JPS5825476A - 高速スパツタリング装置及び方法 - Google Patents
高速スパツタリング装置及び方法Info
- Publication number
- JPS5825476A JPS5825476A JP57123106A JP12310682A JPS5825476A JP S5825476 A JPS5825476 A JP S5825476A JP 57123106 A JP57123106 A JP 57123106A JP 12310682 A JP12310682 A JP 12310682A JP S5825476 A JPS5825476 A JP S5825476A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- active plasma
- movable
- plasma
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 91
- 238000000034 method Methods 0.000 title claims description 27
- 238000001816 cooling Methods 0.000 claims description 75
- 239000013077 target material Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 16
- 239000000696 magnetic material Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims 8
- 206010041235 Snoring Diseases 0.000 claims 2
- 241001062872 Cleyera japonica Species 0.000 claims 1
- 239000011149 active material Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000005478 sputtering type Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910001004 magnetic alloy Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- -1 disokel Chemical compound 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 102220217298 rs1060503025 Human genes 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28376481A | 1981-07-16 | 1981-07-16 | |
| US283764 | 1981-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5825476A true JPS5825476A (ja) | 1983-02-15 |
| JPH0236675B2 JPH0236675B2 (enrdf_load_stackoverflow) | 1990-08-20 |
Family
ID=23087455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57123106A Granted JPS5825476A (ja) | 1981-07-16 | 1982-07-16 | 高速スパツタリング装置及び方法 |
Country Status (11)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149681U (ja) * | 1984-03-15 | 1985-10-04 | ダイコク電機株式会社 | パチンコホ−ル用貸出機 |
| JP2008501863A (ja) * | 2004-06-09 | 2008-01-24 | ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 可動な平らなターゲットを用いて材料を飛散させるための装置及び方法 |
| JP2018517846A (ja) * | 2015-06-05 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | スパッタ堆積源、スパッタリング装置およびそれらを動作させる方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2125441A (en) * | 1982-07-13 | 1984-03-07 | Christopher Elphick | Tunnel magnetron for cathode sputtering |
| US4444643A (en) * | 1982-09-03 | 1984-04-24 | Gartek Systems, Inc. | Planar magnetron sputtering device |
| JPH0772349B2 (ja) * | 1987-05-12 | 1995-08-02 | 住友電気工業株式会社 | 大面積化合物薄膜の作製方法および装置 |
| US4885070A (en) * | 1988-02-12 | 1989-12-05 | Leybold Aktiengesellschaft | Method and apparatus for the application of materials |
| CH687111A5 (de) * | 1992-05-26 | 1996-09-13 | Balzers Hochvakuum | Verfahren zum Erzeugen einer Niederspannungsentladung, Vakuumbehandlungsanlage hierfuer sowie Anwendung des Verfahrens. |
| JP2001343309A (ja) * | 2000-06-01 | 2001-12-14 | Kawasaki Steel Corp | 金属分析試料の予備処理方法および装置 |
| JP4381094B2 (ja) | 2002-09-19 | 2009-12-09 | エーエスエムエル ネザーランズ ビー．ブイ． | 放射源、リソグラフィ装置、およびデバイス製造方法 |
| KR100844375B1 (ko) * | 2007-01-16 | 2008-07-07 | (주)아이씨디 | 알에프 차폐 구조를 갖는 플라즈마 처리 장치 |
| DE102020100061B4 (de) | 2020-01-03 | 2025-07-03 | Schott Ag | Kühlvorrichtung und Kühlverfahren für Sputtertargets |
| CN112626458A (zh) * | 2020-12-08 | 2021-04-09 | 深圳市华星光电半导体显示技术有限公司 | 磁控溅射装置 |
| WO2023274558A1 (de) | 2021-07-02 | 2023-01-05 | Schott Ag | Kühlvorrichtung und kühlverfahren für sputtertargets |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537586A (en) * | 1976-02-19 | 1978-01-24 | Sloan Technology Corp | Cathodic spattering apparatus |
