JP4724963B2

JP4724963B2 - Thermal fuse

Info

Publication number: JP4724963B2
Application number: JP2001204335A
Authority: JP
Inventors: 達也和田; 和俊松村; 篤司河野; 謙治仙田
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2001-07-05
Filing date: 2001-07-05
Publication date: 2011-07-13
Anticipated expiration: 2021-07-05
Also published as: JP2003016895A

Description

【０００１】
【発明の属する技術分野】
本発明は、過昇温による機器の破損を防止するために使用される温度ヒューズに関するものである。
【０００２】
【従来の技術】
図３（ａ）は従来の温度ヒューズの上面図、図３（ｂ）は同Ａ−Ａ線断面図である。
【０００３】
図３において、一対の端子１の先端部２間に橋設され第１の絶縁フィルム３上面に設けられた低融点可溶合金４と、この低融点可溶合金４を覆い、かつ第１の絶縁フィルム３上における低融点可溶合金４が設けられていない部分において、第１の絶縁フィルム３と接着された第２の絶縁フィルム５を備えていた。なお、低融点可溶合金４にはフラックス６が塗布されている。
【０００４】
また、第１の絶縁フィルム３と第２の絶縁フィルム５とが接着された接着部７は、第１の絶縁フィルム３、第２の絶縁フィルム５の最も外側にある周縁部８を含むように設けられていた。
【０００５】
【発明が解決しようとする課題】
しかしながら上記従来の温度ヒューズは、生産上のばらつきによって接着部７の一部が第１の絶縁フィルム３、第２の絶縁フィルム５の周縁部８の外に設けられる場合が生じ、このとき、第１の絶縁フィルム３と第２の絶縁フィルム５との接着面積が小さくなるため、第１の絶縁フィルム３と第２の絶縁フィルム５との接着強度が弱くなるという課題を有していた。
【０００６】
本発明は上記従来の課題を解決するもので、第１の絶縁フィルムと第２の絶縁フィルムとの接着強度が強い温度ヒューズを提供することを目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本発明は以下の構成を有する。
【０００８】
本発明の請求項１記載の発明は、特に、第１、第２の絶縁フィルムの幅方向における前記第１の絶縁フィルムと前記第２の絶縁フィルムとの接着部を、前記第１、第２の絶縁フィルムの周縁部から離間して設け、さらに、前記接着部の周縁部を波形状にしたもので、接着部の一部が第１の絶縁フィルム、第２の絶縁フィルムの周縁部の外に設けていないため、第１の絶縁フィルムと第２の絶縁フィルムとの接着面積をある程度確保でき、さらに、端子をどの方向から引張っても、引張り方向に対して接着部の周縁部に垂直成分が必ず存在するため、端子が抜けないという作用効果が得られる。
【００１０】
【発明の実施の形態】
以下、本発明の一実施の形態における温度ヒューズについて、図面を参照しながら説明する。
【００１１】
図１（ａ）は本発明の一実施の形態における温度ヒューズの上面図、図１（ｂ）は同Ａ−Ａ線断面図である。
【００１２】
図１において、一対の端子１１と、一対の端子１１の先端部１２間に橋設され第１の絶縁フィルム１３上面に設けられた低融点可溶合金１４と、少なくとも低融点可溶合金１４を覆い、かつ第１の絶縁フィルム１３と接着された第２の絶縁フィルム１５とを備え、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着部１６を、第１、第２の絶縁フィルム１３，１５の幅方向における第１、第２の絶縁フィルム１３，１５の周縁部１７に設けないようにしている。すなわち、第１、第２の絶縁フィルム１３，１５の幅方向における第１、第２の絶縁フィルム１３，１５の周縁部１７から離間して接着部１６を設けている。
【００１３】
一対の端子１１は、平板状で、鉄、銅、ニッケルなどの導電性の良い板状の金属からなり、その表面に、はんだめっき、錫めっき、銅めっきなどが施されている。なお、この端子１１は平板状でなく、線状であっても構わない。また、一対の端子１１の各先端部１２は、第１の絶縁フィルム１３の上面に設けられている。
【００１４】
第１の絶縁フィルム１３は、平板状で、ポリエチレンテレフタレートなどの樹脂からなり、その上面に一対の端子１１の各先端部１２、低融点可溶合金１４が備えられている。
【００１５】
低融点可溶合金１４は、一対の端子１１とそれぞれ電気的に接続されるように一対の端子１１の各先端部１２間に橋設され、錫、鉛、ビスマス、インジウム、カドミウムなどのうち２つ以上の金属からなる合金からなる。この低融点可溶合金１４の周囲にはロジンを主成分とするフラックス１８が塗布されている。
【００１６】
なお、図２に示すように、絶縁フィルム１３に２つの貫通孔を備え、一端部に膨出部１１ａが設けられた一対の端子１１を絶縁フィルム１３の裏面の両端部に備え、かつこの膨出部１１ａを絶縁フィルム１３の貫通孔を通して絶縁フィルム１３の裏面から上面に表出させ、さらに、低融点可溶合金１４を絶縁フィルム１３の上面に表出した一対の端子１１間に備えてもよい。
【００１７】
第１の絶縁フィルム１３上において、低融点可溶合金１４および一対の端子１１と低融点可溶合金１４との接合部付近を除いた部分で、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着部１６が備えられている。
【００１８】
第２の絶縁フィルム１５は、平板状で、ポリエチレンテレフタレートなどの樹脂からなり、低融点可溶合金１４を覆うように設けられ、第１の絶縁フィルム１３の上面と接着されている。
【００１９】
