CN101128927A - 电子元件焊接结构及电子元件焊接方法 - Google Patents

电子元件焊接结构及电子元件焊接方法 Download PDF

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Publication number
CN101128927A
CN101128927A CNA2006800060167A CN200680006016A CN101128927A CN 101128927 A CN101128927 A CN 101128927A CN A2006800060167 A CNA2006800060167 A CN A2006800060167A CN 200680006016 A CN200680006016 A CN 200680006016A CN 101128927 A CN101128927 A CN 101128927A
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electronic component
electrode
solder
solder particle
thermosetting resin
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CN100585823C (zh
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大园满
境忠彦
永福秀喜
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

在使设置在柔性基板上的端子与刚性基板的电极相连的电子元件焊接方法中，于其中热固树脂内混合有焊料微粒的焊料混合树脂已经被施加到刚性基板上进而覆盖电极之后，柔性基板被放置在刚性基板上并被热压，进而形成利用热固树脂的热固化结合两个基板的树脂部分，以及被树脂部分围绕并包含变窄部分的焊料部分，在变窄部分中外周表面在端子表面附近和电极表面附近向内变窄。因此，焊料部分以接触锐角焊接在电极和端子上，进而消除降低疲劳强度的形状不连续的产生。

Description

电子元件焊接结构及电子元件焊接方法
技术领域
本发明涉及一种电子元件焊接结构，其中诸如膜形柔性基板之类的电子元件与诸如刚性基板之类的另一电子元件相连，并涉及一种用于获得该电子元件焊接结构的电子元件焊接方法。
背景技术
需要尺寸减少以及强大功能的电子装置如移动电话等通常利用这样的构造，即，单个的功能模块如CCD照相机、显示板等通过膜形的柔性基板而与刚性基板所设置的主要电子电路模块相连。至于使设置在该柔性基板上的端子与刚性基板的电路电极相连的方法，已经知晓一种利用焊料预涂敷方法(使该端子与电路电极焊接的方法例如参见JP-A-6-85454)，以及借助ACF(anisotropic conductive film，各向异性导电膜)使端子和电路电极电连接的方法(例如参见JP-A-11-233912和JP-A-11-167971)。
在焊料预涂敷的方法中，焊料部分通过镀锡预先形成在电路电极上，并且柔性基板被加热压按在刚性基板上，进而端子和电路电极电传导，并且柔性基板被机械地固定在刚性基板上焊料接合的部分处。
此外，在利用ACF的方法中，包含导电微粒的热固树脂被施加在电路电极上，并且柔性基板热结合(heat-bonded)在实体基板上，进而电路电极和端子通过之间的导电微粒相互接触，并且热固树脂热固化。由此，电路电极和端子电传导，并且柔性基板和刚性基板通过硬化的热固树脂彼此结合。
