductor circuit portion 1
16B is a ground layer or a power supply wiring layer,
C is a beer hall. L with no land formed
On the outermost surface of the GA package, a thick film resistor 124 is formed. In FIG. 8, boundaries between the low-temperature fired ceramic sheets are not shown for simplification of the drawing.

It is necessary to electrically connect the thick-film resistance portion 124, which is a terminating resistor, to a signal line and a power supply wiring layer (or a ground layer). This thick-film resistance section is provided with, for example, 1
It is desirable to form it in a region as close as possible to the semiconductor chip as shown at 22. However, it is practically impossible to form a thick-film resistance portion in the region 122 of the fired LGA package by a printing method.

Therefore, as shown in FIG.
24 and the conductor circuit portion 116A serving as a signal wiring, and the thick film resistor portion 124 and the conductor circuit portion 116B serving as a ground layer or a power supply wiring layer must be connected via via holes 116C extending between layers of the ceramic sheet.

Therefore, when designing a multilayer ceramic substrate, it is necessary to design and lay out a conductor circuit portion such as a signal line so as to avoid a via hole, and the degree of freedom in the design and layout of the conductor circuit portion is reduced. There is a problem that the conductor circuit portion becomes complicated. Further, since the length of the signal transmission path becomes longer, the length of the impedance mismatching portion from the signal line to the thick-film resistance portion becomes longer.
There is a problem that the signal waveform is deteriorated.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a multilayer ceramic substrate and a method of manufacturing the same, which have a high degree of freedom in circuit design and do not cause deterioration in transmission signal waveforms, and a semiconductor package to which such a multilayer ceramic substrate is applied. It is in.

[0016]

According to the present invention, there is provided a multilayer ceramic substrate comprising: a first substrate member comprising a plurality of laminated low-temperature fired ceramic sheets;
A first substrate member attached to the surface of the first substrate member and formed of a low-temperature fired ceramic sheet, and formed on the surface of the first substrate member for connection with electric / electronic components. And a second connection terminal for connection to an external circuit, and a first connection terminal and a second connection terminal formed inside and on the surface of the first substrate member. A first conductive circuit portion to be electrically connected, a thick-film resistance portion formed on the surface of the second substrate member, and formed inside and on the surface of the second substrate member, and formed on the surface of the first substrate member. A second conductor circuit section for electrically connecting the formed first conductor circuit section and the thick-film resistance section is provided.

In the multilayer ceramic substrate of the present invention,
The second conductive circuit portion formed on the surface of the second substrate member is electrically and mechanically connected to the first conductive circuit portion formed on the surface of the first substrate member with solder or a conductive material. Thus, it is desirable that the second substrate member is attached to the surface of the first substrate member. The second connection terminal can be, for example, a land grid array.

The first object of the present invention for achieving the above object is as follows.
The method for manufacturing a multilayer ceramic substrate according to the aspect of
A first connection terminal portion for connection to an electric / electronic component, a second connection terminal portion for connection to an external circuit, and a first connection terminal portion and a first connection terminal portion are formed on a ceramic green sheet for low-temperature firing. After the first conductive circuit portions for electrically connecting the first and second connection terminal portions are formed using the first metal paste, a plurality of ceramic green sheets are laminated, and the ceramic green sheets and the first metal paste are formed. (B) forming a second conductive circuit portion on a ceramic green sheet for low-temperature firing using a second metal paste; A low-temperature simultaneous firing of the sheet and the second metal paste is performed, and a thick-film resistance portion is formed on the ceramic sheet after the low-temperature simultaneous firing by using the resistance paste. A step of preparing a substrate member,
(C) attaching the second substrate member to the surface of the first substrate member, and electrically connecting the second conductor circuit portion to the first conductor circuit portion formed on the surface of the first substrate member; Process,
Characterized by comprising:

Further, a method for manufacturing a multilayer ceramic substrate according to a second aspect of the present invention for achieving the above object, comprises:
(A) In a ceramic green sheet for low-temperature firing, a region where a first connection terminal portion for connection to an electric / electronic component and a second connection terminal portion for connection to an external circuit should be formed. A first conductive circuit portion for electrically connecting to the first connection terminal portion is formed using a first metal paste, and then a plurality of ceramic green sheets are laminated to form a ceramic green sheet and a first metal paste. (B) forming a second conductive circuit portion on a ceramic green sheet for low-temperature firing using a second metal paste; A low-temperature simultaneous firing of the sheet and the second metal paste is performed, and a thick-film resistance portion is formed on the ceramic sheet after the low-temperature simultaneous firing by using the resistance paste. A step of preparing a substrate member,
(C) attaching the second substrate member to the surface of the first substrate member, and electrically connecting the second conductor circuit portion to the first conductor circuit portion formed on the surface of the first substrate member; And
Forming a second connection terminal portion for connection to an external circuit in the area on the surface of the first substrate member.

In the method for manufacturing a multilayer ceramic substrate according to the first and second aspects of the present invention, the second conductive circuit portion formed on the surface of the second substrate member is provided on the surface of the first substrate member. By electrically and mechanically connecting to the formed first conductor circuit portion with solder or a conductive material,
It is desirable to attach the second substrate member to the surface of the first substrate member. In the method for manufacturing a multilayer ceramic substrate according to the first aspect of the present invention, the second connection terminal portion may be, for example, a land grid array.

