JPS5853837A - 電子回路部品の接続方法 - Google Patents

電子回路部品の接続方法

Info

Publication number
JPS5853837A
JPS5853837A JP56152426A JP15242681A JPS5853837A JP S5853837 A JPS5853837 A JP S5853837A JP 56152426 A JP56152426 A JP 56152426A JP 15242681 A JP15242681 A JP 15242681A JP S5853837 A JPS5853837 A JP S5853837A
Authority
JP
Japan
Prior art keywords
bumps
chip
electronic circuit
bonding
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56152426A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338737B2 (enExample
Inventor
Kazuhito Ozawa
小沢　一仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP56152426A priority Critical patent/JPS5853837A/ja
Publication of JPS5853837A publication Critical patent/JPS5853837A/ja
Publication of JPH0338737B2 publication Critical patent/JPH0338737B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes

Landscapes

  • Wire Bonding (AREA)
JP56152426A 1981-09-25 1981-09-25 電子回路部品の接続方法 Granted JPS5853837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56152426A JPS5853837A (ja) 1981-09-25 1981-09-25 電子回路部品の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56152426A JPS5853837A (ja) 1981-09-25 1981-09-25 電子回路部品の接続方法

Publications (2)

Publication Number Publication Date
JPS5853837A true JPS5853837A (ja) 1983-03-30
JPH0338737B2 JPH0338737B2 (enExample) 1991-06-11

Family

ID=15540252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56152426A Granted JPS5853837A (ja) 1981-09-25 1981-09-25 電子回路部品の接続方法

Country Status (1)

Country Link
JP (1) JPS5853837A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
JPH08139299A (ja) * 1994-11-04 1996-05-31 Nec Corp ハイブリッド型赤外線センサ
US6061248A (en) * 1996-07-19 2000-05-09 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
EP1001462A3 (en) * 1998-11-10 2000-12-13 Nec Corporation Semiconductor device with connection terminals in the form of a grid array
US6316735B1 (en) 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board
EP1223617B1 (en) * 2000-12-22 2007-04-25 Matsushita Electric Industrial Co., Ltd. Multichip module with a plurality of semiconductor chips mounted on a semiconductor substrate
JP2007242782A (ja) * 2006-03-07 2007-09-20 Fujikura Ltd 半導体装置及び電子装置
JP2008112878A (ja) * 2006-10-31 2008-05-15 Seiko Instruments Inc 半導体装置
JP2009124099A (ja) * 2007-10-24 2009-06-04 Panasonic Corp 半導体チップの電極構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4992548A (enExample) * 1973-01-10 1974-09-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4992548A (enExample) * 1973-01-10 1974-09-04

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
JPH08139299A (ja) * 1994-11-04 1996-05-31 Nec Corp ハイブリッド型赤外線センサ
US6061248A (en) * 1996-07-19 2000-05-09 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
US6566165B1 (en) 1996-07-19 2003-05-20 Matsushita Electric Industrial Co., Ltd. Method for mounting a semiconductor chip to a semiconductor chip-mounting board
US6787922B2 (en) 1996-07-19 2004-09-07 Matsushita Electric Industrial Co., Ltd. Semiconductor chip—mounting board
US6316735B1 (en) 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board
EP1001462A3 (en) * 1998-11-10 2000-12-13 Nec Corporation Semiconductor device with connection terminals in the form of a grid array
US6459161B1 (en) 1998-11-10 2002-10-01 Nec Corporation Semiconductor device with connection terminals in the form of a grid array
EP1223617B1 (en) * 2000-12-22 2007-04-25 Matsushita Electric Industrial Co., Ltd. Multichip module with a plurality of semiconductor chips mounted on a semiconductor substrate
JP2007242782A (ja) * 2006-03-07 2007-09-20 Fujikura Ltd 半導体装置及び電子装置
JP2008112878A (ja) * 2006-10-31 2008-05-15 Seiko Instruments Inc 半導体装置
JP2009124099A (ja) * 2007-10-24 2009-06-04 Panasonic Corp 半導体チップの電極構造

Also Published As

Publication number Publication date
JPH0338737B2 (enExample) 1991-06-11

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