接着部１６は、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルム１３と第２の絶縁フィルム１５とが接着されている部分で、第１、第２の絶縁フィルム１３，１５の周縁部１７には設けていない。すなわち、接着部１６と、第１、第２の絶縁フィルム１３，１５の最も外側の部分とは距離を有している。なお、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着は、超音波溶着あるいは熱圧着によって行う。
【００２０】
また、接着部１６の周縁部１９の形状は、上面視にて波形状になっている。さらに、第１、第２の絶縁フィルム１３，１５の幅方向における第１、第２の絶縁フィルム１３，１５の周縁部１７の形状も同様な波形状になっている。
【００２１】
従って、第１、第２の絶縁フィルム１３，１５の幅方向における第１、第２の絶縁フィルム１３，１５の周縁部１７と接着部１６の周縁部１９との距離は一定になっている。
【００２２】
以下、本実施の形態の温度ヒューズの製造方法を簡潔に説明する。
【００２３】
まず、平板状のポリエチレンテレフタレートからなる第１の絶縁フィルム１３の上面の両端部に、導電性の良い板状の金属からなる一対の端子１１の各先端部１２を配置する。
【００２４】
次に、第１の絶縁フィルム１３の上面の一対の端子１１の各先端部１２間に、錫、鉛、ビスマス、インジウム、カドミウムなどのうち２つ以上の金属からなる合金の低融点可溶合金１４を橋設する。このとき、低融点可溶合金１４の周囲にはロジンを主成分とするフラックス１８を塗布する。
【００２５】
次に、低融点可溶合金１４を覆うように、第１の絶縁フィルム１３の上面に第２の絶縁フィルム１５を形成する。
【００２６】
最後に、第１の絶縁フィルム１３と第２の絶縁フィルム１５を接着する。
【００２７】
このとき、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルム１３と第２の絶縁フィルム１５とが接着される部分である接着部１６は、第１、第２の絶縁フィルム１３，１５の周縁部１７から離間して形成する。さらに、第１、第２の絶縁フィルム１３，１５の幅方向における第１、第２の絶縁フィルム１３，１５の接着部１６の周縁部１９の形状を上面視にて波形状にする。
【００２８】
なお、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着方法は、接着部１６における第１の絶縁フィルム１３の下面と第２の絶縁フィルム１５の上面にそれぞれ所定の治具を当接して、超音波溶着あるいは熱圧着によって行う。このときの治具の形状を波形状にすることによって接着部１６の周縁部１９の形状を波形状にする。
【００２９】
上記したように、本実施の形態における温度ヒューズは、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着部１６を、第１、第２の絶縁フィルム１３，１５の周縁部１７に設けないようにしたため、接着部１６の一部が第１の絶縁フィルム１３、第２の絶縁フィルム１５の外に設けられることはなくなり、これにより、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着面積が小さくならず、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着強度を強くできるという効果が得られる。
【００３０】
さらに、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着部１６の周縁部１９を波形状にした場合、端子１１が抜けることによる第１、第２の絶縁フィルム１３，１５間の隙間が発生することはないため、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着強度を強くできるという効果が得られる。
【００３１】
これは、端子１１をどの方向から引張っても、引張り方向に対して接着部１６の周縁部１９に垂直成分が必ず存在し、これにより、端子１１が抜けることがないためである。
【００３２】
また、波形状の加工は第１、第２の絶縁フィルム１３，１５の長手方向、幅方向の周縁部１７のうち少なくとも一方に設ければよい。
【００３３】
【発明の効果】
以上のように本発明によれば、第１、第２の絶縁フィルム１３，１５の幅方向における第１の絶縁フィルムと第２の絶縁フィルムとの接着部１６を、第１、第２の絶縁フィルムの周縁部に設けないようにし、さらに、接着部１６の周縁部１９を波形状にしたため、接着部１６の一部が第１の絶縁フィルム１３、第２の絶縁フィルム１５の外に設けられることはなくなり、これにより、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着面積が小さくならず、第１の絶縁フィルム１３と第２の絶縁フィルム１５との接着強度を強くでき、さらに、端子１１をどの方向から引張っても、引張り方向に対して接着部１６の周縁部１９に垂直成分が必ず存在するため、端子が抜けないという効果を奏する。
【図面の簡単な説明】
【図１】（ａ）本発明の一実施の形態における温度ヒューズの上面図
（ｂ）同Ａ−Ａ線断面図
【図２】本発明の他の実施の形態における温度ヒューズの断面図
【図３】（ａ）従来の温度ヒューズの上面図
（ｂ）同Ａ−Ａ線断面図
【符号の説明】
１１端子
１２先端部
１３第１の絶縁フィルム
１４低融点可溶合金
１５第２の絶縁フィルム
１６接着部
１７第１、第２の絶縁フィルムの周縁部
１９接着部の周縁部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a thermal fuse used to prevent equipment damage due to excessive temperature rise.
[0002]
[Prior art]
3A is a top view of a conventional thermal fuse, and FIG. 3B is a cross-sectional view taken along the line AA.
[0003]