Further, the semiconductor package of the present invention for achieving the above object comprises (a) a first substrate member comprising a plurality of laminated low-temperature fired ceramic sheets and having a recess for accommodating a semiconductor chip; A first connecting terminal portion attached to a surface of the first substrate member and formed of a low-temperature fired ceramic sheet, formed in the concave portion, for connecting to a semiconductor chip; A second connection terminal portion formed on the surface of the first substrate member for connection to an external circuit; and a first connection terminal portion formed on the inside and on the surface of the first substrate member. A first conductive circuit section for electrically connecting the connection terminal section, and a second conductive circuit section;
A thick-film resistance portion formed on the surface of the first substrate member; a first conductive circuit portion and a thick-film resistance portion formed on the inside and surface of the second substrate member and formed on the surface of the first substrate member A multilayer ceramic substrate having a second conductive circuit portion for electrically connecting the lid and the second conductive circuit portion; (b) a lid fixed above the concave portion; and (c) a lid formed in a space formed by the concave portion and the lid. And a semiconductor chip electrically connected to the first connection terminal portion.

As a form of the semiconductor package of the present invention,
(Multilayer ceramic substrate of LGA package structure + semiconductor chip of wire bonding formation), (Multilayer ceramic substrate of PGA package structure + semiconductor chip of flip chip formation), (Multilayer ceramic substrate of LGA package structure + semiconductor chip of flip chip formation) , (PG
For example, a multilayer ceramic substrate having an A package structure + a semiconductor chip formed by wire bonding) or (QFP + semiconductor chips of various types) can be exemplified.

As the multilayer ceramic substrate, specifically,
LGA package, PGA package, or QFP
And a multilayer ceramic wiring board for a hybrid IC, a multilayer multi-chip module, and the like.

In the package of the present invention, the term "ceramic green sheet for low temperature firing" means an unfired ceramic sheet, and the term "low temperature firing ceramic sheet" means a ceramic sheet obtained by simultaneously firing a ceramic green sheet at a low temperature. . The low-temperature fired ceramic sheet constituting the first substrate member and the low-temperature fired ceramic sheet constituting the second substrate member may be the same or different materials.

As a raw material of the low-temperature fired ceramic sheet,
For example, (borosilicate glass + alumina), (lead borosilicate glass + alumina), (alumina calcium borosilicate glass + alumina), (alumina magnesium magnesium borosilicate glass + quartz or quartz glass), (borosilicate glass + Glass-ceramic composite materials such as (borosilicate glass + quartz + alumina + cordierite), (cordierite-β-spodemene-based material), (cordierite-based ZnO.Mg)
O.Al ₂ O ₃ .SiO ₂ material), (cordierite B _{2
O 3 · MgO · Al 2 O} 3 · SiO 2 based materials) crystallized glass-based material, such _{as, Al 2 O 3 · CaO ·} SiO 2 · MgO · B 2
Non-glass-based materials such as O ₃ and Al ₂ O ₃ .CaO.SiO ₂ .BaO.B ₂ O ₃ can be used, but are not limited thereto.

The point is that the metal (for example, having a melting point of 10) constituting the metal paste for forming the connection terminal portion and the conductor circuit portion.
65 ° C gold, melting point 1085 ° C copper, melting point 962 ° C
And a material that can be fired at a temperature lower than the melting point of nickel (melting point: 1455 ° C.) (for example, 800 to 1000 ° C.), and can be fired at a temperature at which the thick-film resistor portion can be fired. It should just be.

As the electric / electronic component, for example, a semiconductor chip can be exemplified, but it is not limited to this, and any component may be used.

The first and second conductor circuit portions include conductor circuits formed between the low-temperature fired ceramic sheets, and through holes and via holes formed in the low-temperature fired ceramic sheets. Further, the conductor circuit portion is formed on the surface of the low-temperature fired ceramic sheet. The conductor circuit portion functions as a signal line, a ground portion, a power supply wiring portion, and the like.
As a metal paste for forming these circuit parts,
A known metal paste made of gold, silver, copper, or the like can be used. Also, the thick-film resistance portion is made of RuO ₂ or M ₂ Ru ₂ .
Known resistance pastes such as O _7-X , MoO ₃ , and LaB ₆ can be used.

[0029]

According to the present invention, the first substrate member and the second substrate member are separately manufactured, so that the second substrate member can be mounted at an optimum position on the first substrate member, and the circuit design can be improved. High degree of freedom. Moreover, for example, if the second substrate member is attached near the first connection terminal portion, the signal transmission path length from the electric / electronic component to the thick-film resistance portion can be minimized. The problem that the waveform is deteriorated can be avoided.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. The same reference numerals in the drawings denote the same elements and the same components.

Embodiment 1 Embodiment 1 relates to a multilayer ceramic substrate of the present invention having an LGA package structure suitable for mounting a semiconductor chip by a wire bonding method, and a semiconductor package using such a multilayer ceramic substrate. The multilayer ceramic substrate of Example 1 is manufactured by the method for manufacturing a multilayer ceramic substrate according to the first aspect of the present invention.

