JPS5844748A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5844748A JPS5844748A JP14329981A JP14329981A JPS5844748A JP S5844748 A JPS5844748 A JP S5844748A JP 14329981 A JP14329981 A JP 14329981A JP 14329981 A JP14329981 A JP 14329981A JP S5844748 A JPS5844748 A JP S5844748A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- field insulating
- active region
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14329981A JPS5844748A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14329981A JPS5844748A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5844748A true JPS5844748A (ja) | 1983-03-15 |
JPH0117256B2 JPH0117256B2 (enrdf_load_stackoverflow) | 1989-03-29 |
Family
ID=15335514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14329981A Granted JPS5844748A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844748A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057451A (en) * | 1990-04-12 | 1991-10-15 | Actel Corporation | Method of forming an antifuse element with substantially reduced capacitance using the locos technique |
US5780352A (en) * | 1995-10-23 | 1998-07-14 | Motorola, Inc. | Method of forming an isolation oxide for silicon-on-insulator technology |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548950A (en) * | 1978-10-03 | 1980-04-08 | Toshiba Corp | Manufacturing of semiconductor device |
-
1981
- 1981-09-10 JP JP14329981A patent/JPS5844748A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548950A (en) * | 1978-10-03 | 1980-04-08 | Toshiba Corp | Manufacturing of semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057451A (en) * | 1990-04-12 | 1991-10-15 | Actel Corporation | Method of forming an antifuse element with substantially reduced capacitance using the locos technique |
US5780352A (en) * | 1995-10-23 | 1998-07-14 | Motorola, Inc. | Method of forming an isolation oxide for silicon-on-insulator technology |
Also Published As
Publication number | Publication date |
---|---|
JPH0117256B2 (enrdf_load_stackoverflow) | 1989-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2519819B2 (ja) | コンタクトホ―ルの形成方法 | |
US5130271A (en) | Method of manufacturing a semiconductor device having no step at the boundary between self aligned p- or n- type impurity regions | |
JPH0828424B2 (ja) | 半導体装置およびその製造方法 | |
JPS5844748A (ja) | 半導体装置の製造方法 | |
JPS6040702B2 (ja) | 半導体集積回路装置の製造方法 | |
JPH0210730A (ja) | 集積回路チップ上の電界効果トランジスタ用のフィールド・アイソレーション形成方法と構造 | |
JPS60258957A (ja) | Soi型半導体装置の製造方法 | |
JPS6231507B2 (enrdf_load_stackoverflow) | ||
JPS6227542B2 (enrdf_load_stackoverflow) | ||
JPS5933271B2 (ja) | 半導体装置の製造方法 | |
JPS61135136A (ja) | 半導体装置の製造方法 | |
JPS6163059A (ja) | 半導体装置 | |
JPS6038872B2 (ja) | 半導体装置の製造方法 | |
JP2943855B2 (ja) | 半導体装置の製造方法 | |
JPS582047A (ja) | 半導体装置の製造方法 | |
JPS58170012A (ja) | 半導体装置の製造方法 | |
JPS60128633A (ja) | 半導体装置ならびにその製造方法 | |
JPH0576769B2 (enrdf_load_stackoverflow) | ||
JPS58184739A (ja) | 半導体装置の製造方法 | |
JPS5829620B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
JPH04129275A (ja) | 半導体装置 | |
JPS5950087B2 (ja) | 半導体装置の製造方法 | |
JPS60193358A (ja) | 半導体装置の製造方法 | |
JPS60218873A (ja) | 半導体装置の製造方法 | |
JPS5943098B2 (ja) | 半導体装置の製造方法 |