此外，在利用ACF的方法中，已经提出了将焊料微粒用作导电微粒的方法(例如，参见JP-A-11-176879和日本专利No.3417110)。在此方法中，置于电路电极和端子之间的焊料微粒借助热压结合熔化，进而将电路电极和端子焊接在一起，电路电极和端子由此电传导。
可是，上述现有技术参考中所示的现有技术具有由其各自方法特征所引起的以下缺陷。首先，在焊料预涂敷方法中，在电路电极上预形成焊料部分的附加步骤引起生产工序费用的增加。此外，在接合可靠性方面存在不利：电路电极的窄间距很容易引起电桥，其中熔化的焊料在焊接时于相邻电极之间接合在一起的状态下硬化；并且预涂敷的焊料量的限制由于窄间距而很难充分确保连接之后所需的接合保持能量。
进一步，利用ACF的方法具有以下不利：ACF自身的材料成本昂贵；并且由于用于连接的热压结合需要长的结合时间，产量低且成本降低很难。此外，由于端子和电路电极通过处于接触状态的导电微粒而导通，所以连接部分的电阻高，进而很难确保连接可靠性。
此外，因为需要高的结合负载(10-20MPa)以使导电微粒与端子和电路电极很好地接触，所以对于连接目标存在大的限制，对连接目标施用ACF来实行连接。即，在刚性基板为具有内布线的多层基板或其中存在安装在连接表面背面上的电子元件凸起的双面安装基板的情况下，能够充分支撑结合负载的稳定支撑(backup)是困难的，进而很难对这样的基板施用ACF连接。
为了解决上述焊料预涂敷方法和ACF连接方法中的上述问题，如JP-A-11-176879和日本专利No.3417110中所示，已经提出了将焊料微粒用作导电微粒的方法。可是，在这些现有技术中，存在焊料微粒已经将端子和电路电极焊接之后形成的焊料部分形状所引起的以下问题。
也就是说，在焊料微粒被用作导电微粒的情况下，焊料微粒在热压结合步骤中熔化。因此，考虑到热压结合之后通过焊料的冷却和硬化所形成的焊料部分的形状，端子或电路电极的接合表面中的接触角变成钝角，进而容易形成明显的形状不连续。上述形状不连续引起电子元件使用状态下适于热循环的疲劳强度显著下降，因此削弱了连接可靠性。因此，应用于诸如膜形的基板等的电子元件的常规电子元件焊接结构具有一个问题，即，很难实现使与各种类型的电子元件相关的电子元件焊接结构能够以低成本和高产量保证高连接可靠性。
发明内容
因此，本发明的一个目的是提供一种电子元件焊接结构以及电子元件焊接方法，其中能够关于各种类型的电子元件以低成本和高产量保证高连接可靠性。
本发明的电子元件焊接结构，其通过将设置在第一电子元件的第一表面上的多个第一电极与设置在第二电子元件的第二表面上的多个第二电极相连所形成，包括位于彼此相对的第一表面和第二表面之间并结合第一和第二表面的树脂部分，以及由树脂部分所围绕并使第一电极和对应于第一电极的第二电极连接大致柱形的焊料部分。在此，焊料部分在第一电极表面附近和第二电极表面附近的至少两个位置处具有其中周边表面向内变窄的变窄部分，使得焊料部分与第一电极表面和第二电极表面的接触角变为锐角。
本发明的电子元件焊接方法，其是获得本发明的电子元件焊接结构的方法，所述焊接结构通过将设置在第一电子元件的第一表面上的多个第一电极与设置在第二电子元件的第二表面上的多个第二电极相连所形成，包括步骤：将包含焊料微粒的热固树脂施加在第二表面上的树脂施加步骤；在第二电子元件上安装第一电子元件的部件安装步骤，其中以高于焊料微粒的熔化温度已经加热了第一表面，并使第一表面以彼此相对的状态接近第二表面；以及以预定压力将第一电子元件压在第二电子元件上并通过第一电子元件加热焊料微粒和热固树脂的热压步骤。在此，在部件安装步骤中，第一电极表面和第二电极表面与热固树脂中的焊料微粒相接触，并且这些焊料微粒首先从与第一电极表面接触的部分熔化。此外，在热压步骤中，以这样的压力负载将第一电子元件压在第二电子元件上，即，该压力负载使得处于熔化状态的焊料微粒在热固树脂中保持大致球形，并且，通过第一表面持续进行焊料微粒和热固树脂的加热，由此具有变窄部分的焊料部分形成，并且树脂部分通过使热固树脂热固化而形成。
