JPS5823174A - Connector - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a new and improved connector structure.

Traditionally, it has been used for various electrical connections, such as connecting lead terminals for connecting single-child devices and flat wire cables, connecting lead terminals for electrical and electronic components and lead terminals for connecting printed circuit boards, or connecting between printed circuit boards. As one type of connector, an adhesive type connector is known, for example, as disclosed in US Pat. In the case of the above-mentioned former connector, when a solder alloy, for example, is used as the metal that penetrates the insulating molded body, the molten metal in the portion that protrudes from the molded body is likely to short-circuit adjacent components, and therefore is not suitable for high-density mounting 2. In addition, in the case of welding only gold sea bream, C: is the welded part, especially (the weld boundary between two dissimilar metals is susceptible to corrosion due to the influence of moisture in the air and carbon dioxide gas). be.

-1. The latter connector mentioned above uses an adhesive such as synthetic resin or synthetic rubber to obtain a connection, but in this case, electrical corrosion between the contact metal and parts or the Seebeck effect may occur depending on the type of metal or carbon. However, in order to avoid the occurrence of the Peltier effect, the C dimetallic am material must be made of a noble metal or be plated with another metal, which is a hassle.

In addition, as adhesive type connectors≦2 similar to the above, for example, Japanese Utility Model Application No. 54-114079, Japanese Utility Model Application Publication No. 54-1186
There are connectors such as those disclosed in No. 77 and No. 54-1!61114, but since these connectors are partially or entirely made of a heat-melting material, the terminals to be connected are When formed by etching (a) and fixedly placed on the board (c), the bonding area (1) is likely to cause an air block between the board and the connector (i), and there is a drawback that the area involved in electrical connection (i) is limited. In addition, because the thermal conductivity of the connector itself is low, it is necessary to heat the connector from the top and bottom, or to connect it by heating one side at a time. C: It has various disadvantages such as the bifurcated connector is easily deformed when heated and short-circuit accidents are likely to occur.
The present invention provides a new and improved connector free from drawbacks, which comprises an adhesive organic polymeric material that plastically flows under heat and pressure, and at least a surface of which is melted or sintered by heating. The electrode surface 5 to be connected is characterized by being formed by forming a mixture with metal particles to be fused into a film or a single piece.

Hereinafter, the present invention will be described in detail based on attached drawing G2. First, FIG. The mixture of metal particles 2 and 2 is formed into a sheet shape and then cut into predetermined dimensions.The connector 3 thus obtained is, for example, as shown in FIG. 4m, 4b circuit board etc. 5a,
5b and then heat and pressurize this connector to obtain a connection structure as shown in Figure s3.
Dimorphic flowing adhesive organic polymer materials include polystyrene, polyvinyl chloride, polyvinyl acetate, polyethylene,
A well-known hot melt whose main ingredient is poly-a-pyrene, polyamide, polyurethane, polyester, etc.)? Ingredients, unsaturated polyester, ebony & Itj 1% resin, sulfonated rubber, silicone rubber, urethane rubber.

8BR% NBR, thermosetting resin such as acrylic rubber f
! Or rubber, Sara 5: The power that can be obtained from near asphalt resin, giltstone, graystone, graphemite, etc., this is a combination of two or more of them,
It may be a copolymer, but it melts and/or txm during hot pressing to connect the terminals to be connected.
It must have a melting point and/or a pressure plastic flow range of 60°C.
It is manufactured at 1:@ so as to be far away from the range of ~250℃,
This is true! : Thermo-pressure plastic flow in the range of 8o to 150℃, and by appropriately selecting the types and amounts of various additives 1, such as crosslinking agents and retarders, the curing time ranges from several seconds to several tens of seconds.
Try to complete more than 80 yen in seconds! 1 is preferred. Note that this requires g: various v-ran compounds,
A known coupling agent such as an organic titanium compound, a rust preventive agent, or the like may be blended, and this provides a more favorable effect.

On the other hand, the organic polymer substance g constituting the connector of the present invention: The metal particles to be mixed are preferably selected from those having a melting point of at least 70 to 300°C on the surface, such as soot, lead, silver, etc. , indium, cadmium, bismuth, antimony, zinc, copper, etc., a solder alloy of two or more types selected from the group consisting of indium, cadmium, bismuth, antimony, zinc, copper, etc., aluminum alloy, tin, etc., and the addition of these metal particles to the polymeric substance. If the amount is too small, there will be insufficient conduction between the terminals to be connected at the time of heat and pressure, and if it is too large, the insulation surrounding the conductive part will be poor. 0.03 to 40 parts by volume, preferably 0.03 to 40 parts by volume, preferably 0.
05-b 0.07-25 parts by volume. In addition, it is necessary that the metal particles be dispersed as homogeneously as possible among the above-mentioned polymeric substances, so the particle size should be 70 or 1.
It is preferable to use particles with a particle size of 0 μm or more and a particle size distribution range as small as possible. For example, if the particle size is 1 μm or more,
mesh pass, 250-350 mesh, 150-25
It is preferable to use a material with a mesh size of 0 mesh and a maximum particle size of 2000 pIrL or less.