In FIG. 3, a low melting point soluble alloy 4 bridged between the front end portions 2 of the pair of terminals 1 and provided on the upper surface of the first insulating film 3, and covers the low melting point soluble alloy 4, and A portion of the insulating film 3 where the low melting point soluble alloy 4 is not provided is provided with a second insulating film 5 adhered to the first insulating film 3. A flux 6 is applied to the low melting point soluble alloy 4.
[0004]
Further, the bonding portion 7 where the first insulating film 3 and the second insulating film 5 are bonded to each other includes the first insulating film 3 and the outer peripheral edge portion 8 of the second insulating film 5. It was provided.
[0005]
[Problems to be solved by the invention]
However, in the above-described conventional thermal fuse, a part of the adhesive portion 7 may be provided outside the peripheral edge portion 8 of the first insulating film 3 and the second insulating film 5 due to production variations. Since the bonding area between the first insulating film 3 and the second insulating film 5 is reduced, the bonding strength between the first insulating film 3 and the second insulating film 5 is reduced.
[0006]
SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object of the present invention is to provide a thermal fuse having high adhesive strength between a first insulating film and a second insulating film.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0008]
According to the first aspect of the present invention, in particular, the first and second bonding portions between the first insulating film and the second insulating film in the width direction of the first and second insulating films are arranged in the first and second directions. The insulating film is provided apart from the peripheral edge of the insulating film, and the peripheral edge of the adhesive portion is corrugated. A part of the adhesive portion is outside the peripheral edge of the first insulating film and the second insulating film. Since the bonding area between the first insulating film and the second insulating film can be secured to some extent , and the terminal is pulled from any direction, the component perpendicular to the peripheral portion of the bonding portion with respect to the pulling direction can be secured. Therefore, there is an effect that the terminal cannot be removed .
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a thermal fuse in an embodiment of the present invention will be described with reference to the drawings.
[0011]
FIG. 1A is a top view of a thermal fuse in one embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line AA.
