JPH0582179A - Lead wire connecting device for electrical element - Google Patents
Lead wire connecting device for electrical elementInfo
- Publication number
- JPH0582179A JPH0582179A JP24626291A JP24626291A JPH0582179A JP H0582179 A JPH0582179 A JP H0582179A JP 24626291 A JP24626291 A JP 24626291A JP 24626291 A JP24626291 A JP 24626291A JP H0582179 A JPH0582179 A JP H0582179A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- connecting piece
- section
- wire connecting
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本考案は、例えば、インダクタな
どの電気素子のリ―ド線を金属フレ―ムにて形成された
端子片の立上りリード線接続部の上端部に電気素子のリ
ード線を直交させて接続する電気素子のリ―ド線接続装
置に関する。BACKGROUND OF THE INVENTION The present invention relates to a lead wire of an electric element at the upper end of a rising lead wire connecting portion of a terminal piece formed of a metal frame for a lead wire of an electric element such as an inductor. The present invention relates to a lead wire connection device for an electric element that connects at right angles to each other.
【０００２】[0002]
【従来の技術】従来のこの種の電気素子のリード線接続
装置は、例えば、実公平２ー７３０６６号公報に記載さ
れている構造が提案されている。この構造は図３および
図４に示すように、金属フレ―ム20にて形成された一対
の端子片21の外部電極接続片部22から立上げ形成したリ
ード線接続片部23の上端部にインダクタ素子24のリード
線25を直交させて半田付け接続する構造が提案されてい
る。2. Description of the Related Art As a conventional lead wire connecting device of this kind of electric element, for example, a structure disclosed in Japanese Utility Model Publication No. 2-73066 has been proposed. This structure, as shown in FIGS. 3 and 4, is formed on the upper end of the lead wire connecting piece 23 formed by rising from the external electrode connecting piece 22 of the pair of terminal pieces 21 formed of the metal frame 20. A structure has been proposed in which the lead wires 25 of the inductor element 24 are made orthogonal to each other and connected by soldering.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の構造の装置
では、端子片21の立上りリ―ド線接続片部23の上端部に
インダクタ素子24のリード線25を係合してクリーム半田
26をレーザービームで溶融して接続するときに余剰半田
が流出し、この流出した余剰半田がリ―ド線接続片部23
を伝わって外部電極部接続片部22に付着する問題があっ
た。さらに、リ―ド線接続片部23の上端部にインダクタ
素子24のリード線25を搭載するときに、リ―ド線接続片
部23の上端部に掛かる力でリ―ド線接続片部23の上端部
に形成したリード線接続部27が変形し易く、さらに、こ
の端子片21を樹脂でモールドする場合の樹脂と端子片と
の接続強度が低い問題があり、さらに、外部電極接続片
部からリ―ド線接続片部23を折曲げるときの折曲げ加工
性が悪い問題があった。In the device of the above-mentioned conventional structure, the lead wire 25 of the inductor element 24 is engaged with the upper end portion of the rising lead wire connecting piece portion 23 of the terminal piece 21 for cream soldering.
Excessive solder flows out when melting and connecting 26 with a laser beam, and this flowing out excess solder is the lead wire connecting piece 23
There was a problem of being attached to the external electrode portion connecting piece portion 22 while being transmitted. Further, when the lead wire 25 of the inductor element 24 is mounted on the upper end portion of the lead wire connecting piece portion 23, the force applied to the upper end portion of the lead wire connecting piece portion 23 causes the lead wire connecting piece portion 23. The lead wire connecting portion 27 formed at the upper end of the is easily deformed, and there is a problem that the connection strength between the resin and the terminal piece is low when the terminal piece 21 is molded with resin. There was a problem that the bending workability was poor when the lead wire connecting piece 23 was bent.
【０００４】本考案は、上記問題点に鑑みなされたもの
で、リ―ド線接続片部の上端部に電気素子のリード線を
接続する半田が外部電極部接続片部に付着することがな
く、さらに、リ―ド線接続片部の上端部に形成したリー
ド線接続部が変形することがなく、また、この端子片を
モールドした樹脂と端子片との接続強度が高められ、さ
らに、外部電極接続片部からリ―ド線接続片部を折曲げ
るときの加工性が向上される電気素子のリ―ド線接続装
置を提供するものである。The present invention has been made in view of the above problems, and solder for connecting the lead wire of the electric element to the upper end portion of the lead wire connecting piece does not adhere to the external electrode connecting piece. In addition, the lead wire connecting portion formed at the upper end of the lead wire connecting piece is not deformed, and the connection strength between the resin molded with this terminal piece and the terminal piece is enhanced. Provided is a lead wire connecting device for an electric element, which is improved in workability when the lead wire connecting piece is bent from the electrode connecting piece.
