JPH049382B2 - - Google Patents
Info
- Publication number
- JPH049382B2 JPH049382B2 JP57107873A JP10787382A JPH049382B2 JP H049382 B2 JPH049382 B2 JP H049382B2 JP 57107873 A JP57107873 A JP 57107873A JP 10787382 A JP10787382 A JP 10787382A JP H049382 B2 JPH049382 B2 JP H049382B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive path
- resistor
- laser
- hybrid integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 239000004416 thermosoftening plastic Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
本発明は多層混成集積回路、特に抵抗体を多層
化しレーザートリミングできる混成集積回路に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer hybrid integrated circuit, and particularly to a hybrid integrated circuit in which resistors are multilayered and can be laser trimmed.
従来の混成集積回路に於いて導電路の多層化に
ついては数多く実施されている。しかしながら抵
抗体の多層化については実現に至つていない。こ
れは混成集積回路に用いるメタルグレーズ抵抗や
カーボン抵抗体を多層化すると、多層化のための
樹脂絶縁膜と反応して相溶してペースト組成が失
なわれ抵抗値が制御できなくなる欠点がある。 In conventional hybrid integrated circuits, many attempts have been made to increase the number of layers of conductive paths. However, multi-layered resistors have not yet been realized. This has the disadvantage that when metal glaze resistors and carbon resistors used in hybrid integrated circuits are multilayered, they react with the resin insulation film used for multilayering, become compatible, and lose their paste composition, making it impossible to control the resistance value. .
また多層化された抵抗体のトリミングが困難で
あり、抵抗値の制御が難しい欠点がある。 Furthermore, it is difficult to trim a multilayered resistor, and it is difficult to control the resistance value.
本発明は斯る欠点に鑑みてなされ、抵抗体の多
層化を実現する多層混成集積回路を実現するもの
である。以下に図面を参照して本発明の実施例を
詳述する。 The present invention has been made in view of these drawbacks, and is intended to realize a multilayer hybrid integrated circuit that realizes multilayering of resistors. Embodiments of the present invention will be described in detail below with reference to the drawings.
本発明に依る多層混成集積回路は図面に示す如
く、混成集積回路基板１と、該基板１上に設けた
銅箔より成る第１の導電路２と、第１の導電路２
間に無電解ニツケルメツキにより形成したニツケ
ルメツキ抵抗体３と、第１の導電路２およびニツ
ケルメツキ抵抗体３を被覆する耐レーザー保護樹
脂層４と、この樹脂層４上に設けられ孔５を介し
て第１の導電路２と連結された第２の導電路６
と、第２の導電路６間に設けた第２のカーボン抵
抗体７より構成されている。 As shown in the drawings, the multilayer hybrid integrated circuit according to the present invention includes a hybrid integrated circuit board 1, a first conductive path 2 made of copper foil provided on the board 1, and a first conductive path 2 provided on the substrate 1.
In between, a nickel-plated resistor 3 formed by electroless nickel plating, a laser-resistant protective resin layer 4 covering the first conductive path 2 and the nickel-plated resistor 3, and a laser-resistant protective resin layer 4 provided on the resin layer 4 through holes 5. A second conductive path 6 connected to the first conductive path 2
and a second carbon resistor 7 provided between the second conductive path 6.
斯る構造に於いて、混成集積回路基板１として
はセラミツクスあるいは表面をアルマイト処理し
たアルミニウム基板等を用いる。 In such a structure, the hybrid integrated circuit board 1 is made of ceramics or an aluminum substrate whose surface is treated with alumite.
第１の導電路２は基板１の全面に粘着した銅箔
を選択エツチングして所望のパターンにして形成
される。 The first conductive path 2 is formed by selectively etching a copper foil adhered to the entire surface of the substrate 1 into a desired pattern.
第１のニツケルメツキ抵抗体３は基板１表面に
レジストをスクリーン印刷してその露出部分に無
電解ニツケルメツキして形成する。 The first nickel-plated resistor 3 is formed by screen printing a resist on the surface of the substrate 1 and electroless nickel plating on the exposed portion.
耐レーザー保護樹脂層４は本発明の最も特徴と
する点であり、熱硬化性あるいは熱可塑性の有機
物合成樹脂中にレーザー光非透過性の無機物フイ
ラーを分散して含有させる電気絶縁材料である。
熱硬化性樹脂としてはエポキシ樹脂を用い、無機
物フイラーとして窒化ボロン（BN）、アルミナ
（Al2O3）、タルク（3MgO・4SiO2・2H2O）等を
一種又は数種混合して用いる。無機物フイラーは
透過レーザー光を散乱してエネルギー密度を低下
させるので、透過率50％以下であれば保護効果が
得られる。 The laser-resistant protective resin layer 4 is the most characteristic feature of the present invention, and is an electrically insulating material in which an inorganic filler that does not transmit laser light is dispersed in a thermosetting or thermoplastic organic synthetic resin.
