JPS5856424A - パタ−ン形成法 - Google Patents
パタ−ン形成法Info
- Publication number
- JPS5856424A JPS5856424A JP15546781A JP15546781A JPS5856424A JP S5856424 A JPS5856424 A JP S5856424A JP 15546781 A JP15546781 A JP 15546781A JP 15546781 A JP15546781 A JP 15546781A JP S5856424 A JPS5856424 A JP S5856424A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- stencil
- stencil layer
- substrate
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15546781A JPS5856424A (ja) | 1981-09-30 | 1981-09-30 | パタ−ン形成法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15546781A JPS5856424A (ja) | 1981-09-30 | 1981-09-30 | パタ−ン形成法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5856424A true JPS5856424A (ja) | 1983-04-04 |
JPH0119257B2 JPH0119257B2 (enrdf_load_html_response) | 1989-04-11 |
Family
ID=15606683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15546781A Granted JPS5856424A (ja) | 1981-09-30 | 1981-09-30 | パタ−ン形成法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5856424A (enrdf_load_html_response) |
-
1981
- 1981-09-30 JP JP15546781A patent/JPS5856424A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0119257B2 (enrdf_load_html_response) | 1989-04-11 |
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