【０００５】[0005]
【課題を解決するための手段】本発明の電気素子のリ―
ド線接続装置は、外部電極接続片部とこの外部電極接続
片部の一端部より垂直状に折曲げて立ち上げたリード線
接続片部とからなる端子片を備え、この端子片のリード
線接続片部の上端部に素子のリード線がこのリード線接
続片面と直交する方向に接続されるリード線接続部とを
形成した電気素子のリ―ド線接続装置において、前記端
子片の外部電極接続片部とリード線接続片部との折曲げ
部に孔を形成したものである。[Means for Solving the Problems]
The lead wire connecting device is provided with a terminal piece including an external electrode connecting piece and a lead wire connecting piece that is vertically bent from one end of the external electrode connecting piece and rises. A lead wire connecting device for an electric element, wherein a lead wire of an element is formed on an upper end portion of a connecting piece portion, and a lead wire connecting portion is connected in a direction orthogonal to the surface of the lead wire connecting piece. A hole is formed in the bent portion between the connecting piece portion and the lead wire connecting piece portion.
【０００６】[0006]
【作用】本発明の電気素子のリ―ド線接続装置は、端子
片の立上りリ―ド線接続片部の上端部にインダクタ素子
のリード線を係合してクリーム半田をレーザー線で溶融
して接続するときに余剰半田が流出し、余剰半田がリ―
ド線接続片部を伝わって流れても外部電極接続片部とリ
ード線接続片部との折曲げ部に形成した孔部分に溜ま
り、半田が外部電極部接続片部に付着することがない。
さらに、リ―ド線接続片部の上端部に電気素子のリード
線を搭載するときに、リ―ド線接続片部の上端部に掛か
る力が外部電極接続片部とリード線接続片部との折曲げ
部に形成した孔で吸収され、リ―ド線接続片部の上端部
に形成したリード線接続部が変形することがない。さら
に、この端子片を樹脂でモールドする場合、外部電極接
続片部とリード線接続片部との折曲げ部に形成した孔に
樹脂が入込み、樹脂と端子片との接続強度が高められ
る。さらに、外部電極接続片部とリード線接続片部との
折曲げ部に形成した孔により外部電極接続片部からリ―
ド線接続片部を折曲げるときの折曲げ加工性が良好にな
る。In the lead wire connecting device for an electric element of the present invention, the lead wire of the inductor element is engaged with the upper end of the rising lead wire connecting piece of the terminal piece to melt the cream solder with the laser line. Excess solder flows out when connecting
Even when flowing through the connecting wire connecting piece portion, the solder is not accumulated in the hole formed in the bent portion between the external electrode connecting piece portion and the lead wire connecting piece portion, and the solder does not adhere to the external electrode connecting piece portion.
Further, when the lead wire of the electric element is mounted on the upper end portion of the lead wire connecting piece, the force applied to the upper end portion of the lead wire connecting piece causes the external electrode connecting piece and the lead wire connecting piece to It is absorbed by the hole formed in the bent portion, and the lead wire connecting portion formed at the upper end of the lead wire connecting piece is not deformed. Furthermore, when this terminal piece is molded with resin, the resin enters into the hole formed in the bent portion between the external electrode connecting piece portion and the lead wire connecting piece portion, and the connection strength between the resin and the terminal piece is increased. Further, a hole formed in the bent portion between the external electrode connecting piece and the lead wire connecting piece allows the external electrode connecting piece to be relieved from the external electrode connecting piece.
The bending workability at the time of bending the cable connection piece is improved.
【０００７】[0007]
【実施例】本考案の一実施例の構成を図１および図２に
ついて説明する。１は半田メッキを施された細長鋼板よ
りなる金属フレ―ムであり、この金属フレ―ム１の巾方
向に相対して一対の端子片２，２が切起し形成され、こ
のそれぞれの端子片２，２は、外部電極接続片部３とこ
の外部電極接続片部３の互いに対向する先端側から垂直
状に折曲げて立ち上げたリード線接続片部４とから形成
されている。また、このリード線接続片部４の中央部に
は、内面円弧状の凹部５とこの凹部５の内面と同一面の
彎曲面６とからなるリード線接続部７が形成されてい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of one embodiment of the present invention will be described with reference to FIGS. Reference numeral 1 is a metal frame made of an elongated steel plate plated with solder, and a pair of terminal pieces 2 and 2 are formed by cutting and raising so as to face each other in the width direction of the metal frame 1. Each of the pieces 2 and 2 is formed of an external electrode connecting piece portion 3 and a lead wire connecting piece portion 4 which is vertically bent and raised from opposite ends of the external electrode connecting piece portion 3. A lead wire connecting portion 7 is formed at the center of the lead wire connecting piece portion 4 and is composed of a concave portion 5 having an arcuate inner surface and a curved surface 6 that is flush with the inner surface of the concave portion 5.