根据本发明，通过将第一电子元件的第一电极与第二电子元件的第二电极焊接所形成的电子元件焊接结构包括相互结合这些电子元件的树脂部分，以及由该树脂部分围绕的大致柱形的焊料部分，并且该焊料部分的形状被形成以其中在电极表面附近存在向内变窄的周边表面的变窄部分以及焊料部分与电极表面的接触角变为锐角。由此，本发明可用于各种类型的电子元件，并能以低成本和高生产量确保高连接可靠性。
附图说明
图1为根据本发明一个实施例的电子元件焊接方法中所使用的电子元件安装设备的截面图；
图2为施用根据本发明一个实施例的电子元件焊接方法的电子电路模块的透视图；
图3A至3D为用于说明根据本发明一个实施例的电子元件焊接方法的工序的示意图；
图4A至4D为用于说明根据本发明一个实施例的电子元件焊接方法的工序的示意图；
图5为根据本发明一个实施例的电子元件焊接结构的截面图；
图6为常规电子元件焊接结构的截面图。
具体实施方式
以下，参照附图描述本发明的实施例。图1为根据本发明一个实施例的电子元件焊接方法中所使用的电子元件安装设备的截面图，图2为施用根据本发明一个实施例的电子元件焊接方法的电子电路模块的透视图，图3A至3D为用于说明根据本发明一个实施例的电子元件焊接方法的工序的示意图，图4A至4D为用于说明根据本发明一个实施例的电子元件焊接方法的工序的示意图，图5为根据本发明一个实施例的电子元件焊接结构的截面图，以及图6为常规电子元件焊接结构的截面图。
参照图1，描述本发明的电子元件焊接方法中所使用的电子元件安装方法的构造。电子元件安装设备1具有使膜形的柔性基板与其上已经安装有电子元件的刚性基板电连接的功能，并用于通过柔性基板10使电子元件模块，如控制基板模块4A、显示板模块4B和照相机模块4C彼此相连，如图2所示。在图2中所示的实例中，将诸如液晶板之类的显示板作为主要元件的显示板模块4B通过柔性基板10A与通过将电子元件8安装在刚性基板5上构成的控制基板模块4A相连，并进一步，其中构建有CCD照相机的照相机模块4C通过柔性基板10B与控制基板模块相连。
如图1所示，电子元件安装设备1包括基板支架2、分配器9和结合机构(bonding mechanism)11。柔性基板10是结合机构11所保持的第一电子元件，并与作为基板支架2所保持的第二电子元件的刚性基板5热结合。在柔性基板10的端子形成表面10a(第一表面)上，提供作为第一电极的端子16(参见图3C)。端子16与设置在刚性基板5连接表面5a(第二表面)的端部处用于外部连接的电极6相连，进而柔性板10与刚性基板5相连。
基板支架2由垂直设置在支撑台2a上的多个挡销(backing pin)3所形成，并且挡销3后挡并支撑控制基板模块4A中刚性基板5的下表面。在刚性基板5的连接表面5a上，在之前的步骤中已经安装了多种类型的电子元件8a；另外在连接表面5a的相反表面上，类似地已经安装了电子元件8b。挡销3选择地设置在刚性基板5的下表面上能够后挡的部分处，在该部分处不存在电子元件8b。
刚性基板5的上表面变为其上设有与柔性基板10相连的电极6的连接表面5a，并且在与柔性基板10连接之前电极6借助分配器9被涂敷有焊料混合树脂7。焊料混合树脂7通过在热固树脂内混合具有预定微粒尺寸的焊料微粒而形成(参见图3)。作为焊料微粒15的材料，可使用SnAg基、SnZn基和SnBi基的焊料，其通常用在电子电路的组装中。优选地，SnBi基焊料是好的，更具体地，42SnBi共晶焊料(熔点139℃)最适合。可用的焊料微粒15的平均微粒尺寸为5μm至30μm。对于热固树脂，可使用环氧基树脂和丙烯基树脂，其具有上述热固特性，即在低于焊料微粒15熔点的温度开始热固化并在相对短的时间内进行硬化。
