JPH049382B2 - - Google Patents

Info

Publication number
JPH049382B2
JPH049382B2 JP57107873A JP10787382A JPH049382B2 JP H049382 B2 JPH049382 B2 JP H049382B2 JP 57107873 A JP57107873 A JP 57107873A JP 10787382 A JP10787382 A JP 10787382A JP H049382 B2 JPH049382 B2 JP H049382B2
Authority
JP
Japan
Prior art keywords
conductive path
resistor
laser
hybrid integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57107873A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58225657A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57107873A priority Critical patent/JPS58225657A/ja
Publication of JPS58225657A publication Critical patent/JPS58225657A/ja
Publication of JPH049382B2 publication Critical patent/JPH049382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP57107873A 1982-06-22 1982-06-22 多層混成集積回路 Granted JPS58225657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS58225657A JPS58225657A (ja) 1983-12-27
JPH049382B2 true JPH049382B2 (enExample) 1992-02-20

Family

ID=14470248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107873A Granted JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS58225657A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011049247A1 (ja) 2009-10-23 2011-04-28 東レ・ダウコーニング株式会社 油性原料の増粘剤またはゲル化剤
WO2011049248A1 (ja) 2009-10-23 2011-04-28 東レ・ダウコーニング株式会社 新規な共変性オルガノポリシロキサン
WO2011078408A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same
WO2011078407A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same
WO2011136397A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Novel organopolysiloxane, surfactant, emulsion composition, powder treatment agent, thickening agent of oil-based raw material, gelling agent, gel composition, and cosmetic raw material comprising novel organopolysiloxane, as well as, preparation for external use and cosmetic comprising the same
WO2011136393A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same
WO2011136394A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Powder treatment agent comprising sugar alcohol -modified organopolysiloxane
WO2012015070A1 (en) 2010-07-30 2012-02-02 Dow Corning Toray Co., Ltd. Cosmetic for hair containing co-modified organopolysiloxane
WO2013065766A1 (en) 2011-10-31 2013-05-10 Dow Corning Toray Co., Ltd. Long chain amide-modified silicone - amino-modified silicone copolymer and uses thereof
WO2013100207A1 (en) 2011-12-27 2013-07-04 Dow Corning Toray Co., Ltd. Novel liquid organopolysiloxane and uses thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (enExample) * 1988-09-29 1990-04-05
JP3233060B2 (ja) * 1997-02-26 2001-11-26 株式会社デンソー 樹脂製品のレーザ加工方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011049247A1 (ja) 2009-10-23 2011-04-28 東レ・ダウコーニング株式会社 油性原料の増粘剤またはゲル化剤
WO2011049248A1 (ja) 2009-10-23 2011-04-28 東レ・ダウコーニング株式会社 新規な共変性オルガノポリシロキサン
WO2011078408A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same
WO2011078407A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same
WO2011136397A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Novel organopolysiloxane, surfactant, emulsion composition, powder treatment agent, thickening agent of oil-based raw material, gelling agent, gel composition, and cosmetic raw material comprising novel organopolysiloxane, as well as, preparation for external use and cosmetic comprising the same
WO2011136393A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same
WO2011136394A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Powder treatment agent comprising sugar alcohol -modified organopolysiloxane
WO2012015070A1 (en) 2010-07-30 2012-02-02 Dow Corning Toray Co., Ltd. Cosmetic for hair containing co-modified organopolysiloxane
WO2013065766A1 (en) 2011-10-31 2013-05-10 Dow Corning Toray Co., Ltd. Long chain amide-modified silicone - amino-modified silicone copolymer and uses thereof
WO2013100207A1 (en) 2011-12-27 2013-07-04 Dow Corning Toray Co., Ltd. Novel liquid organopolysiloxane and uses thereof

Also Published As

Publication number Publication date
JPS58225657A (ja) 1983-12-27

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