【０００８】また、前記端子片２，２の外部電極接続片
部３とリード線接続片部４との折曲げ部８にこの外部電
極接続片部３とリード線接続片部４に亘って孔９が形成
されている。A bent portion 8 between the external electrode connecting piece 3 and the lead wire connecting piece 4 of each of the terminal pieces 2 and 2 has a hole extending through the external electrode connecting piece 3 and the lead wire connecting piece 4. 9 is formed.
【０００９】10はインダクタ素子で、コア11と、このコ
ア11に捲回されたコイル（図示せず）と、前記コア11の
両端面に接続され軸方向に突設されたリ―ド線12とて構
成され、コイルの両端はリ―ド線12の基部に接続されて
いる。Reference numeral 10 designates an inductor element, a core 11, a coil (not shown) wound around the core 11, and a lead wire 12 connected to both end faces of the core 11 and projecting in an axial direction. Both ends of the coil are connected to the base of the lead wire 12.
【００１０】次にこの実施例の作用を説明する。半田付
けに際しては、インダクタ素子10のリ―ド線12を端子片
２，２のリード線接続片部４に形成したリード線接続部
７の凹部５上に架設して支持させ、このリード線接続部
７の上方のリ―ド線12上にクリーム半田13を塗布または
印刷し、リ―ド線12上の半田の近傍を例えばレ―ザ―ビ
―ムによって加熱してリード線接続部７とリ―ド線12と
の接触部を加熱し、この伝導熱によって半田を溶融し流
動化させると半田は凹部５の内面と同一面の彎曲面６に
流入し、リ―ド線12がリード線接続部７に半田付けされ
る。Next, the operation of this embodiment will be described. At the time of soldering, the lead wire 12 of the inductor element 10 is erected and supported on the concave portion 5 of the lead wire connecting portion 7 formed in the lead wire connecting piece portion 4 of the terminal pieces 2 and 2, and this lead wire connecting The cream solder 13 is applied or printed on the lead wire 12 above the portion 7, and the vicinity of the solder on the lead wire 12 is heated by, for example, a laser beam to form the lead wire connecting portion 7. When the contact portion with the lead wire 12 is heated and the solder is melted and fluidized by this conduction heat, the solder flows into the curved surface 6 which is the same surface as the inner surface of the recess 5, and the lead wire 12 leads Soldered to the connection part 7.
【００１１】そして、端子片２，２の立上りリ―ド線接
続片部７の上端部にインダクタ素子10のリード線12を係
合してクリーム半田13をレーザービームで溶融して接続
するときに余剰半田が流出し、余剰半田がリ―ド線接続
片部４を伝わって流れても外部電極接続片部３とリード
線接続片部４との折曲げ部８に形成した孔９部分に溜ま
り、半田が外部電極部接続片部３に付着することがな
い。When the lead wire 12 of the inductor element 10 is engaged with the upper ends of the rising lead wire connecting piece portions 7 of the terminal pieces 2 and 2 to melt and connect the cream solder 13 with the laser beam, Excess solder flows out, and even if the excess solder flows along the lead wire connecting piece portion 4, it collects in the hole 9 formed in the bent portion 8 between the external electrode connecting piece portion 3 and the lead wire connecting piece portion 4. The solder does not adhere to the external electrode connecting piece 3.
【００１２】さらに、リ―ド線接続片部４の上端部にイ
ンダクタ素子10のリード線12を搭載するときに、リ―ド
線接続片部７に掛かる力が外部電極接続片部３とリード
線接続片部４との折曲げ部に形成した孔で吸収され、リ
―ド線接続片部４の上端部に形成したリード線接続部７
が変形することがない。Further, when the lead wire 12 of the inductor element 10 is mounted on the upper end portion of the lead wire connecting piece portion 4, the force applied to the lead wire connecting piece portion 7 is applied to the external electrode connecting piece portion 3 and the lead. The lead wire connecting portion 7 formed at the upper end of the lead wire connecting piece portion 4 is absorbed by the hole formed in the bent portion with the wire connecting piece portion 4.
Does not deform.
【００１３】さらに、この端子片２，２を樹脂でモール
ドする場合、外部電極接続片部３とリード線接続片部４
との折曲げ部８に形成した孔９に樹脂が入込み、樹脂９
と端子片２，２との接続強度が高められる。この状態で
端子片２，２を金属フレーム１から切り離す。Further, when the terminal pieces 2 and 2 are molded with resin, the external electrode connecting piece 3 and the lead wire connecting piece 4 are formed.
The resin enters the hole 9 formed in the bent portion 8 of
And the connection strength between the terminal pieces 2 and 2 is increased. In this state, the terminal pieces 2 and 2 are separated from the metal frame 1.