结合机构11具有沿水平方向和上下方向相对于基板支架2移动的工作头12。保持头13和热压结合工具14安装在工作头12上。保持头13借助多个吸附保持垫13a从与端子形成表面10a侧相对的表面侧吸附柔性基板10(柔性基板10A或柔性基板10B)。热压结合工具14通过吸孔14从与端子形成表面10a侧相反的表面侧吸附柔性基板10的设有端子16的连接部分。
热压结合工具14包括将柔性基板10压在刚性基板5上的按压单元，以及通过接触热的传递加热柔性基板10的加热单元。在柔性基板10与刚性基板5借助移动工作头12对齐、并且柔性基板10的端部通过焊料混合树脂7放置在刚性基板5的电极6上的状态下，利用热压结合工具14相对于刚性基板5加热并按压柔性基板10，进而使得柔性基板10与刚性基板5相连。
即，借助焊料混合树脂7中熔化并硬化的焊料微粒电连接电极6和端子16，并借助其中焊料混合树脂7中的热固树脂已经热固化的树脂部分结合刚性基板5和柔性基板10。因此，设置在柔性基板10(第一电子元件)的端子形成表面10a(第一表面)上的多个端子16(第一电极)与设置在共性基板5(第二电子元件)的连接表面5a(第二表面)上的多个电极6a(第二电极)相连，进而构成电子元件焊接结构。
接着，参照图3A至3D和4A至4D，描述使柔性基板10与刚性基板5相连的电子元件焊接方法。如图3A所示，在基板支架2所保持的刚性基板5的连接表面5a上形成多个电极6。如图3B所示，借助分配器9在连接表面5a施加热固树脂7a中包含有焊料微粒15的焊料混合树脂7以覆盖电极6。即，包含焊料微粒的热固树脂被施加在作为第二表面的连接表面5a上(树脂施加步骤)。在此，焊料混合树脂7内包含的焊料微粒15的比率被设定成使得多个焊料微粒15在焊料混合树脂7被施加到连接表面5a上的情况下总是插入在每个电极6之上。
接着，工作头12实行柔性基板10的安装。首先，柔性基板10被保持头13真空保持。此时，调节热压结合工具14的位置使得该工具14位于端子16的正上方。进一步，柔性基板10被热压结合工具14预先加热，使得端子16的下表面的温度增加到焊料微粒15的熔化温度或更高。
此后，移动工作头12以使端子形成表面10a和连接表面5a彼此相对，如图3C所示，并且端子16与电极6对齐。接着，允许热压结合工具14下降以使端子形成表面10a接近连接表面5a，并且端子16通过焊料混合树脂7与对应该端子16的电极6相接触。即，以高于焊料微粒15熔化温度的温度已经加热的柔性基板10的端子形成表面10a被安装在刚性基板5上，并且端子形成表面10a在与连接表面5a相对的状态下接近连接表面5a(部件安装步骤)。
接着，如图3D，借助热压结合工具14的预定压力负载将柔性简便10按压在刚性基板5上，并借助热压结合工具14通过柔性基板10加热热固水质7a和焊料微粒15(热压步骤)。在此，对于按压条件，热压结合工具14的压力负载被设定在1至4MPa的压力范围内。因此，设定压力负载低于利用热压结合的常规电子元件焊接方法中的压力负载(10至20MPa)。由此，在以下描述的热压步骤中，在已经熔化的焊料微粒在不被挤压的情况下通常保持其原始微粒形状的状态下，形成焊料部分。
参照图4A至4D描述上述部件安装步骤和热压步骤中焊料微粒15的移动和条件变化。图4A示出了在使热压工具14下降并使端子形成表面10a接近连接表面5a的操作中，端子16开始与焊料混合树脂7相接触的情况。此时，在电极6和端子16之间，存在多个焊料微粒15。图4A至4D示出了存在两个焊料微粒15的实例。为了区分两个焊料微粒，以下将其描述成焊料微粒15A和15B。