Next C:, the present invention (L: manufacturing the second connector) is
The above-mentioned polymeric substance is heated and melted or dissolved in a solvent, and the above-mentioned metal particles are mixed therein and dispersed, and then formed into a film stick A4 or V- shape according to various molding methods. , the final shape can be obtained by cutting two desired shapes. It should be noted that C can be split into two parts. In order to connect the terminal electrodes to be connected using the connector 3 as shown in FIG. As shown in FIG. The back of the material is heated by contacting it with a hot iron or the like, or high-frequency heating or ultrasonic heating is applied.

First, heat transfer occurs rapidly at the portions that are in contact with the connected terminal electrodes 4a and 4b, so the surface layer of the contact organic polymer material 1 in those portions softens and flows, and at the same time (: The metal particles 2 that are in contact with or in the vicinity of the electrodes 4a and 4 become molten or sintered, and soon most of the polymer material flows into a soft fluid, and the metal particles that are present between the electrodes 4a and 4 become molten or sintered. The terminal electrodes 4a adjacent to the planar weight of the substrate 5a%5b
, between 4a or between 4b and 4b = The existing gold particles have lower thermal conductivity than the metal particles between the opposing terminal electrodes 4a and 4b, and therefore are in a molten state. G remains dispersed in the sacrificial polymeric material, and even if it melts, it remains in an electrically insulating state due to interfacial phenomena and becomes a bidirectionally dispersed state in the insulating polymeric material. It is retained.

In the present invention, the relationship between the melting point of the metal particles and the softening pour point of the polymer material is not particularly limited, but the latter temperature is extremely lower than the former temperature, ``for example, the temperature difference is If the temperature exceeds 50℃, the frame polymer material layer tends to become completely fluid, and sufficient strength cannot be obtained, and the molten metal tends to settle and there is a risk of connection failure. The temperature difference between them should be less than t-30°C, preferably less than -120°C. On the other hand, if the temperature of the former is too high, even if the surface layer of the polymer material softens and flows, it may not be able to penetrate the molten metal; Due to its low conductivity, this should keep the temperature difference below 100°C, preferably below 60°C.

Note that the temperature characteristics related to the melting point of the metal material and the softening pour point of the polymeric substance (for both, the first heat and pressure conditions should be selected).

Next, C: When the opposing connection terminal electrodes are fused and joined via molten metal or sintered metal particles as described above, the heat held by the molten metal flows to the electrodes and rapidly C: Cooling or cooling state Tonatsu J1 molten gold 11t1 solidifies and C between the electrodes
You will now be able to obtain two melting snow conditions.

When the heat is removed, the polymer material solidifies around the welded area and hermetically seals the welded area, but at the same time, this solidified polymer material
a and 5b, and is also used to bond and integrate them together.

@38!3 is an example of the connection structure obtained in this way.

Therefore, when the connector of the present invention is used to connect the terminal electrodes to be connected by opposing wiring, 52, the metal material is welded between the terminal electrodes to be connected, and the electrical connection is reliably achieved. The area around this welded part is completely hermetically sealed with a polymeric material, so there is no risk of corrosion or electrolytic corrosion. There is no risk of short-circuiting, and in the presence of polymeric substances, the substrates on which the connecting terminal electrodes are arranged are bonded and integrated with each other, so the reliability of the connection is dramatically improved (as mentioned above). @ As explained above, the connector of the present invention has J
Since it is possible to simultaneously achieve the electrical connection by 1, and the adhesive integration by adhesive 52, the reliability of the connection is higher than that of conventional g:! It is said to be superior in terms of durability and strength to mold funecta, and therefore its practical value is extremely great.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway perspective view showing a representative Fl embodiment of the connector according to the present invention, and Fig. 2 is a cross-sectional view of the connector arranged between opposing connecting terminal electrodes provided with two basic shoes. ,
Figure $3 is a sectional view of a connection structure obtained using the above connector. 1...Adhesive organic polymer substance 2...Gold particles 3...Connector 4...Connection terminal electrode 5...Circuit board

Claims (1)

[Claims] an adhesive organic polymer substance that plastically flows under heat and pressure;
A connector characterized in that it is formed into a film or sheet by forming a mixture with gold scrap particles, at least the surface of which melts or sinters when heated and is fused to the surface of an electrode to be connected.