FIG. 1 is a schematic cross-sectional view of a multilayer ceramic substrate 1 according to a first embodiment, which comprises a first substrate member 10 composed of a plurality of laminated low-temperature fired ceramic sheets 18,
And a second substrate member 20 made of a low-temperature fired ceramic sheet. The shape of the second substrate member 20 is a letter "B". The second substrate member may be composed of one low-temperature fired ceramic sheet or may be composed of a plurality of laminated low-temperature fired ceramic sheets. The multilayer ceramic substrate 1 further includes a first connection terminal section 12, a second connection terminal section 14, a first conductor circuit section 16, a thick film resistor section 24, and a second conductor circuit section 22.

The first connection terminal portion 12 is formed on the surface of the first substrate member 10 and is provided for connection with an electric / electronic component. In the first embodiment,
The electronic component is a semiconductor chip. Further, the first connection terminal section 12 is a connection terminal section for wire bonding.
The second connection terminal portion 14 is also formed on the surface of the first substrate member 10 and is provided for connection with an external circuit (for example, a circuit formed on a printed wiring board). In the first embodiment, the second connection terminal unit 14 is a land grid array. A large number of the second connection terminals 14 are arranged on the bottom surface of the multilayer ceramic substrate at a pitch of, for example, 2.54 mm in the vertical and horizontal directions.

The first conductive circuit section 16 is formed inside and on the surface of the first substrate member 10 and electrically connects the first connection terminal section 12 and the second connection terminal section 14. ing. More specifically, the first conductive circuit section 16 is formed on the low-temperature fired ceramic sheet 18 or between the low-temperature fired ceramic sheets 18. The first conductive circuit portion 16 is also a via hole or a through hole formed in the low-temperature fired ceramic sheet 18. The first conductive circuit portion functions as a signal line, a ground portion, a power supply wiring portion, and the like.

The thick-film resistance portion 24 is formed on the surface of the second substrate member 20. Also, the second conductor circuit section 22
Is formed inside and on the surface of the second substrate member 20, and electrically connects the first conductor circuit portion 16 formed on the surface of the first substrate member 10 to the thick-film resistance portion 24. ing.

The multilayer ceramic substrate 1 has a recess 30 for accommodating a semiconductor chip. Example 1
, The recess 30 penetrates the multilayer ceramic substrate 1. In the drawings, the boundary between the low-temperature fired ceramic sheets in the first substrate member is not shown for simplification of the drawing.

The second substrate member 20 includes the first substrate member 1
0 is attached to the recess 30. Second substrate member 2
0 is desirably arranged near the first connection terminal portion 12. The second conductive circuit section 22 is electrically connected to the first conductive circuit section 16 formed on the surface of the first substrate member.

This connection can be made by using a conductive material (not shown) such as solder, brazing or silver paste. In order to attach the second substrate member 20 to the surface of the first substrate member 10, an adhesive or the like may be used. However, by electrically and mechanically connecting the second conductive circuit portion 22 to the first conductive circuit portion 16 by a conductive material such as solder, brazing, or silver paste, the second substrate member 2
0 is preferably attached to the surface of the first substrate member 10.

The multilayer ceramic substrate 1 has a second connection terminal 1 which is a land (sometimes called a pad).
4 is connected to a circuit formed on a printed wiring board (not shown). Specifically, the multilayer ceramic substrate may be electrically and mechanically connected to the circuit formed on the printed wiring board by soldering, or may be electrically and mechanically connected to the circuit formed on the printed wiring board. The multilayer ceramic substrate may be electrically and mechanically connected to the socket (not shown).

FIG. 2 is a schematic sectional view of the semiconductor package of the first embodiment. In this semiconductor package,
The semiconductor chip 50 is housed in the recess 30 formed in the first substrate member 10 and is electrically connected to the first connection terminal section 12 by a gold wire 52. The semiconductor chip 50 is fixed to the heat radiating plate 62 by a known method, and the heat radiating plate 62 is attached to the upper portion of the recess 30 by a known method. Further, a lid 60 is attached to a lower portion of the recess 30 by a known method.

The thick film resistor section 24 is electrically connected to the semiconductor chip 50 by a gold wire 52. In some cases, the thick-film resistance portion 24 is connected to the first connection terminal portion 12 and the gold wire 52.
Are electrically connected by

The multilayer ceramic substrate of the present invention shown in FIG. 1 can be manufactured by the following method for manufacturing a multilayer ceramic substrate according to the first embodiment of the present invention.

A product name "Green Tape" manufactured by DuPont
“851TA” (114 μm thick) was used as a ceramic green sheet for low-temperature firing. The composition of the ceramic green sheet is as follows. Borosilicate glass 55% by weight Alumina 30% by weight Silica 7% by weight Acrylic resin 8% by weight

[Step-100] The ceramic green sheets 40A and 40B for low-temperature firing are subjected to an outer shape punching process and a punching process for forming holes for via holes and through holes by punching.

[Step-110] Next, in order to produce a first substrate member, a ceramic green sheet 40A is formed.
A first connection terminal portion 1 for connection to a semiconductor chip.
2. Each of the second connection terminal portion 14 which is a land portion and the first conductor circuit portion 16 which electrically connects the first connection terminal portion and the second terminal portion are formed by a first metal paste. It is formed using.