【００１４】さらに、外部電極接続片部３とリード線接
続片部４との折曲げ部に形成した孔９により外部電極接
続片部３からリ―ド線接続片部４を折曲げるときの折曲
げ加工性が良好になる。Further, when the lead wire connecting piece 4 is bent from the external electrode connecting piece 3 by the hole 9 formed in the bent portion of the external electrode connecting piece 3 and the lead wire connecting piece 4. Bendability becomes good.
【００１５】[0015]
【発明の効果】本発明によれば、リ―ド線接続片部の上
端部に電気素子のリード線を接続する半田が外部電極部
接続片部に付着することがなく、さらに、リ―ド線接続
片部の上端部に形成したリード線接続部が変形すること
がなく、また、この端子片をモールドした樹脂と端子片
との接続強度が高められ、さらに、外部電極接続片部か
らリ―ド線接続片部を折曲げるときの加工性が向上され
る。According to the present invention, the solder for connecting the lead wire of the electric element to the upper end portion of the lead wire connecting piece does not adhere to the external electrode connecting piece and the lead wire The lead wire connecting portion formed on the upper end of the wire connecting piece is not deformed, and the connection strength between the resin molding this terminal piece and the terminal piece is enhanced. -The workability when bending the wire connection piece is improved.
【図１】本発明の一実施例を示す電気素子のリ―ド線接
続装置の斜視図である。FIG. 1 is a perspective view of a lead wire connection device for an electric element showing an embodiment of the present invention.
【図２】同上端子片の一部の拡大図である。FIG. 2 is an enlarged view of a part of the above terminal piece.
【図３】従来の電気素子のリ―ド線接続装置の側面図で
ある。FIG. 3 is a side view of a conventional lead wire connecting device for electric elements.
【図４】同上斜視図である。FIG. 4 is a perspective view of the same.
２ 端子片 ３ 外部電極接続片部 ４ リード線接続片部 ７ リード線接続部 ８ 折曲げ部 ９ 孔 2 Terminal piece 3 External electrode connection piece 4 Lead wire connection piece 7 Lead wire connection section 8 Bent section 9 Hole
Claims (1)
部の一端部より垂直状に折曲げて立ち上げたリード線接
続片部とからなる端子片を備え、 この端子片のリード線接続片部の上端部に素子のリード
線がこのリード線接続片面と直交する方向に接続される
リード線接続部とを形成した電気素子のリ―ド線接続装
置において、 前記端子片の外部電極接続片部とリード線接続片部との
折曲げ部に孔を形成したことを特徴とする電気素子のリ
―ド線接続装置。1. A terminal piece comprising an external electrode connecting piece portion and a lead wire connecting piece portion which is vertically bent from one end of the external electrode connecting piece portion and stands up, and the lead wire connecting portion of the terminal piece is provided. A lead wire connecting device for an electric element, wherein a lead wire of an element is formed at an upper end portion of the piece, and a lead wire connecting portion is connected in a direction orthogonal to the one surface of the lead wire connecting portion. A lead wire connecting device for an electric element, characterized in that a hole is formed in a bent portion between the one portion and the lead wire connecting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03246262A JP3100081B2 (en) | 1991-09-25 | 1991-09-25 | Lead wire connection device for electrical elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03246262A JP3100081B2 (en) | 1991-09-25 | 1991-09-25 | Lead wire connection device for electrical elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0582179A true JPH0582179A (en) | 1993-04-02 |
| JP3100081B2 JP3100081B2 (en) | 2000-10-16 |
Family
ID=17145909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03246262A Expired - Fee Related JP3100081B2 (en) | 1991-09-25 | 1991-09-25 | Lead wire connection device for electrical elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3100081B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07192950A (en) * | 1993-12-27 | 1995-07-28 | Matsushita Electric Ind Co Ltd | Production of chip inductor |
| KR100386077B1 (en) * | 2000-11-24 | 2003-06-09 | 아비코전자 주식회사 | An manufacture process of chip type inductor |
| CN105719803A (en) * | 2016-04-12 | 2016-06-29 | 泉州市元华电子科技有限公司 | Wiring structure improvement of transformer and submerged pump adopting structure improvement |
-
1991
- 1991-09-25 JP JP03246262A patent/JP3100081B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07192950A (en) * | 1993-12-27 | 1995-07-28 | Matsushita Electric Ind Co Ltd | Production of chip inductor |
| KR100386077B1 (en) * | 2000-11-24 | 2003-06-09 | 아비코전자 주식회사 | An manufacture process of chip type inductor |
| CN105719803A (en) * | 2016-04-12 | 2016-06-29 | 泉州市元华电子科技有限公司 | Wiring structure improvement of transformer and submerged pump adopting structure improvement |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3100081B2 (en) | 2000-10-16 |
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