| JPS57120668A (en) * | 1981-01-16 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming thin polymer film |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE705794C (de) * | 1937-04-29 | 1941-05-09 | Bernhard Berghaus | Verfahren und Vorrichtung zur Kathodenzerstaeubung |
| US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
| US3590777A (en) * | 1969-03-13 | 1971-07-06 | United Aircarft Corp | Ingot feed drive |
| GB1354702A (en) * | 1970-02-12 | 1974-06-05 | Baxter Ltd Alexander | Methods of and means for vacuum deposition |
| DE2301593C3 (de) * | 1972-11-23 | 1979-05-03 | Balzers Hochvakuum Gmbh, 6200 Wiesbaden | Wechselvorrichtung für Targets für Kathodenzerstäubung |
| DE2528108B2 (de) * | 1975-06-24 | 1977-11-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum aufbringen von elektrisch leitenden schichten auf eine unterlage |
| DE2856930A1 (de) * | 1977-06-23 | 1981-02-12 | H Hessner | A device for absorbing urine with incontinent persons |
| US4142958A (en) * | 1978-04-13 | 1979-03-06 | Litton Systems, Inc. | Method for fabricating multi-layer optical films |
| DE2832719A1 (de) * | 1978-07-26 | 1980-02-07 | Basf Ag | Anordnung zur kompensation von ungleichen schreibfeldern in magnetischen datenspeichereinrichtungen, insbesondere in magnetplattenspeichern |
| DE2903291A1 (de) * | 1979-01-29 | 1980-08-07 | Siemens Ag | Verfahren zur herstellung von abwechselnd uebereinanderliegenden metall- und glimmpolymerisationsschichten |
-
1982
- 1982-07-02 GB GB08219206A patent/GB2101638B/en not_active Expired
- 1982-07-08 IE IE1649/82A patent/IE53214B1/en unknown
- 1982-07-09 PT PT75222A patent/PT75222B/pt unknown
- 1982-07-14 BR BR8204080A patent/BR8204080A/pt unknown
- 1982-07-14 KR KR8203138A patent/KR890001032B1/ko not_active Expired
- 1982-07-15 MX MX193615A patent/MX152639A/es unknown
- 1982-07-15 FR FR8212350A patent/FR2509755B1/fr not_active Expired
- 1982-07-15 IT IT48820/82A patent/IT1148359B/it active
- 1982-07-15 NL NL8202878A patent/NL8202878A/nl not_active Application Discontinuation
- 1982-07-16 JP JP57123106A patent/JPS5825476A/ja active Granted
- 1982-07-16 DE DE19823226717 patent/DE3226717A1/de active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537586A (en) * | 1976-02-19 | 1978-01-24 | Sloan Technology Corp | Cathodic spattering apparatus |
| JPS57120668A (en) * | 1981-01-16 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming thin polymer film |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149681U (ja) * | 1984-03-15 | 1985-10-04 | ダイコク電機株式会社 | パチンコホ−ル用貸出機 |
| JP2008501863A (ja) * | 2004-06-09 | 2008-01-24 | ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 可動な平らなターゲットを用いて材料を飛散させるための装置及び方法 |
| JP2018517846A (ja) * | 2015-06-05 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | スパッタ堆積源、スパッタリング装置およびそれらを動作させる方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MX152639A (es) | 1985-10-02 |
| FR2509755B1 (fr) | 1985-11-08 |
| KR840000665A (ko) | 1984-02-25 |
| GB2101638A (en) | 1983-01-19 |
| KR890001032B1 (ko) | 1989-04-20 |
| IE53214B1 (en) | 1988-08-31 |
| PT75222A (en) | 1982-08-01 |
| FR2509755A1 (fr) | 1983-01-21 |
| IT1148359B (it) | 1986-12-03 |
| GB2101638B (en) | 1985-07-24 |
| IT8248820A0 (it) | 1982-07-15 |
| NL8202878A (nl) | 1983-02-16 |
| DE3226717A1 (de) | 1983-02-03 |
| DE3226717C2 (enrdf_load_stackoverflow) | 1988-10-06 |
| JPH0236675B2 (enrdf_load_stackoverflow) | 1990-08-20 |
| BR8204080A (pt) | 1983-07-05 |
| PT75222B (en) | 1984-11-19 |
| IE821649L (en) | 1983-01-16 |
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