[0012]
In FIG. 1, a pair of terminals 11, a low melting point soluble alloy 14 bridged between the front end portions 12 of the pair of terminals 11 and provided on the upper surface of the first insulating film 13, and at least the low melting point soluble alloy 14. A second insulating film 15 that covers and is bonded to the first insulating film 13, and the adhesive portion 16 between the first insulating film 13 and the second insulating film 15 is connected to the first and second insulating films 15. It is made not to provide in the peripheral part 17 of the 1st, 2nd insulating films 13 and 15 in the width direction of the films 13 and 15. FIG. That is, the adhesive portion 16 is provided apart from the peripheral edge portion 17 of the first and second insulating films 13 and 15 in the width direction of the first and second insulating films 13 and 15.
[0013]
The pair of terminals 11 are flat and made of a plate-like metal having good conductivity such as iron, copper, nickel, and the surface thereof is subjected to solder plating, tin plating, copper plating, or the like. The terminal 11 may not be flat but linear. Each tip 12 of the pair of terminals 11 is provided on the upper surface of the first insulating film 13.
[0014]
The first insulating film 13 has a flat plate shape and is made of a resin such as polyethylene terephthalate. The top end portion 12 of the pair of terminals 11 and the low melting point soluble alloy 14 are provided on the upper surface of the first insulating film 13.
[0015]
The low-melting-point soluble alloy 14 is bridged between the tip portions 12 of the pair of terminals 11 so as to be electrically connected to the pair of terminals 11, and two of tin, lead, bismuth, indium, cadmium, etc. It consists of an alloy consisting of two or more metals. A flux 18 mainly composed of rosin is applied around the low melting point soluble alloy 14.
[0016]
As shown in FIG. 2, the insulating film 13 is provided with two through holes, and a pair of terminals 11 provided with a bulging portion 11a at one end are provided at both ends of the back surface of the insulating film 13, and the bulging is provided. The protruding portion 11 a is exposed from the back surface of the insulating film 13 through the through hole of the insulating film 13, and the low melting point soluble alloy 14 is provided between the pair of terminals 11 exposed on the upper surface of the insulating film 13. Good.
[0017]
On the first insulating film 13, the portions of the first and second insulating films 13 and 15 except for the low melting point soluble alloy 14 and the vicinity of the joint between the pair of terminals 11 and the low melting point soluble alloy 14 . An adhesive portion 16 between the first insulating film 13 and the second insulating film 15 in the width direction is provided.
[0018]
The second insulating film 15 is a flat plate made of a resin such as polyethylene terephthalate, is provided so as to cover the low melting point soluble alloy 14, and is bonded to the upper surface of the first insulating film 13.
[0019]
The bonding portion 16 is a portion where the first insulating film 13 and the second insulating film 15 are bonded in the width direction of the first and second insulating films 13 and 15, and the first and second insulating films are bonded to each other. 13 and 15 are not provided on the peripheral edge 17. That is, the adhesion part 16 and the outermost part of the 1st, 2nd insulating films 13 and 15 have distance. The first insulating film 13 and the second insulating film 15 are bonded by ultrasonic welding or thermocompression bonding.
[0020]
The shape of the peripheral edge portion 19 of the bonding portion 16 is a wave shape when viewed from above. Furthermore, the shape of the peripheral part 17 of the 1st, 2nd insulating films 13 and 15 in the width direction of the 1st, 2nd insulating films 13 and 15 is also the same wave shape.
[0021]
Therefore, the distance between the peripheral edge portion 17 of the first and second insulating films 13 and 15 and the peripheral edge portion 19 of the adhesive portion 16 in the width direction of the first and second insulating films 13 and 15 is constant.
[0022]
Hereinafter, a method for manufacturing the thermal fuse of the present embodiment will be briefly described.
[0023]
First, the end portions 12 of the pair of terminals 11 made of a plate metal having good conductivity are arranged at both ends of the upper surface of the first insulating film 13 made of flat polyethylene terephthalate.
[0024]
Next, a low melting point fusible alloy of an alloy made of two or more metals of tin, lead, bismuth, indium, cadmium, etc., between the tip portions 12 of the pair of terminals 11 on the upper surface of the first insulating film 13. 14 is built. At this time, a flux 18 mainly composed of rosin is applied around the low melting point soluble alloy 14.
[0025]
Next, a second insulating film 15 is formed on the upper surface of the first insulating film 13 so as to cover the low melting point soluble alloy 14.
[0026]
Finally, the first insulating film 13 and the second insulating film 15 are bonded.