[Step-110A] For this purpose, first, a first metal paste is embedded in a hole, and the first metal paste is dried to remove a solvent contained in the first metal paste. I do. As the first metal paste,
For example, those having the solid components outlined below can be used. Gold powder 95% by weight Ethyl cellulose resin 5% by weight In this way, a part of the first conductive circuit portion 16 is formed in the hole.

[Step-110B] Next, the first connection terminal portion 12, the second connection terminal portion 14, and the first connection terminal portion and the second connection terminal portion are formed on the ceramic green sheet 40A. A part of the first conductive circuit portion 16 to be electrically connected is formed by using, for example, a first metal paste by a screen printing method. As the first metal paste, for example,
Those having the following solid components can be used. The composition of the first metal paste used for filling the holes and the composition of the first metal paste used in this step were slightly changed. Gold powder 80% by weight Oxide 2% by weight Ethyl cellulose resin 18% by weight Alternatively, the second connection terminal portion 14 can be formed using a first metal paste having the following solid components. Silver powder 60% by weight Palladium 10% by weight Oxide and glass 10% by weight Phenolic resin 20% by weight The solid components of the first metal paste used in [Step-110A] and [Step-110B] are examples. Yes, the components can be changed as appropriate.

[Step-120] In order to manufacture the second substrate member, the ceramic green sheet 40 for low-temperature firing is used.
B, the second conductive circuit portion 22 is formed using a second metal paste.

[Step-120A] For this purpose, first, a second metal paste is buried in a hole provided in the ceramic green sheet 40B, and the second metal paste is dried. The solvent contained in is removed. As the second metal paste, for example,
The first metal paste used in [Step-110A] can be used. Thus, the second conductive circuit portion 2 is provided in the hole.
2 is formed.

[Step-120B] Next, on the ceramic green sheet 40B, in order to electrically connect the thick film resistance portion formed in a later step and the first conductor circuit portion 16,
A part of the second conductive circuit portion 22 is formed by using, for example, a second metal paste by a screen printing method. As the second metal paste, for example, the first metal paste used in [Step-110B] can be used. In this step, the second conductive circuit portion 22 is formed on one surface of the ceramic green sheet on which the thick film resistor portion is not formed.

The second substrate member may be constituted by one ceramic green sheet or a plurality of ceramic green sheets. In the case of a plurality of ceramic green sheets, a second conductor circuit portion is formed on each of the ceramic green sheets corresponding to the outermost layer, and a second conductor including a through hole is formed in the ceramic green sheet corresponding to the intermediate layer. What is necessary is just to form a circuit part. Alternatively, a signal line or the like may be formed on a ceramic green sheet corresponding to the intermediate layer.

Thus, as shown in FIGS. 3A and 3B, various ceramic green sheets are formed.
The order of [Step-110A] and [Step-110B], and the order of [Step-120A] and [Step-120B] can be changed as appropriate.

[Step-130] Next, in order to fabricate the first substrate member, [Step-11]
0A] and a plurality of ceramic green sheets produced in [Step-110B] are laminated, hot-pressed, and bonded and integrated with each other. When the second substrate member is manufactured by laminating a plurality of ceramic green sheets, [Step-120A] and [Step-1] are performed by using a hot press.
20B], and a plurality of ceramic green sheets are laminated and hot-pressed to be bonded and integrated with each other.

Thereafter, the laminated ceramic green sheets and the first metal paste are simultaneously fired at a low temperature by a usual method to produce a first substrate member 10 (see FIG. 4A). At the same time, the ceramic green sheet and the second metal paste prepared in [Step-120A] and [Step-120B] are simultaneously fired at a low temperature to prepare a precursor 20A for the second substrate member (FIG. 4). (B)).
Precursor 2 for these first and second substrate members
OA can be produced by low-temperature simultaneous firing in the same firing step. Although the firing temperature depends on the material used, it is usually 800 to 1000 ° C. The firing conditions such as the atmosphere and firing time in the firing step may be optimized depending on the material used. Thus, as shown in FIGS. 4A and 4B, a precursor 20A for the first substrate member 10 and the second substrate member can be manufactured. After that, in the same manner as in [Step-120B], a second metal paste is screen-printed on the other surface of the precursor 20A of the second substrate member, and then the second metal paste is fired. Thus, it is desirable to form a part of the second conductive circuit portion 22 on the other surface of the precursor 20A of the second substrate member.

[Step-140] Thereafter, the thick film resistor portion 24 is formed on the other surface of the precursor 20A of the second substrate member by using a resistor paste. As the resistance paste, for example, a material having a solid component outlined below can be used. Ruthenium oxide 45% by weight Silver binder 8% by weight Palladium 5% by weight Glass 20% by weight Ethyl cellulose resin 22% by weight Or ruthenium oxide 40% by weight Pyrochlore 5% by weight Glass 30% by weight Ethyl cellulose type resin 25% by weight The formation can be performed, for example, by a screen printing method using the above-mentioned resistance paste. still,
The solid component of the resistance paste is an example, and the component can be appropriately changed. Incidentally, the thick film resistance portion 24 is formed by the following steps:
120B] so as to be in contact with a part of the second conductive circuit portion 22 formed in step S120B]. Then, the resistance paste formed on the precursor 20A of the second substrate member is fired by a usual method to produce the second substrate member 20 (FIG. 4C).
reference). Although the firing temperature depends on the material used, it is usually 800 to 1000 ° C. The firing conditions such as the atmosphere and firing time in the firing step may be optimized depending on the material used.