此后，通过使热压结合工具14进一步下降，如图4B所示，端子表面16a开始与置于焊料混合树脂7中上面位置的焊料微粒15A接触。因此，焊料微粒15A借助端子表面16a传递的热而被加热，所述端子表面已经被加热到焊料的熔化温度或更高，并从与端子表面16a的接触表面开始熔化。在此附图中，焊料微粒15的熔化部分表示为黑色。熔化的焊料沿着端子表面16a伸展，并在接触开始时间内在宽于接触表面的范围内润湿端子表面16a。此时，焊料微粒15B还没有开始与端子表面16a相接触。
此后，当柔性基板10进一步下降时，焊料微粒15B也开始与端子表面16a相接触。接着，如图4C所示，焊料微粒15A和15B都夹在电极表面6a和端子表面16a之间。此时，首先与端子表面16a相接触的焊料微粒15A在焊料微粒15B之前处于完全熔化状态，并且后与端子表面16a相接触的焊料微粒15B处于从其与端子表面16a接触的表面开始熔化的状态。
在此状态中，热固树脂7a通过柔性基板10被加热，进而实行热固化，其防止已经熔化或正在熔化的焊料微粒15A、15B流动。当继续进一步加热时，如图4D所示，焊料微粒15A和15B都完全熔化并焊接在电极表面6a和端子表面16a上，连接端子16和电极6的大致柱形焊料部分15*形成，并且已经热固化的热固树脂7a形成覆盖该焊料部分周围的树脂部分7*。由此，完成使柔性基板10与刚性基板5相连的电子元件焊接结构。
接着，参照图5，描述由此形成的电子元件连接结构。
在图5中，于柔性基板10和刚性基板5之间，形成作为借助焊料混合树脂7内热固树脂7a的热固化所获得的硬化物质的树脂部分7*。树脂部分7*存在于彼此相对的端子形成表面10a和连接表面5a之间，并结合两个表面。电极6和端子16借助焊料微粒15A和15B的熔化和硬化所形成的焊料部分15*相互连接。
焊料部分15*的周围覆盖有树脂部分7*，并且焊料部分15*连接端子16和与该端子16对应的电极6。在此，焊料微粒15在焊料混合树脂7内的混合比率被适当地设定，进而两个或更多个焊料部分15*存在于端子16和与该端子16相对应的电极6之间。由于多个焊料部分15*借助焊接而在电极之间相连，因此，相比于其中使用ACF的连接中通过导电微粒的接触而实行的电极之间导电的结构，实现了具有低电阻和高可靠性的连接结构。
接着，描述由此形成的焊料部分15*的形状。如前所述，焊料部分15*在焊料微粒15的周围覆盖有正在热固化的热固树脂7a的状态下熔化和硬化。此外，由于在该步骤中仅对焊料微粒15施加低的压力负载，因此，开始熔化之后的焊料微粒在除与端子表面16a和电极表面6a的接触部分外整体保持其原始形状的同时熔化并硬化。
即，当焊料微粒15与端子表面16a和电极表面6a开始接触时，在焊料部分15与端子表面16a和电极表面6a的接触部分处，允许熔化的焊料在湿的条件下以良好的润湿度沿接触表面伸展，因为焊料微粒15的表面上的氧化薄膜在焊料部分15与端子表面16a和电极表面6a的接触部分处断裂，或因为通过热固树脂7a的活性作用而移除了氧化薄膜。因此，在焊料部分15*的上和下端中，在焊接电极表面6a和端子表面16a的部分处，如图5中部分放大示意图所示，形成分别具有锐角的接触角θ1或θ2的接合。
由于上述形状的接合，在焊料部分15*中，在端子表面16a附近以及电极表面6a的附近处，形成变窄的部分15a，其具有周边表面向内变窄的形状。在两个变窄的部分15a之间形成凸出部分15b，其具有焊料微粒15基本保持其原始形状且相对于变窄部分15a向外凸出的形状。即，焊料部分15*在作为端子16表面的端子表面16a附近以及作为电极6表面的电极表面6a附近的至少两个位置处，具有分别具有向内变窄的周边表面的形状的变窄部分15a；其中与端子表面16a和电极表面6a的接触角是锐角的形状；以及在这些两个部分中形成的变窄部分15a之间所形成的并沿周向凸出的凸出部分15b。