[0027]
At this time, the bonding portion 16, which is a portion where the first insulating film 13 and the second insulating film 15 in the width direction of the first and second insulating films 13 and 15 are bonded, The insulating films 13 and 15 are formed away from the peripheral edge portion 17. Furthermore, the shape of the peripheral edge portion 19 of the adhesive portion 16 of the first and second insulating films 13 and 15 in the width direction of the first and second insulating films 13 and 15 is changed to a wave shape when viewed from above.
[0028]
The first insulating film 13 and the second insulating film 15 are bonded by applying predetermined jigs to the lower surface of the first insulating film 13 and the upper surface of the second insulating film 15 in the bonding portion 16. The contact is made by ultrasonic welding or thermocompression bonding. By changing the shape of the jig at this time into a wave shape, the shape of the peripheral edge portion 19 of the bonding portion 16 is changed to a wave shape.
[0029]
As described above, the thermal fuse in the present embodiment has the bonding portion 16 between the first insulating film 13 and the second insulating film 15 in the width direction of the first and second insulating films 13 and 15. 1, since it is not provided on the peripheral edge portion 17 of the second insulating films 13 and 15, a part of the adhesive portion 16 is not provided outside the first insulating film 13 and the second insulating film 15, Thereby, the adhesive area of the 1st insulating film 13 and the 2nd insulating film 15 does not become small, and the effect that the adhesive strength of the 1st insulating film 13 and the 2nd insulating film 15 can be strengthened is acquired. .
[0030]
Furthermore, when the peripheral edge portion 19 of the adhesive portion 16 between the first insulating film 13 and the second insulating film 15 in the width direction of the first and second insulating films 13 and 15 is formed into a wave shape, the terminal 11 comes off. Since the gap between the first and second insulating films 13 and 15 does not occur, there is an effect that the adhesive strength between the first insulating film 13 and the second insulating film 15 can be increased.
[0031]
This is because no matter which direction the terminal 11 is pulled, a vertical component always exists in the peripheral edge portion 19 of the bonding portion 16 with respect to the pulling direction, and thus the terminal 11 does not come off.
[0032]
Moreover, what is necessary is just to provide a waveform process in at least one among the peripheral part 17 of the longitudinal direction of the 1st, 2nd insulating films 13 and 15 and the width direction.
[0033]
【The invention's effect】
As described above, according to the present invention, the adhesive portion 16 between the first insulating film and the second insulating film in the width direction of the first and second insulating films 13 and 15 can be replaced with the first and second insulating films. Since the peripheral portion 19 of the adhesive portion 16 is not provided at the peripheral portion of the film, and the peripheral portion 19 of the adhesive portion 16 is corrugated , a part of the adhesive portion 16 is provided outside the first insulating film 13 and the second insulating film 15. As a result, the adhesive area between the first insulating film 13 and the second insulating film 15 is not reduced, and the adhesive strength between the first insulating film 13 and the second insulating film 15 can be increased. In addition, no matter which direction the terminal 11 is pulled, a vertical component always exists in the peripheral edge portion 19 of the bonding portion 16 with respect to the pulling direction, so that the terminal cannot be pulled out .
[Brief description of the drawings]
1A is a top view of a thermal fuse according to an embodiment of the present invention. FIG. 1B is a cross-sectional view taken along line AA in FIG. 2. FIG. 2 is a cross-sectional view of a thermal fuse according to another embodiment of the present invention. 3) (a) Top view of a conventional thermal fuse (b) Cross-sectional view taken along line AA [Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Terminal 12 Tip part 13 1st insulating film 14 Low melting-point meltable alloy 15 2nd insulating film 16 Adhesive part 17 Peripheral part of 1st, 2nd insulating film 19 Peripheral part of adhesive part

Claims

A pair of terminals, a first insulating film provided on the lower surface of the pair of terminals, and a low melting point soluble alloy provided on the upper surface of the first insulating film that is bridged between tip portions of the pair of terminals And a thermal fuse that includes a second insulating film that covers at least the low melting point soluble alloy and is bonded to the first insulating film, in the width direction of the first and second insulating films. An adhesive portion between the first insulating film and the second insulating film is provided apart from the peripheral edge portions of the first and second insulating films, and the peripheral edge portion of the adhesive portion is wave-shaped. A thermal fuse characterized by that .