[Step-150] Next, the second substrate member 20 is attached to the surface of the first substrate member 10, and the first conductive circuit portion 16 formed on the surface of the first substrate member is mounted.
To the second conductor circuit section 22 electrically and mechanically. This connection can be made by using a conductive material such as solder, brazing, or silver paste.
In addition, if necessary, the thick-film resistance part 24 is trimmed,
The resistance value is set to a desired value.

Thus, the multilayer ceramic substrate 1 schematically shown in FIG. 1 can be manufactured.

Example 2 Example 2 relates to a multilayer ceramic substrate of the present invention having a PGA package structure suitable for mounting a flip-chip type semiconductor chip, and a semiconductor package using such a multilayer ceramic substrate.
The multilayer ceramic substrate of Example 2 is manufactured by the method for manufacturing a multilayer ceramic substrate according to the second aspect of the present invention.

The multilayer ceramic substrate 1A of the second embodiment, whose schematic cross-sectional view is shown in FIG. 5, is different from the first embodiment in the structure of the first connection terminal 12A and the second connection terminal 14A. The multilayer ceramic substrate 1A according to the second embodiment includes a first substrate member 10 formed of a plurality of laminated low-temperature fired ceramic sheets 18 and a second substrate formed of a low-temperature fired ceramic sheet attached to the surface of the first substrate member. Substrate member 2
0. The shape of the second substrate member 20 is
It has the shape of "b". The multilayer ceramic substrate 1A includes a first
Connection terminal portion 12A, second connection terminal portion 14A, first conductor circuit portion 16, thick film resistor portion 24, second conductor circuit portion 2
2 is further provided.

The multilayer ceramic substrate 1 has a recess 30 for accommodating a semiconductor chip. The second board member 20 is attached to the recess 30 of the first board member 10. It is desirable that the second substrate member 20 be disposed near the first connection terminal portion 12A.

The first connection terminal portion 12A is formed on the surface of the first substrate member 10 and is provided for connection with an electric / electronic component. In the second embodiment, the electric / electronic component is a semiconductor chip. Further, the first connection terminal portion 12A is a connection terminal portion having a bump for flip chip bonding.

The second connection terminal portion 14A is also formed on the surface of the first substrate member 10 and is provided for connection to an external circuit (for example, a circuit formed on a printed wiring board). . In the second embodiment, the second connection terminal 1
4A is a pin grid array. The second connection terminal portion 14A is a large number of pins arranged on the bottom surface of the multilayer ceramic substrate in the vertical and horizontal directions at a pitch of, for example, 2.54 mm.

The first conductor circuit section 16 is formed inside and on the surface of the first substrate member 10 and electrically connects the first connection terminal section 12A and the second connection terminal section 14A. ing. The first conductive circuit portion 16, the thick film resistor portion 24, the second
Substrate member 20, second conductive circuit portion 22, thick film resistor portion 2
4 is the same as in the first embodiment, and a detailed description thereof will be omitted.

The multilayer ceramic substrate 1 is connected to a circuit formed on a printed wiring board (not shown) through a second connection terminal 14A composed of pins. Specifically, the multilayer ceramic substrate may be electrically and mechanically connected to the circuit formed on the printed wiring board by soldering pins to the circuit formed on the printed wiring board, or electrically and mechanically connected to the circuit formed on the printed wiring board. Pins may be inserted into mechanically connected sockets (not shown) to electrically and mechanically connect the multilayer ceramic substrate.

FIG. 6 is a schematic sectional view of the semiconductor package of the second embodiment. In this semiconductor package,
The semiconductor chip 50 is housed in the concave portion 30 formed in the first substrate member 10, and the connection terminal portion provided on the semiconductor chip 50 and the first connection terminal portion 12A are electrically and mechanically soldered. It is connected to the. Further, a lid 60 also serving as a heat radiating plate is mounted on the upper portion of the concave portion 30 by a known method.

The thick film resistor section 24 is connected to the semiconductor chip 50 via the first terminal connection section 12A, the first conductor circuit section 16, and the second conductor circuit section 22. In some cases, the thick-film resistance portion 24 is connected to the first conductor circuit portion 16 and the gold wire 5.
2 may be electrically connected.

The multilayer ceramic substrate of the present invention shown in FIG. 5 can be manufactured by the method for manufacturing a multilayer ceramic substrate according to the second embodiment of the present invention described below.

[Step-200] In the same manner as in Example 1, a trade name “Green Tape 851TA” (having a thickness of 114 μm) manufactured by DuPont was used as a ceramic green sheet for low-temperature firing. The ceramic green sheets 40A and 40B for low-temperature firing are subjected to an outer shape punching process and a punching process for forming holes for via holes and through holes by punching.