An epoxy resin is used as the thermosetting resin, and one or a mixture of boron nitride (BN), alumina (Al 2 O 3 ), talc (3MgO.4SiO 2 .2H 2 O), etc. is used as the inorganic filler. Inorganic fillers scatter transmitted laser light and reduce energy density, so a protective effect can be obtained if the transmittance is 50% or less.
斯上した耐レーザー保護樹脂層４はスクリーン
印刷して付着され、少くとも多層化を行う部分の
第１のニツケルメツキ抵抗体３および第１の導電
路２を完全に被覆する。なお第１の導電路２との
接続を行う孔５およびトランジスタ等の回路素子
８を固着する部分を除いて選択的にスクリーン印
刷を行う。 The laser-resistant protective resin layer 4 is applied by screen printing, and completely covers at least the first nickel-plated resistor 3 and the first conductive path 2 in the portion where multilayering is to be performed. Note that screen printing is selectively performed except for the holes 5 for connection with the first conductive path 2 and the portions to which circuit elements 8 such as transistors are fixed.
第２の導電路６は耐レーザー保護樹脂層４表面
に所望のパターンに形成される。第２の導電路６
としては無電解ニツケルニツケルメツキで形成さ
れるか、あるいは銀ペーストのスクリーン印刷で
形成される。なおこの第２の導電路６を孔５上に
も同時に形成して第１の導電路２との連結を行
う。 The second conductive path 6 is formed on the surface of the laser-resistant protective resin layer 4 in a desired pattern. Second conductive path 6
It is formed by electroless nickel plating or by screen printing with silver paste. Note that this second conductive path 6 is also formed on the hole 5 at the same time to connect with the first conductive path 2.
第２の抵抗体７は耐レーザー保護樹脂層４上の
第２の導電路６間に形成される。第２の抵抗体７
はカーボン抵抗塗料をスクリーン印刷して焼成し
て形成する。斯る第２の抵抗体７はレーザー光に
よりトリミングを行い、所望の抵抗値に調整す
る。本トリミング工程に於いてレーザー光はカー
ボン抵抗７を切断するが、耐レーザー保護樹脂層
４でそのエネルギー密度は散乱され、第１のニツ
ケル抵抗体３および第１の導電路２との絶縁を良
好に保持できる。 The second resistor 7 is formed between the second conductive paths 6 on the laser-resistant protective resin layer 4 . Second resistor 7
is formed by screen printing and baking carbon resistance paint. The second resistor 7 is trimmed with laser light and adjusted to a desired resistance value. In the main trimming process, the laser beam cuts the carbon resistor 7, but its energy density is scattered by the laser-resistant protective resin layer 4, and the insulation between the first nickel resistor 3 and the first conductive path 2 is improved. can be maintained.
以上に詳述した如く本発明に依れば、抵抗体の
多層化を容易に実現でき且つ従来不可能とされて
いた上層の抵抗体のレーザートリミングを行うこ
とができる。この結果混成集積回路の回路設計の
自由度が増し、小型化に寄与できる有益なもので
ある。 As described in detail above, according to the present invention, it is possible to easily realize a multi-layered resistor, and to perform laser trimming of the upper layer resistor, which was previously considered impossible. As a result, the degree of freedom in circuit design of the hybrid integrated circuit increases, which is beneficial as it can contribute to miniaturization.
図面は本発明による多層混成集積回路を説明す
る断面図である。
主な図番の説明、１は混成集積回路基板、２は
第１の導電路、３は第１のニツケルメツキ抵抗
体、４は耐レーザー保護樹脂層、７は第２の抵抗
体である。
The drawing is a cross-sectional view illustrating a multilayer hybrid integrated circuit according to the present invention. Explanation of main figure numbers: 1 is a hybrid integrated circuit board, 2 is a first conductive path, 3 is a first nickel-plated resistor, 4 is a laser-resistant protective resin layer, and 7 is a second resistor.