即在之前所述的电子元件焊接方法中的部件安装步骤中，端子16的端子表面16a和电极6的电极表面6a与热固树脂7a中的焊料微粒15相接触，并且该焊料微粒15首先从与端子16的端子表面16a的接触部分熔化；并在热压步骤中，柔性部件10借助压力负载压按在刚性基板5上使得处于正在熔化状态的焊料微粒15在热固树脂7a中保持大致球形，并且焊料微粒15和热固树脂7a的热量连续通过端子形成表面10a，进而形成具有上述变窄部分15a的焊料部分15*，并且通过使热固树脂7a热固化形成树脂部分7*。
相比于电子元件焊接结构，上述形状的焊料部分15*具有以下特征，将具有其中在热固树脂中混有焊料微粒的类似构造的焊料混合树脂用作连接材料。图6示出了通过使类似于本实施例中情况的具有端子116的柔性基板110与具有电极106的基板105相连所形成的常规电子元件焊接结构。
即，在使用常规技术的焊接结构中，连接端子116和电极16的焊接部分115*在熔化时间内很容易由于压力负载而在上下方向上形成以压缩形状，并且焊料部分115*与端子116和电极106的接合被形成以具有接触角θ3的接合形状，该接合角为钝角。因此，焊料部分115*具有箭头a所示的形状不连续，使得适于热应力的疲劳强度由于连接之后使用状态中所产生的热循环而下降。相反，在本发明的电子元件焊接结构中，由于焊料部分15*以接触锐角与每个电极接合，故不存在形状不连续，并且实现了抗疲劳强度良好的电子元件焊接结构。
在上述实施例中，尽管示出了其中膜形柔性基板10作为第一电子元件与刚性基板5相连的实例，但本发明并不限于此。例如，本发明还适用于具有金属凸起或凸起电极的半导电部件(semiconductive part)，如连接表面上的连接端子，直接与刚性基板相连的情况。
如上所述，通过使柔性基板10的端子16与刚性基板5的电极6相连所形成的所述实施例中所示的电子元件焊接结构，由将这些电子元件相互结合的树脂部分7*以及由该树脂部分7*所围绕的大致柱形的焊料部分15*所构成。在此，焊料部分15*被如此形成：设置其中端子16表面附近和电极6表面附近的周边表面向内变窄的变窄部分15a；并且端子16和电极6的接触角变为锐角。
为了实现上述电子元件焊接结构，在热固树脂7a中混合焊料微粒15的焊料混合树脂7预先被施加在电极6上，以高于焊料熔点的温度已经预先加热端子16的柔性基板10借助于低压力负载通过焊料混合树脂7被压按在刚性基板5上，并且焊料微粒15在该焊料微粒15最大可能地保持其形状的状态下熔化和硬化，由此获得具有上述形状的焊料部分15*。
因此，相比于应用于类似电子元件的常规电子元件焊接方法，能够获得以下极好的优点。首先，相比于焊料预涂敷方法，因为在该焊料预涂敷方法中添加了在电路电极上预先形成焊料部分的步骤，故生产工序成本的增加是不可避免的。可是，在本发明的实施例中，在电极上施加焊料混合树脂7后立即实行热压结合，进而极大地简化了工序。此外，因为混合在焊料混合树脂7内的焊料微粒15的数量被适当设定，即使在本发明的电子元件焊接方法用于窄间距电极的情况下，也能够防止电极之间电桥的产生。此外，借助树脂部分7*的强化作用，能充分保证接合保持能量。
此外，相比于使用ACF的方法，由于在本发明中用在热固树脂中混合焊料微粒的廉价结合材料替代昂贵的ACF，能够实现低的运行成本。此外，相比于利用ACF的热压结合，能在短结合时间内完成连接，并能实现高产量，加上低的运行成本能够促进成本降低。