[Step-210] Next, in order to manufacture the first substrate member, the ceramic green sheet 40A is formed.
A first connection terminal portion 1 for connection to a semiconductor chip.
Each of the first conductive circuit portions 16 for electrically connecting the 2A and the first connection terminal portion to a region where a second connection terminal portion for connection to an external circuit is to be formed, It is formed using a metal paste.

[Step-210A] For this purpose, first, a first metal paste is buried in a hole, and the first metal paste is dried to remove a solvent contained in the first metal paste. I do. The solid component of the first metal paste can be, for example, the same as the metal paste used in [Step-110A] of Example 1, but is not limited thereto. Thus, the conductor circuit portion 16 is provided in the hole.
Is formed.

[Step-210B] Next, on the ceramic green sheet 40A, a first conductor circuit for electrically connecting the first connection terminal portion 12A and the region where the second connection terminal portion is to be formed. A part of the portion 16 is formed using the first metal paste by, for example, a screen printing method. The solid component of the first metal paste was prepared, for example, by using the [Step-
110B], but is not limited thereto. In addition, [Step-
The order of [210A] and [Step-210B] can be changed as appropriate.

[Step-220C] In the second embodiment,
The second connection terminal portion 14A is composed of a pin. Therefore, the second
A first conductive circuit portion 16 composed of a brazing portion for brazing a pin is formed on a surface portion of a ceramic green sheet corresponding to a region where a connection terminal portion is to be formed, for example, by nickel by screen printing. It is formed using a first metal paste as a main component.

[Step-220] To produce a second substrate member, ceramic green sheets for low-temperature firing are
The second conductive circuit section 22 is formed using a second metal paste. This step can be the same as [Step-120] in Example 1, and the detailed description is omitted.

[Step-230] Next, in the same manner as in [Step-130] of Example 1, a plurality of ceramic green sheets were laminated and hot-pressed, bonded and integrated with each other, and then processed in a usual manner. , Ceramic green sheet and first
Is fired simultaneously at a low temperature to form a first substrate member 1
0 is produced. At the same time, in some cases, a plurality of ceramic green sheets are laminated and hot-pressed, and the ceramic green sheets and the second metal paste are simultaneously fired at a low temperature to produce a precursor 20A for the second substrate member. Thereafter, the second substrate member 20A has a second surface on the other surface thereof.
It is desirable to form a part of the conductor circuit portion 22 of FIG. Further, the thick film resistor portion 24 is formed on the other surface of the precursor 20A of the second substrate member by the same method as in [Step-140] of the first embodiment, and the second substrate member 20 is manufactured. .

[Step-240] Next, the second substrate member 20 is mounted on the surface of the first substrate member 10, and the first conductive circuit portion 16 formed on the surface of the first substrate member is formed.
To the second conductor circuit section 22 electrically and mechanically. This connection can be made by using a conductive material such as solder, brazing, or silver paste.

[Step-250] On the surface of the first substrate member,
A second connection terminal portion 14A including pins for connection to an external circuit is formed in a region where the second connection terminal portion is to be formed. More specifically, a pin is brazed to a part 16 of the first conductive circuit portion composed of a brazing portion. In addition, [Step-24]
0] and [Step-250] may be reversed.

Thus, the multilayer ceramic substrate schematically shown in FIG. 5 can be manufactured.

(Embodiment 3) The semiconductor package of Embodiment 3 whose schematic sectional view is shown in FIG. 7 is a modification of the semiconductor package described in Embodiment 2. The difference from the semiconductor package of the second embodiment is that the second connection terminal portion has the LGA structure as in the first embodiment, and the lid 60, the concave portion 30, and the semiconductor chip 50 also function as a heat sink. And the space 32 formed between them is filled with the heat conductive material 34. By filling the space 32 with the heat conductive material 34, the heat generated in the semiconductor chip 50 is effectively transmitted to the lid 60 and is radiated to the outside.

As the heat conductive material 34, for example, a composition composed of a metal oxide such as silicon oil and ZnO, a filler composed of alumina powder or aluminum nitride powder, or a metal powder such as copper or aluminum is dispersed. It consists of a resin composition and the like.

The semiconductor chip 50 is desirably of a flip chip type, and the first connection terminal portion 12A desirably has a flip chip bonding bump. The multilayer ceramic substrate in the third embodiment can be basically manufactured by a combination of the manufacturing methods described in the first and second embodiments, and a detailed description of the manufacturing method is omitted. It is to be noted that, on the surface of the multilayer ceramic substrate in contact with the lid 60, for example, a metal paste layer having a solid component of 58% by weight of silver powder, 7% by weight of palladium, and 35% by weight of ethylcellulose resin may be formed. preferable.

The first connection terminal 12A of the first substrate member
After electrically and mechanically connecting the semiconductor chip 50 to
The space 32 formed between the lid 60, the recess 30 and the semiconductor chip 50 is filled with a heat conductive material 34. Thereafter, the lid 60 is placed on the upper portion of the concave portion 30 and the whole is heated to melt the metal paste layer.
To the top. Thus, a semiconductor package is completed.