Claims (1)
路と 前記第１の導電路間に設けられた第１のニツケ
ルメツキ抵抗体と 前記第１のニツケルメツキ抵抗体を被覆する樹
脂層に形成された孔を介して前記第１の導電路と
接続された第２の導電路と 前記第２の導電路間に設けられた第２のカーボ
ン抵抗体とを具備し、 前記樹脂層は熱硬化性あるいは熱可塑性の有機
物合成樹脂中にレーザー光非透過性の無機物フイ
ラーを分散させてなる耐レーザー保護性の高い樹
脂層であり、前記第２のカーボン抵抗体のみがレ
ーザートリミングされたことを特徴とする多層混
成集積回路。[Claims] 1. A first conductive path formed on a hybrid integrated circuit board, a first nickel-plated resistor provided between the first conductive path, and covering the first nickel-plated resistor. a second conductive path connected to the first conductive path through a hole formed in the resin layer; and a second carbon resistor provided between the second conductive path; The layer is a highly laser-protective resin layer made by dispersing an inorganic filler that does not transmit laser light in a thermosetting or thermoplastic organic synthetic resin, and only the second carbon resistor is laser-trimmed. A multilayer hybrid integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57107873A JPS58225657A (en) | 1982-06-22 | 1982-06-22 | Multilayer hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57107873A JPS58225657A (en) | 1982-06-22 | 1982-06-22 | Multilayer hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58225657A JPS58225657A (en) | 1983-12-27 |
| JPH049382B2 true JPH049382B2 (en) | 1992-02-20 |
Family
ID=14470248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57107873A Granted JPS58225657A (en) | 1982-06-22 | 1982-06-22 | Multilayer hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58225657A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011049247A1 (en) | 2009-10-23 | 2011-04-28 | 東レ・ダウコーニング株式会社 | Thickening or gelling agent for oily raw materials |
| WO2011049248A1 (en) | 2009-10-23 | 2011-04-28 | 東レ・ダウコーニング株式会社 | Novel co-modified organopolysiloxane |
| WO2011078407A1 (en) | 2009-12-24 | 2011-06-30 | Dow Corning Toray Co., Ltd. | Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same |
| WO2011078408A1 (en) | 2009-12-24 | 2011-06-30 | Dow Corning Toray Co., Ltd. | Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same |
| WO2011136397A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Novel organopolysiloxane, surfactant, emulsion composition, powder treatment agent, thickening agent of oil-based raw material, gelling agent, gel composition, and cosmetic raw material comprising novel organopolysiloxane, as well as, preparation for external use and cosmetic comprising the same |
| WO2011136393A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same |
| WO2011136394A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Powder treatment agent comprising sugar alcohol -modified organopolysiloxane |
| WO2012015070A1 (en) | 2010-07-30 | 2012-02-02 | Dow Corning Toray Co., Ltd. | Cosmetic for hair containing co-modified organopolysiloxane |
| WO2013065766A1 (en) | 2011-10-31 | 2013-05-10 | Dow Corning Toray Co., Ltd. | Long chain amide-modified silicone - amino-modified silicone copolymer and uses thereof |
| WO2013100207A1 (en) | 2011-12-27 | 2013-07-04 | Dow Corning Toray Co., Ltd. | Novel liquid organopolysiloxane and uses thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63224392A (en) * | 1987-03-13 | 1988-09-19 | 日本メクトロン株式会社 | Multilayer printed interconnection board and method of processing the same |
| JPH0249169U (en) * | 1988-09-29 | 1990-04-05 | ||
| JP3233060B2 (en) * | 1997-02-26 | 2001-11-26 | 株式会社デンソー | Laser processing method for resin products |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558096A (en) * | 1978-06-30 | 1980-01-21 | Ibm | Ic package |
-
1982
- 1982-06-22 JP JP57107873A patent/JPS58225657A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558096A (en) * | 1978-06-30 | 1980-01-21 | Ibm | Ic package |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011049247A1 (en) | 2009-10-23 | 2011-04-28 | 東レ・ダウコーニング株式会社 | Thickening or gelling agent for oily raw materials |
| WO2011049248A1 (en) | 2009-10-23 | 2011-04-28 | 東レ・ダウコーニング株式会社 | Novel co-modified organopolysiloxane |
| WO2011078407A1 (en) | 2009-12-24 | 2011-06-30 | Dow Corning Toray Co., Ltd. | Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same |
| WO2011078408A1 (en) | 2009-12-24 | 2011-06-30 | Dow Corning Toray Co., Ltd. | Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same |
| WO2011136397A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Novel organopolysiloxane, surfactant, emulsion composition, powder treatment agent, thickening agent of oil-based raw material, gelling agent, gel composition, and cosmetic raw material comprising novel organopolysiloxane, as well as, preparation for external use and cosmetic comprising the same |
| WO2011136393A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same |
| WO2011136394A1 (en) | 2010-04-30 | 2011-11-03 | Dow Corning Toray Co., Ltd. | Powder treatment agent comprising sugar alcohol -modified organopolysiloxane |
| WO2012015070A1 (en) | 2010-07-30 | 2012-02-02 | Dow Corning Toray Co., Ltd. | Cosmetic for hair containing co-modified organopolysiloxane |
| WO2013065766A1 (en) | 2011-10-31 | 2013-05-10 | Dow Corning Toray Co., Ltd. | Long chain amide-modified silicone - amino-modified silicone copolymer and uses thereof |
| WO2013100207A1 (en) | 2011-12-27 | 2013-07-04 | Dow Corning Toray Co., Ltd. | Novel liquid organopolysiloxane and uses thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58225657A (en) | 1983-12-27 |
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