JPS5830759B2 - スクリ−ン印刷ペ−ストおよび厚膜導電性回路 - Google Patents
スクリ−ン印刷ペ−ストおよび厚膜導電性回路Info
- Publication number
- JPS5830759B2 JPS5830759B2 JP3239576A JP3239576A JPS5830759B2 JP S5830759 B2 JPS5830759 B2 JP S5830759B2 JP 3239576 A JP3239576 A JP 3239576A JP 3239576 A JP3239576 A JP 3239576A JP S5830759 B2 JPS5830759 B2 JP S5830759B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- glass
- mol
- screen printing
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007650 screen-printing Methods 0.000 title claims description 18
- 239000011521 glass Substances 0.000 claims description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000012298 atmosphere Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000011787 zinc oxide Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 239000000292 calcium oxide Substances 0.000 claims description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- 229910052810 boron oxide Inorganic materials 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims description 3
- 229910001947 lithium oxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 150000002894 organic compounds Chemical group 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000004020 conductor Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910001676 gahnite Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7509288A FR2305478A1 (fr) | 1975-03-25 | 1975-03-25 | Pate serigraphiable pour conducteurs en couches epaisses a deposer sur un substrat ceramique et procede de preparation de couches conductrices utilisant une telle pate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51119973A JPS51119973A (en) | 1976-10-20 |
| JPS5830759B2 true JPS5830759B2 (ja) | 1983-07-01 |
Family
ID=9153042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3239576A Expired JPS5830759B2 (ja) | 1975-03-25 | 1976-03-24 | スクリ−ン印刷ペ−ストおよび厚膜導電性回路 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5830759B2 (cg-RX-API-DMAC10.html) |
| DE (1) | DE2610303C2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2305478A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1489031A (cg-RX-API-DMAC10.html) |
| IT (1) | IT1066171B (cg-RX-API-DMAC10.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2397469A1 (fr) * | 1977-02-22 | 1979-02-09 | Panoduz Anstalt | Procede pour deposer une couche de metal conducteur sur un support isolant |
| FR2490210A1 (fr) | 1980-09-15 | 1982-03-19 | Labo Electronique Physique | Melange de depart pour une composition fortement resistante, encre serigraphiable constituee avec et circuits electriques ainsi realises |
| JPS5811565A (ja) * | 1981-07-14 | 1983-01-22 | Murata Mfg Co Ltd | 導電塗料 |
| FR2513751B1 (fr) * | 1981-09-28 | 1986-04-11 | France Etat | Initiateur pyrotechnique electrique a effet joule |
| JPS5879837A (ja) * | 1981-10-31 | 1983-05-13 | Tdk Corp | 磁器コンデンサ |
| FR2564455B1 (fr) * | 1984-05-18 | 1986-09-19 | Labo Electronique Physique | Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine |
| FR2566386A1 (fr) * | 1984-06-22 | 1985-12-27 | Labo Electronique Physique | Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique |
| FR2575331B1 (fr) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | Boitier pour composant electronique |
| JPS6248097A (ja) * | 1985-08-28 | 1987-03-02 | 日本特殊陶業株式会社 | 多層回路基板の製造法 |
| JPS62211994A (ja) * | 1986-03-13 | 1987-09-17 | 三井金属鉱業株式会社 | 多層回路基板およびその製造法 |
| US4808770A (en) * | 1986-10-02 | 1989-02-28 | General Electric Company | Thick-film copper conductor inks |
| US6399230B1 (en) * | 1997-03-06 | 2002-06-04 | Sarnoff Corporation | Multilayer ceramic circuit boards with embedded resistors |
| JP2006107776A (ja) * | 2004-09-30 | 2006-04-20 | Toshiba Corp | 画像表示装置の製造方法 |
| DE102005007933A1 (de) * | 2005-02-10 | 2006-08-17 | Schott Ag | Verfahren zum Herstellen einer Heizleiterschicht auf einem Substrat und damit hergestellte Kochplatte |
| CN112259279B (zh) * | 2020-10-19 | 2022-03-18 | 厦门翰森达电子科技有限公司 | 一种汽车玻璃环保水性导电银浆 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2993815A (en) * | 1959-05-25 | 1961-07-25 | Bell Telephone Labor Inc | Metallizing refractory substrates |
-
1975
- 1975-03-25 FR FR7509288A patent/FR2305478A1/fr active Granted
-
1976
- 1976-03-12 DE DE19762610303 patent/DE2610303C2/de not_active Expired
- 1976-03-22 GB GB1141276A patent/GB1489031A/en not_active Expired
- 1976-03-22 IT IT2143276A patent/IT1066171B/it active
- 1976-03-24 JP JP3239576A patent/JPS5830759B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1489031A (en) | 1977-10-19 |
| FR2305478B1 (cg-RX-API-DMAC10.html) | 1981-09-25 |
| JPS51119973A (en) | 1976-10-20 |
| IT1066171B (it) | 1985-03-04 |
| DE2610303A1 (de) | 1976-10-07 |
| FR2305478A1 (fr) | 1976-10-22 |
| DE2610303C2 (de) | 1983-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2993815A (en) | Metallizing refractory substrates | |
| KR910005524B1 (ko) | 구리도체 조성물 | |
| US5258335A (en) | Low dielectric, low temperature fired glass ceramics | |
| JPS5830759B2 (ja) | スクリ−ン印刷ペ−ストおよび厚膜導電性回路 | |
| US3440182A (en) | Copper/vanadium oxide compositions,noble metal metalizing compositions containing vanadium oxide additives,and electrical conductor elements made therewith | |
| JPS6230638A (ja) | ガラス−セラミツク複合基板の製造方法 | |
| JPS58223678A (ja) | 金属化層を有するＳｉＣ焼結体とその製法 | |
| JPH0715101A (ja) | 酸化物セラミック回路基板及びその製造方法 | |
| JPH01128488A (ja) | 厚膜銅導体インキ | |
| US4004057A (en) | Gold conductor compositions | |
| JPH0653594B2 (ja) | 導体組成物 | |
| US3615734A (en) | Brazeable compositions | |
| US3970590A (en) | Gold conductor compositions | |
| WO2001044143A1 (en) | Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same | |
| KR100585909B1 (ko) | 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물 | |
| US3960777A (en) | Gold compositions | |
| JP2598872B2 (ja) | ガラスセラミックス多層基板 | |
| JPH0322306A (ja) | 接着性良好な金属ペースト | |
| JPH06199541A (ja) | ガラスセラミックス組成物 | |
| JP2003511838A (ja) | 導電体組成物 | |
| JPH0349108A (ja) | 銅導体組成物 | |
| JPH05170552A (ja) | メタライズ層を有する窒化アルミニウム基板とそのメタライズ方法 | |
| JPH05221759A (ja) | メタライズ層を有する窒化アルミニウム基板とそのメタライズ方法 | |
| JPH0238557B2 (cg-RX-API-DMAC10.html) | ||
| JPS6115522B2 (cg-RX-API-DMAC10.html) |