JPS5823174A - 接続端子の電気接続方法 - Google Patents
接続端子の電気接続方法Info
- Publication number
- JPS5823174A JPS5823174A JP12007181A JP12007181A JPS5823174A JP S5823174 A JPS5823174 A JP S5823174A JP 12007181 A JP12007181 A JP 12007181A JP 12007181 A JP12007181 A JP 12007181A JP S5823174 A JPS5823174 A JP S5823174A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- metal
- metal particles
- terminal electrodes
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229920000620 organic polymer Polymers 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000002861 polymer material Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007181A JPS5823174A (ja) | 1981-07-31 | 1981-07-31 | 接続端子の電気接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12007181A JPS5823174A (ja) | 1981-07-31 | 1981-07-31 | 接続端子の電気接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5823174A true JPS5823174A (ja) | 1983-02-10 |
| JPS6351354B2 JPS6351354B2 (enrdf_load_stackoverflow) | 1988-10-13 |
Family
ID=14777171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12007181A Granted JPS5823174A (ja) | 1981-07-31 | 1981-07-31 | 接続端子の電気接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5823174A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130004A (ja) * | 1983-12-15 | 1985-07-11 | 日立化成工業株式会社 | 透明導電異方性接着シ−ト |
| JPS60133677A (ja) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | 熱融着型接続ケ−ブル |
| JPS60170177A (ja) * | 1984-02-13 | 1985-09-03 | 日本黒鉛工業株式会社 | 導電異方性ヒ−トシ−ルコネクタ部材 |
| JPS6155809A (ja) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | 導電性接着フイルム巻重体 |
| JPS6164085A (ja) * | 1984-09-04 | 1986-04-02 | ダイソー株式会社 | 電気部材 |
| JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS61168574U (enrdf_load_stackoverflow) * | 1985-04-09 | 1986-10-18 | ||
| JPS61168573U (enrdf_load_stackoverflow) * | 1985-04-09 | 1986-10-18 | ||
| JPS61269873A (ja) * | 1985-05-23 | 1986-11-29 | 信越ポリマ−株式会社 | コネクタ− |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| JP2002256303A (ja) * | 2001-03-06 | 2002-09-11 | Fujitsu Ltd | 伝導性粒子、伝導性組成物、電子機器および電子機器製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2655368A1 (en) | 2010-12-20 | 2013-10-30 | Irm Llc | Compositions and methods for modulating farnesoid x receptors |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
| JPS5121192A (ja) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | Dodenseisetsuchakushiito |
| JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
| JPS5259889A (en) * | 1975-11-13 | 1977-05-17 | Seiko Epson Corp | Sticking conductivity anisotropy |
| JPS5652885A (en) * | 1979-10-03 | 1981-05-12 | Shinetsu Polymer Co | Pressure nipping type connector |
-
1981
- 1981-07-31 JP JP12007181A patent/JPS5823174A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
| JPS5121192A (ja) * | 1974-08-14 | 1976-02-20 | Seikosha Kk | Dodenseisetsuchakushiito |
| JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
| JPS5259889A (en) * | 1975-11-13 | 1977-05-17 | Seiko Epson Corp | Sticking conductivity anisotropy |
| JPS5652885A (en) * | 1979-10-03 | 1981-05-12 | Shinetsu Polymer Co | Pressure nipping type connector |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130004A (ja) * | 1983-12-15 | 1985-07-11 | 日立化成工業株式会社 | 透明導電異方性接着シ−ト |
| JPS60133677A (ja) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | 熱融着型接続ケ−ブル |
| JPS60170177A (ja) * | 1984-02-13 | 1985-09-03 | 日本黒鉛工業株式会社 | 導電異方性ヒ−トシ−ルコネクタ部材 |
| JPS6155809A (ja) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | 導電性接着フイルム巻重体 |
| JPS6164085A (ja) * | 1984-09-04 | 1986-04-02 | ダイソー株式会社 | 電気部材 |
| JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS61168573U (enrdf_load_stackoverflow) * | 1985-04-09 | 1986-10-18 | ||
| JPS61168574U (enrdf_load_stackoverflow) * | 1985-04-09 | 1986-10-18 | ||
| JPS61269873A (ja) * | 1985-05-23 | 1986-11-29 | 信越ポリマ−株式会社 | コネクタ− |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| JP2002256303A (ja) * | 2001-03-06 | 2002-09-11 | Fujitsu Ltd | 伝導性粒子、伝導性組成物、電子機器および電子機器製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6351354B2 (enrdf_load_stackoverflow) | 1988-10-13 |
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