此外，由于不同于利用ACF的方法，不必利用高压力负载实行热压结合以获得低连接阻抗，因此，即使在本发明用于具有内布线的多层基板，或其中在连接表面的背面上存在的凸起不能支撑高负载的这类基板，如双面安装基板，也能利用低压力负载实现低连接阻抗。因此，根据所述实施例中所示的电子元件焊接结构和电子元件焊接方法，对于各种类型的电子元件，都能够以低成本和高产量确保高连接可靠性。
工业应用性
本发明的电子元件焊接结构和电子元件焊接方法具有这样的优点，对于各种类型的电子元件，均能以低成本和高产量确保高连接可靠性。因此，本发明可应用于小尺寸便携电子装置等中的膜形柔性基板预设置在刚性基板上的电极相结合的领域。

Claims (7)

1.一种电子元件焊接结构，其通过将设置在第一电子元件的第一表面上的多个第一电极与设置在第二电子元件的第二表面上的多个第二电极焊接而形成，包括位于彼此相对的所述第一表面和第二表面之间并相互结合所述第一表面和第二表面的树脂部分，以及由该树脂部分围绕并使第一电极和对应于所述第一电极的第二电极连接的大致柱形的焊料部分，
其中所述焊料部分分别在与第一电极的分界面附近和与第二电极的分界面附近的至少两个位置处具有该焊料部分的周边表面向内变窄的变窄部分，使得该焊料部分与第一电极和第二电极的接触角变为锐角。
2.根据权利要求1所述的电子元件焊接结构，其中在所述第一电极和对应于所述第一电极的第二电极之间存在两个或更多个焊接部分。
3.根据权利要求1所述的电子元件焊接结构，其中所述焊料部分具有位于所述变窄部分之间并沿其周向凸出的凸出部分。
4.根据权利要求1所述的电子元件焊接结构，其中所述树脂部分由硬化的热固树脂形成。
5.根据权利要求1所述的电子元件焊接结构，其中所述第一电子元件为膜形柔性基板。
6.根据权利要求1所述的电子元件焊接结构，其中所述第一电子元件为具有凸起电极的半导电部件。
7.一种电子元件焊接方法，其为获得电子元件焊接结构的方法，所述电子元件焊接结构通过将设置在第一电子元件的第一表面上的多个第一电极与设置在第二电子元件的第二表面上的多个第二电极焊接而形成，所述方法包括步骤：
将包含焊料微粒的热固树脂施加在第二表面上的树脂施加步骤；
在第二电子元件上安装第一电子元件的部件安装步骤，其中以高于所述焊料微粒的熔化温度已经加热了第一表面，并使第一表面以彼此相对的状态接近第二表面；以及
以预定压力将第一电子元件压在第二电子元件上并通过第一电子元件加热所述焊料微粒和热固树脂的热压步骤，其中
在所述部件安装步骤中，第一电极表面和第二电极表面与所述热固树脂中的焊料微粒相接触，并且这些焊料微粒首先从与第一电极表面接触的部分熔化，
在所述热压步骤中，以这样的压力负载将第一电子元件压在第二电子元件上，即，该压力负载使得处于熔化状态的焊料微粒在所述热固树脂中保持大致球形，并且，通过第一表面持续进行所述焊料微粒和热固树脂的加热，由此具有变窄部分的焊料部分形成，并且树脂部分通过使所述热固树脂热固化而形成。
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CN102388687A (zh) * 2009-04-07 2012-03-21 松下电器产业株式会社 电子元件安装系统和电子元件安装方法
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CN102388686B (zh) * 2009-04-07 2015-07-22 松下电器产业株式会社 电子元件安装系统和电子元件安装方法
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