Although the present invention has been described based on the embodiments, the present invention is not limited to these embodiments. In the first embodiment (multilayer ceramic substrate of LGA package structure + semiconductor chip of wire bonding formation)
In the second embodiment (multilayer ceramic substrate having a PGA package structure + flip chip-formed semiconductor chip), the third embodiment
In the above, the semiconductor package of (multilayer ceramic substrate of LGA package structure + semiconductor chip of flip chip formation) has been described. However, (multilayer ceramic substrate of PGA package structure + semiconductor chip of wire bonding formation) or (QFP + various types of semiconductor chips) Various semiconductor packages such as semiconductor chips) are also included in the semiconductor package of the present invention.

In the embodiments, the multilayer ceramic substrate and the semiconductor package for exclusively accommodating the semiconductor chip have been described. However, for example, for a hybrid IC, for a multi-layer multi-chip module, etc., the structure is basically the same as that of the first, second, or third embodiment except that a recess for accommodating a semiconductor chip is not formed. Are also included in the multilayer ceramic substrate of the present invention. These multilayer ceramic wiring boards can also be manufactured by the method for manufacturing a multilayer ceramic board of the present invention described in the first or second embodiment.

The structures of the multilayer ceramic substrate and the semiconductor package are merely examples, and can be appropriately designed and changed. The various materials used are also examples, and can be appropriately changed depending on the characteristics required for the multilayer ceramic substrate and the semiconductor package. Various metal pastes, for example, a copper paste, may be used as the metal paste.

A second substrate member is formed on a ceramic green sheet for low-temperature firing, and a second conductive circuit portion is formed using a second metal paste. Then, the ceramic green sheet and the second metal paste are simultaneously fired at a low temperature. Further, the process of forming a thick-film resistance portion using a resistance paste on the ceramic sheet after the low-temperature co-firing, and then firing the resistance paste to prepare the same was described. However, depending on the material composition of the resistor paste to be used, the second conductor circuit portion is formed using the second metal paste and the thick film resistor portion is formed using the resistor paste on the ceramic green sheet for low-temperature firing. After the formation, the ceramic green sheet, the second metal paste, and the resistance paste are simultaneously fired at a low temperature, whereby the second substrate member can be manufactured.
Thereby, the first and second substrate members can be manufactured in the same low-temperature simultaneous firing step, and the manufacturing steps (especially, the firing step) of the first and second substrate members can be reduced.

[0086]

According to the present invention, since the first substrate member and the second substrate member are separately manufactured, the second substrate member can be mounted at an optimum position on the first substrate member.
High degree of freedom in circuit design. Moreover, for example, if the second substrate member is attached near the first connection terminal portion, the signal transmission path length from the electric / electronic component to the thick-film resistance portion can be minimized. The problem that the waveform is deteriorated can be avoided.

For example, when a semiconductor package having a terminating resistor in the middle of a signal line is designed, a terminating resistor comprising a thick film resistor can be built in the semiconductor package. Therefore, the layout of the other layers is not restricted, and the design of the signal lines, via holes, and the like becomes very easy. Further, the length of the wiring portion extending from the signal line to the thick film resistance portion, and the length from the thick film resistance portion to the first conductor circuit portion and the second conductor circuit portion such as the ground portion or the power supply wiring portion are minimized. Can be

The relative permittivity ε of the low-temperature fired ceramic sheet is about 4.5 to 8, which is lower than that of a normal high-temperature fired ceramic sheet containing alumina as a main component. Unlikely to happen. Moreover, about 100 low-temperature fired ceramic sheets can be laminated,
The degree of freedom in designing a multilayer ceramic substrate or a semiconductor package can be increased.

Further, when the first substrate member and the second substrate member are manufactured using the same material, the first and second substrate members may have the same or substantially the same thermal expansion coefficient. As a result, the reliability of the connection between the first substrate member and the second substrate member can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a multilayer ceramic substrate according to a first embodiment.

FIG. 2 is a schematic cross-sectional view of the semiconductor package according to the first embodiment.

FIG. 3 is a schematic cross-sectional view before laminating ceramic green sheets for low-temperature firing for explaining a method of manufacturing the multilayer ceramic substrate of Example 1.

FIG. 4 is a schematic cross-sectional view after stacking ceramic green sheets for low-temperature firing for explaining a method of manufacturing the multilayer ceramic substrate of Example 1.

FIG. 5 is a schematic sectional view of a multilayer ceramic substrate according to a second embodiment.

FIG. 6 is a schematic sectional view of a semiconductor package according to a second embodiment.

FIG. 7 is a schematic sectional view of a semiconductor package according to a third embodiment.

FIG. 8 is a schematic sectional view of a conventional LGA package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 1st board member 12 1st connection terminal part 14 2nd connection terminal part 16 1st conductor circuit part 18 Low temperature firing ceramic sheet 20 2nd board member 22 2nd conductor circuit part 24 Thick film resistance part REFERENCE SIGNS 30 concave portion 32 space 34 thermal conductive material 40A, 40B ceramic green sheet 50 semiconductor chip 52 gold wire 60 lid 62 heat sink

