JPS58225657A - 多層混成集積回路 - Google Patents

多層混成集積回路

Info

Publication number
JPS58225657A
JPS58225657A JP57107873A JP10787382A JPS58225657A JP S58225657 A JPS58225657 A JP S58225657A JP 57107873 A JP57107873 A JP 57107873A JP 10787382 A JP10787382 A JP 10787382A JP S58225657 A JPS58225657 A JP S58225657A
Authority
JP
Japan
Prior art keywords
resistors
laser
conductive path
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57107873A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049382B2 (enExample
Inventor
Akira Kazami
風見　明
Masakazu Yamagishi
正和 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP57107873A priority Critical patent/JPS58225657A/ja
Publication of JPS58225657A publication Critical patent/JPS58225657A/ja
Publication of JPH049382B2 publication Critical patent/JPH049382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP57107873A 1982-06-22 1982-06-22 多層混成集積回路 Granted JPS58225657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS58225657A true JPS58225657A (ja) 1983-12-27
JPH049382B2 JPH049382B2 (enExample) 1992-02-20

Family

ID=14470248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107873A Granted JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS58225657A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (enExample) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102666664B (zh) 2009-10-23 2015-09-23 道康宁东丽株式会社 共改性的有机聚硅氧烷
US9580600B2 (en) 2009-10-23 2017-02-28 Dow Conring Toray Co., Ltd. Thickening or gelling agent for oily raw materials
WO2011078408A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same
KR101834885B1 (ko) 2009-12-24 2018-03-08 다우 코닝 도레이 캄파니 리미티드 카르보실록산 덴드리머 구조를 갖는 코폴리머, 및 이를 함유하는 조성물 및 화장료
US9980897B2 (en) 2010-04-30 2018-05-29 Dow Corning Toray Co., Ltd. Organopolysiloxane and powder treatment agent, preparation for external use and cosmetic comprising the same
EP2563844A1 (en) 2010-04-30 2013-03-06 Dow Corning Toray Co., Ltd. Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same
JP5856386B2 (ja) 2010-04-30 2016-02-09 東レ・ダウコーニング株式会社 糖アルコール変性オルガノポリシロキサンを含む粉体処理剤及び当該粉体処理剤によって表面処理された粉体、並びに、これらを含む化粧料用原料及び化粧料
WO2012015070A1 (en) 2010-07-30 2012-02-02 Dow Corning Toray Co., Ltd. Cosmetic for hair containing co-modified organopolysiloxane
JP2013095835A (ja) 2011-10-31 2013-05-20 Dow Corning Toray Co Ltd 長鎖アミド変性シリコーン・アミノ変性シリコーン共重合体及びその用途
JP6369888B2 (ja) 2011-12-27 2018-08-08 東レ・ダウコーニング株式会社 新規液状オルガノポリシロキサン及びその利用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (enExample) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Also Published As

Publication number Publication date
JPH049382B2 (enExample) 1992-02-20

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