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 23/12 B (72) Inventor Yoshikazu Murakami 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Kawa ▲ saki ▼ Hidetoshi 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Arthur T. Murphy 1-28-4, Kakigizaka, Meguro-ku, Tokyo (72) Inventor Tsuyoshi Suzuki 360-3, One-cho, Tenpaku-ku, Nagoya-shi, Aichi Prefecture (72) Inventor Yasuhiko Mizutani 1058 Double-shaped moat, Komaki-shi, Aichi Japan Nippon Insulator Co., Ltd. Komaki Ryo (56) References JP-A-61-274397 (JP, A) JP-A-1-222498 (JP, A) JP-A-1-102997 (JP, A) JP-A-4-42597 (JP, A) JP-A-1-270293 (JP, A) JP-A-61 −285739 (JP, A) JP-A-62-171197 (JP, A) JP-A-1-321695 (JP, A) JP-A-1-152688 (JP, A) JP-A-4-26184 (JP, A) JP-A-6-5828 ( JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/46 H01L 23/12

Claims (8)

(57) [Claims] A first substrate member composed of a plurality of laminated low-temperature fired ceramic sheets; and a second substrate member attached to the surface of the first substrate member and composed of a low-temperature fired ceramic sheet. A first connection terminal portion formed on the surface of the first substrate member for connection to an electric / electronic component and a second connection terminal portion for connection to an external circuit; a first substrate member A first conductor circuit portion formed on the inside and on the surface of the first substrate and electrically connecting the first connection terminal portion and the second connection terminal portion; and a thick film resistor formed on the surface of the second substrate member A second conductor circuit formed inside and on the surface of the second substrate member and electrically connecting the first conductor circuit portion formed on the surface of the first substrate member to the thick-film resistance portion A multilayer ceramic substrate comprising: 2. The method according to claim 1, wherein the second conductive circuit portion formed on the surface of the second substrate member is electrically connected to the first conductive circuit portion formed on the surface of the first substrate member using solder or a conductive material. The multilayer ceramic substrate according to claim 1, wherein the second substrate member is attached to a surface of the first substrate member by mechanical connection. 3. The multilayer ceramic substrate according to claim 1, wherein the second connection terminal is a land grid array. 4. A first connecting terminal portion for connecting to an electric / electronic component, a second connecting terminal portion for connecting to an external circuit, and a ceramic green sheet for low temperature firing. After forming the first conductive circuit portion for electrically connecting the first connection terminal portion and the second connection terminal portion using the first metal paste, a plurality of the ceramic green sheets are laminated, A step of simultaneously firing the ceramic green sheet and the first metal paste at a low temperature to produce a first substrate member;
After forming the conductor circuit portion using the second metal paste, the ceramic green sheet and the second metal paste are simultaneously fired at a low temperature, and further, a thick film resistor portion is formed on the ceramic sheet after the low temperature simultaneous firing. B) forming a second substrate member by baking the resistance paste after forming the first substrate member; (c) attaching the second substrate member to the surface of the first substrate member; and Electrically connecting the second conductive circuit portion to the first conductive circuit portion formed on the surface of the multi-layer ceramic substrate. 5. A first connecting terminal portion for connection to an electric / electronic component and a second connecting terminal portion for connection to an external circuit are formed on a ceramic green sheet for low-temperature firing. A first conductive circuit portion for electrically connecting a region to be connected and a first connection terminal portion is formed using a first metal paste, and a plurality of the ceramic green sheets are laminated to form a ceramic green sheet. And a step of simultaneously firing the first metal paste at a low temperature to produce a first substrate member; and (b) forming a second green sheet on the ceramic green sheet for low-temperature firing.
After forming the conductor circuit portion using the second metal paste, the ceramic green sheet and the second metal paste are simultaneously fired at a low temperature, and further, a thick film resistor portion is formed on the ceramic sheet after the low temperature simultaneous firing. B) forming a second substrate member by baking the resistance paste after forming the second substrate member; and (c) attaching the second substrate member to the surface of the first substrate member. Electrically connecting the second conductor circuit portion to the first conductor circuit portion formed on the surface of
Forming a second connection terminal portion for connection to an external circuit in the region on the surface of the first substrate member. 6. The second conductive circuit portion formed on the surface of the second substrate member is electrically connected to the first conductive circuit portion formed on the surface of the first substrate member using solder or a conductive material. 5. The method according to claim 4, wherein the second substrate member is attached to a surface of the first substrate member by mechanical connection.
A method for manufacturing a multilayer ceramic substrate according to claim 5. 7. The method according to claim 4, wherein the second connection terminal is a land grid array. 8. A first substrate member comprising a plurality of laminated low-temperature fired ceramic sheets and having a recess for accommodating a semiconductor chip, and a low-temperature fired ceramic attached to a surface of the first substrate member. A first connection terminal portion formed of a second substrate member made of a sheet, formed in the recess, for connection to a semiconductor chip; and an external circuit formed on a surface of the first substrate member. And a first conductor formed on the inside and on the surface of the first substrate member for electrically connecting the first connection terminal and the second connection terminal. A circuit portion; a thick-film resistance portion formed on the surface of the second substrate member; and a first conductor circuit formed inside and on the surface of the second substrate member and formed on the surface of the first substrate member. Second conductor circuit for electrically connecting the portion and the thick-film resistance portion (B) a lid fixed to the upper portion of the recess, (c) housed in a space formed by the recess and the lid, and electrically connected to the first connection terminal portion. A semiconductor package, comprising: a semiconductor chip connected to the semiconductor package.